Datasheet STTH802 Datasheet (ST)

Main product characteristics

STTH802

Ultrafast recovery diode

I

F(AV)

V

RRM

T

j (max)

(typ) 0.8 V

V

F

(typ) 17 ns

t

rr

8 A

200 V

175° C

Features and benefits

■ Very low conduction losses

■ Negligible switching losses

■ Low forward and reverse recovery time

■ High junction temperature

Description

The STTH802 uses ST's new 200 V planar Pt
doping technology, and is specially suited for
switching mode base drive and transistor circuits.

Packaged in TO-220AC, TO-220FPAC, DPAK,

2

and D
voltage, high frequency inverters, free wheeling
and polarity protection.

PAK this device is intended for use in low

K

TO-220AC

STTH802D

K

A

A

K

NC

DPAK

STTH802B

K

A

K

TO-220FPAC

STTH802FP

K

A

A

NC

2

DPAK

STTH802G

Order codes

Part Number Marking

STTH802D STTH802

STTH802FP STTH802

STTH802B STTH802

STTH802B-TR STTH802

STTH802G STTH802

STTH802G-TR STTH802

September 2006 Rev 2 1/11

www.st.com

Characteristics STTH802

1 Characteristics

Table 1. Absolute ratings (limiting values at T

= 25° C, unless otherwise specified)

j

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

Repetitive peak reverse voltage 200 V

RMS forward current 16 A

Average
forward
current, δ = 0.5

TO-220A, DPAK, D

TO-220FPAC

2

PA K

= 145° C

T

c

T

= 125° C

c

8A

Surge non

I

FSM

repetitive

tp = 10 ms Sinusoidal 100 A

forward current

T

stg

T

j

Table 2. Thermal parameters

Storage temperature range -65 to + 175 ° C

Maximum operating junction temperature 175 ° C

Symbol Parameter Value Unit

2

PA K 3 .2

R

th(j-c)

Table 3. Static electrical characteristics

Junction to case

TO-220AC, DPAK, D

TO-220FPAC 5.5

° C/W

Symbol Parameter Test conditions Min. Typ Max. Unit

(1)

I

R

V

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: t

Reverse leakage current

(2)

Forward voltage drop

F

= 380 µs, δ < 2 %

p

= 25° C

j

= 125° C 6 60

T

j

T

= 25° C

j

= 150° C 0.8 0.90

T

j

V

R

= 8 A

I

F

= V

RRM

0.95 1.05

6

T

To evaluate the conduction losses use the following equation:
P = 0.73 x I

F(AV)

+ 0.021 I

F2(RMS)

µA

V

2/11

STTH802 Characteristics

Table 4. Dynamic characteristics

Symbol Parameter

t

rr

I

RM

t

fr

V

FP

Reverse recovery time

Reverse recovery current

Forward recovery time

Forward recovery voltage

Test conditions

I

= 1 A, dIF/dt = -50 A/µs,

F

VR = 30 V, Tj = 25 °C

= 1 A, dIF/dt = -100 A/µs,

I

F

= 30 V, Tj = 25 °C

V

R

= 8 A, dIF/dt = -200 A/µs,

I

F

VR = 160 V, Tj = 125 °C

I

= 8 A, dIF/dt = 50 A/µs

F

VFR = 1.1 x V

, Tj = 25 °C

Fmax

IF = 8 A, dIF/dt = 50 A/µs,

= 25 °C

T

j

Min. Typ Max. Unit

25 30 ns

17 22

5.5 7 A

150 ns

1.5 V

Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus

forward current (typical values)

IM(A)

100

80

60

40

20

0

P = 5 WP = 5 W

P = 2 WP = 2 W

P = 1 WP = 1 W

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

T

T

I

I

M

M

=tp/T

=tp/T

d

δ

tp

tp

δ

IFM(A)

200

180

160

140

120

100

80

60

40

20

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0

Tj=150°C

Tj=25°C

VFM(V)

Figure 3. Forward voltage drop versus

forward current (maximum values)

IFM(A)

200

180

160

140

120

100

80

60

40

20

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0

Tj=150°C

Tj=25°C

VFM(V)

Figure 4. Relative variation of thermal

impedance, junction to case,
versus pulse duration (TO-220AC,
DPAK, D

Z

th(j-c)/Rth(j-c)

1.0

Single pulse

TO-220AC

DPAK

2

DPAK

0.1

1.E-03 1.E-02 1.E-01 1.E+00

3/11

2

PAK)

tp(s)

Characteristics STTH802

Figure 5. Relative variation of thermal

impedance, junction to case,
versus pulse duration
(TO-220FPAC)

Z

th(j-c)/Rth(j-c)

1.0

Single pulse
TO-220FPAC

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

tp(s)

Figure 7. Reverse recovery charges versus

dI

/dt (typical values)

F

QRR(nC)

160

IF=8A

=160V

V

140

R

120

100

80

60

40

20

0

10 100 1000

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

Figure 6. Junction capacitanceversus

reverse applied voltage (typical
values)

