Datasheet STTH806 Datasheet (ST)

Page 1

STTH806

Turbo 2 ultrafast - high voltage rectifier

Main product characteristics
I
F(AV)
V
RRM
T
j
(typ) 1.1 V
V
F
(max) 35 ns
t
rr
8 A
600 V
175° C
Features and benefits
■ Ultrafast switching
■ Low reverse current
■ Reduces conduction and switching losses
■ Insulated package TO-220AC Ins
– Insulated voltage: 2500 V – Typical package capacitance: 7 pF
RMS
K
NC
D2PAK
STTH806G
A
K
TO-220AC
STTH806D
Order codes
Part Number Marking
KA
A
K
TO-220AC Ins
STTH806DIRG
STTH806G STTH806G
Description
The STTH806 uses ST Turbo2 600 V technology. This device is specially suited for use in switching
STTH806G-TR STTH806G
STTH806D STTH806D
STTH806DIRG STTH806DI
power supplies, and industrial applications.
Table 1. Absolute ratings (limiting values per diode at 25° C, unless otherwise specified)
A
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T
1. condition to avoid thermal runaway for a diode on its own heatsink
Repetitive peak reverse voltage 600 V
TO-220AC, D
2
PA K 3 0 A
RMS forward current
TO-220 Ins 24 A
T
= 140° C TO-220AC, D2PA K 8 A
Average forward current, δ = 0.5
c
= 120° C TO-220 Ins 8 A
T
c
Surge non repetitive forward current tp = 10 ms Sinusoidal 90 A
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature
T
j
dP
--------------­dT
tot
j
1
--------------------------< R
th j a–()
(1)
175 °C
August 2006 Rev 2 1/9
www.st.com
Page 2
Characteristics STTH806

1 Characteristics

Table 2. Thermal parameters

Symbol Parameter Value Unit
2
R
th(j-c)

Table 3. Static electrical characteristics

Junction to case
TO-220AC, D
TO-220AC Ins 4
PA K 2 .5
° C/W
Symbol Parameter Test conditions Min. Typ Max. Unit
(1)
I
R
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: t
Reverse leakage current
(2)
Forward voltage drop
F
= 380 µs, δ < 2 %
p
= 25° C
T
j
T
= 150° C 20 200
j
= 25° C
T
j
T
= 150° C 1.10 1.40
j
V
R
I
= 8 A
F
= V
RRM
8
1.85
To evaluate the conduction losses use the following equation: P = 1.07 x I

Table 4. Dynamic characteristics

Symbol Parameter
t
rr
I
RM
t
fr
V
FP
Reverse recovery time
Reverse recovery current
Forward recovery time
Forward recovery voltage
F(AV)
+ 0.041 I
F2(RMS)
Test conditions
= 0.5 A, Irr = 0.25 A, IR = 1 A,
I
F
Tj = 25° C
I
= 1 A, dIF/dt = -50 A/µs,
F
= 30 V, Tj = 25° C
V
R
I
= 8 A, dIF/dt = -100 A/µs,
F
VR = 400 V, Tj = 25° C
= 8 A dIF/dt = 100 A/µs
I
F
VFR = 1.1 x V
= 8 A dIF/dt = 100 A/µs
I
F
= 1.1 x V
V
FR
, Tj = 25° C
Fmax
, Tj = 25° C
Fmax
Min. Typ Max. Unit
35
40 55
4.5 6.5
200 ns
3.5 V
µA
V
ns
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Page 3
STTH806 Characteristics
Figure 1. Conduction losses versus
average current
P (W)
F(AV)
15.0
12.5
10.0
7.5
5.0
2.5
0.0
012345678910
δ = 0.05
δ = 0.1
δ = 0.2
I (A)
F(AV)
δ = 0.5
δ
δ = 1
T
=tp/T
Figure 3. Relative variation of thermal
impedance junction to case versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
Single pulse
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
Figure 2. Forward voltage drop versus
forward current
I (A)
FM
100
90
80
70
60
50
40
30
20
tp
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
T=150°C
j
(typical values)
T=150°C
j
(maximum values)
(maximum values)
V (V)
FM
T=25°C
j
Figure 4. Peak reverse recovery current
versus dI
I (A)
RM
14
V =400V
R
T=125°C
j
12
10
8
6
4
2
0
0 50 100 150 200 250 300 350 400 450 500
I =0.25 x I
F F(AV)
/dt (typical values)
F
I=I
I =0.5 x I
F F(AV)
F F(AV)
dI /dt(A/µs)
F
I =2 x I
F F(AV)
Figure 5. Reverse recovery time versus
dI
/dt (typical values)
F
t (ns)
rr
300
250
I =2 x I
200
150
100
50
0
0 50 100 150 200 250 300 350 400 450 500
F F(AV)
I=I
F F(AV)
dI /dt(A/µs)
F
I =0.5 x I
F F(AV)
V =400V
R
T=125°C
j
Figure 6. Reverse recovery charges versus
dIF/dt (typical values)
Q (nC)
rr
450
V =400V
R
T=125°C
j
400
350
300
250
200
150
100
50
0 50 100 150 200 250 300 350 400 450 500
3/9
I =2 x I
F F(AV)
dI /dt(A/µs)
F
I=I
F F(AV)
I =0.5 x I
F F(AV)
Page 4
Characteristics STTH806
Figure 7. Softness factor versus
dI
/dt (typical values)
F
S factor
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0 50 100 150 200 250 300 350 400 450 500
dI /dt(A/µs)
F
I 2 x I
≤
F F(AV)
V = 400V
R
T = 125° C
j
Figure 9. Transient peak forward voltage
versus dI
V (V)
FP
14
I=I
F F(AV)
T=125°C
j
12
10
8
6
4
2
0
0 100 200 300 400 500
/dt (typical values)
F
dI /dt(A/µs)
F
Figure 8. Relative variations of dynamic
parameters versus junction temperature
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00 25 50 75 100 125
S factor
I
RM
T (°C)
Q
RR
j
I=I
F F(AV)
V =400V
R
Reference:T =125°C
j
Figure 10. Forward recovery time versus
dIF/dt (typical values)
t (ns)
fr
200
180
160
140
120
100
80
60
40
20
0
0 100 200 300 400 500
dI /dt(A/µs)
F
I=I
F F(AV)
V =1.1 x V max.
FR F
T=125°C
j
Figure 11. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
100
10
V (V)
1
1 10 100 1000
R
4/9
F=1MHz
V =30mV
OSC RMS
T=25°C
j
Figure 12. Thermal resistance junction to
ambient versus copper surface under tab (printed circuit board FR4, e
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
= 35 µm)
CU
S (cm²)
(Cu)
D²PAK
Page 5
STTH806 Package mechanical data
m
D

2 Package mechanical data

Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.80 Nm
Maximum torque value: 1.0 Nm
Table 5. D
2
PAK Dimensions
Dimensions
Ref.
Millimeters Inches
Min. Max Min. Max.
A
E
L2
C2
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
L
L3
A1
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
B2
B
C
R
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G
G 4.88 5.28 0.192 0.208
A2
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
M
*
V2
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
* FLAT ZONE NO LESS THAN 2m
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°

Figure 13. D2PAK Footprint dimensions (in mm)

16.90
10.30
8.90
5/9
5.08
1.30
3.70
Page 6
Package mechanical data STTH806

Table 6. TO-220AC Dimensions

Dimensions
L2
F1
Ref.
Millimeters Inches
Min. Max. Min. Max.
H2
Ø I
L5
A
C
L7
L6
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
L9
L4
F
G
D
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
M
E
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151
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Page 7
STTH806 Package mechanical data

Table 7. TO-220AC Ins Dimensions

Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
B
Ø I
L
A
I4
C
b2
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
F
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
a1
l2
a2
c2
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 4.80 5.40 0.189 0.212
M
b1
e
c1
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
M2.60 0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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Page 8
Ordering information STTH806

3 Ordering information

Part Number Marking Package Weight Base qty
2
STTH806G STTH806G D
STTH806G-TR STTH806G D
PAK 1.48 g 50 Tube
2
PAK 1.48 g 1000 Tape and reel
Delivery
mode
STTH806D STTH806D TO-220AC 1.90 g 50 Tube
STTH806DIRG STTH806DI TO-220AC Ins 2.30 g 50 Tube

4 Revision history

Date Revision Description of Changes
18-May-2006 1 First issue.
10-Aug-2006 2 Changed part number STTH806DI to STTH806DIRG.
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Page 9
STTH806
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