C(pF)

100

10

1 10 100 1000

V

F=1MHz

=30mV

osc

Tj=25°C

RMS

VR(V)

Figure 8. Reverse recovery time versus dI

(typical values)

tRR(ns)

80

70

60

50

40

30

20

10

0

10 100 1000

Tj=125°C

Tj=25°C

IF=8A

V

=160V

R

dIF/dt(A/µs)

F

/dt

Figure 9. Peak reverse recovery current

versus dI

IRM(A)

12

IF=8A

V

=160V

R

10

8

6

4

2

0

10 100 1000

/dt (typical values)

F

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

Figure 10. Dynamic parameters versus

junction temperature

QRR;IRM[Tj]/QRR;IRM[Tj=125°C]

1.4

IF=8A

V

=160V

R

1.2

1.0

I

0.8

0.6

0.4

0.2

0.0

25 50 75 100 125 150

RM

Q

RR

Tj(°C)

4/11

STTH802 Ordering information scheme

Figure 11. Thermal resistance, junction to

Figure 12. Thermal resistance, junction to
ambient, versus copper surface
under tab - Epoxy printed circuit
board FR4, e

R

(°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

= 35 µm (D2PAK )

CU

SCU(cm²)

2

DPAK

R

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

2 Ordering information scheme

ambient, versus copper surface
under tab - Epoxy printed circuit
board FR4, e

(°C/W)

= 35 µm (DPAK)

CU

SCU(cm²)

DPAK

Ultrafast switching diode

Average forward current

8 = 8 A

Repetitive peak reverse voltage

02 = 200 V

Package

D = TO-220AC in Tube
FP = TO-220FPAC in Tube
B = DPAK in Tube
B-TR = DPAK in Tape and reel

2

G = D PAK in Tube
G-TR = D PAK in Tape and reel

2

STTH 8 02 XXX

5/11

Package information STTH802

3 Package information

Epoxy meets UL94, V0

Cooling method: by conduction (C)

Recommended torque value: 0.8 Nm

Maximum torque value: 1.0 Nm

Table 5. T0-220AC dimensions

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

H2

Ø I

L5

L6

L2

F1

F

L9

L4

G

A

C

L7

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

D

G 4.95 5.15 0.194 0.202

H2 10.00 10.40 0.393 0.409

L2 16.40 typ. 0.645 typ.

M

E

L4 13.00 14.00 0.511 0.551

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. I 3.75 3.85 0.147 0.151

6/11

STTH802 Package information

Table 6. T0-220FPAC dimensions

DIMENSIONS

REF

Millimeters Inches

Min. Max. Min. Max.

A 4.4 4.6 0.173 0.181

A

H

B

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

Dia

L6

L2

L3

L5

F1

L4

F

G1

G

D

L7

E

E 0.45 0.70 0.018 0.027

F 0.75 1 0.030 0.039

F1 1.15 1.70 0.045 0.067

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

L2 16 Typ. 0.63 Typ.

L3 28.6 30.6 1.126 1.205

L4 9.8 10.6 0.386 0.417

L5 2.9 3.6 0.114 0.142

L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

7/11

Package information STTH802

Table 7. DPAK dimensions

DIMENSIONS

REF

E

B2

L2

H

L4

B

G

R

A1

C2

A

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B2 5.20 5.40 0.204 0.212

D

C2 0.48 0.60 0.018 0.023

R

C

G 4.40 4.60 0.173 0.181

0.60 MIN.

A2

L2 0.80 typ. 0.031 typ.

V2

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

Millimeters Inches

.

Min. Max Min. Max.

A 2.20 2.40 0.086 0.094

B 0.64 0.90 0.025 0.035

C 0.45 0.60 0.017 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

H 9.35 10.10 0.368 0.397

Figure 13. DPAK footprint (dimensions in mm)

6.7 3 3

6.7

1.6

2.3

2.3

1.6

8/11

STTH802 Package information

m

D

Table 8. D

L2

L

L3

2

PAK dimensions

E

A1

B2

B

G

* FLAT ZONE NO LESS THAN 2m

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A

C2

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

C

R

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

A2

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

M

*

V2

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 14. D2PAK footprint (dimensions in mm)

16.90

10.30

8.90

3.70

5.08

1.30

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

9/11

Ordering information STTH802

4 Ordering information

Part Number Marking Package Weight Base qty Delivery mode

STTH802D STTH802 TO-220AC 1.86 g 50 Tube

STTH802FP STTH802 TO-220FPAC 2.2 g 50 Tube

STTH802B STTH802 DPAK 0.3 g 75 Tube

STTH802B-TR STTH802 DPAK 0.3 g 2500 Tape and reel

2

STTH802G STTH802 D

STTH802G-TR STTH802 D

PAK 1.48 g 50 Tube

2

PAK 1.48 g 1000 Tape and reel

5 Revision history

Date Revision Description of Changes

03-May-2006 1 First issue

22-Sep-2006 2 Added D2PAK package

10/11

STTH802

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11/11