Datasheet STTH60L06 Datasheet (ST)

Page 1
Features and benefits
■ Ultrafast switching
■ Low reverse current
■ Low thermal resistance
Description
The STTH60L06, which is using ST Turbo 2 600 V technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode PFC boost diode. Thanks to its low V characteristics, this device exhibits high performances in free-wheeling applications.
F
STTH60L06
Turbo 2 ultrafast high voltage rectifier
A
K
DO-247
STTH60L06W

Table 1. Device summary

Symbol Value
I
F(AV)
V
RRM
(max) 175 °C
T
j
(typ) 0.95 V
V
F
t
(max) 70 ns
rr
60 A
600 V
September 2011 Doc ID 10764 Rev 3 1/8
www.st.com
8
Page 2
Characteristics STTH60L06

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
T

Table 3. Thermal parameter

Repetitive peak reverse voltage 600 V
RRM
Forward rms current 90 A
Average forward current δ = 0.5 Tc = 110 °C 60 A
Surge non repetitive forward current tp = 10 ms sinusoidal 600 A
FSM
Storage temperature range -65 to + 175 °C
stg
T
Maximum operating junction temperature 175 °C
j
Symbol Parameter Value (max) Unit
R

Table 4. Static electrical characteristics

Junction to case 0.75 °C/W
th(j-c)
Symbol Parameter Test conditions Min. Typ. Max. Unit
R
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
current
(2)
Forward voltage drop
F
Reverse leakage
(1)
I
= 25 °C
T
j
= 150 °C 160 1600
T
j
T
= 25 °C
j
Tj = 150 °C 0.95 1.2
= V
V
R
= 60 A
I
F
RRM
50
1.55
µA
V
To evaluate the maximum conduction losses use the following equation: P = 0.93 x I
2/8 Doc ID 10764 Rev 3
F(AV)
+ 0.0045 I
F2(RMS)
Page 3
STTH60L06 Characteristics

Table 5. Dynamic electrical characteristics

Symbol Parameter
Reverse
t
rr
recovery time
I
V
Reverse
RM
recovery current
Forward recovery
t
fr
time
Forward recovery
FP
voltage
T
T
T
T
Test conditions
= 25 °C
j
= 125 °C
j
= 25 °C
j
= 25 °C
j
= 0.5 A,
I
F
= 0.25 A
I
rr
IR =1 A
= 1 A,
I
F
/dt = 50 A/µs
dI
F
VR = 30 V
I
= 60 A,
F
= 400 V
V
R
dIF/dt = 100 A/µs
I
= 60 A,
F
/dt = 200 A/µs
dI
F
VFR = 1.1 x V
I
= 60 A,
F
/dt = 200 A/µs
dI
F
VFR = 1.1 x V
Fmax
Fmax
Min. Typ. Max. Unit
70
ns
75 105
14 19 A
500 ns
3V
Doc ID 10764 Rev 3 3/8
Page 4
Characteristics STTH60L06
Figure 1. Conduction losses versus average
forward current
P(W)
140
120
100
80
60
40
20
0
δ = 0.05
0 102030405060 708090100
δ = 0.1
δ = 0.2
I (A)
F(AV)
δ = 0.5
δ
δ = 1
=tp/T
T
tp
Figure 3. Relative variation of thermal
impedance junction to case versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
Figure 5. Reverse recovery time versus dIF/dt
(typical values)
t (ns)
rr
1000
900
800
700
600
500
400
300
200
100
0
0 50 100 150 200 250 300 350 400 450 500
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
V =400V
R
T =125°C
j
Figure 2. Forward voltage drop versus
forward current
I (A)
FM
200
180
T=150°C
160
140
120
100
80
60
40
20
0
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
(maximum values)
T=150°C
j
(typical values)
j
T=25°C
j
(maximum values)
V (V)
FM
Figure 4. Peak reverse recovery current
versus dI
I (A)
RM
55
V =400V
R
T=125°C
j
50
45
40
35
30
25
20
15
10
5
0
0 50 100 150 200 250 300 350 400 450 500
I =0.5 x I
F F(AV)
/dt (typical values)
F
I =2 x I
F F(AV)
I=I
F F(AV)
dI /dt(A/µs)
F
Figure 6. Reverse recovery charges versus
dI
/dt (typical values)
F
Q (µC)
rr
4.5
V =400V
R
T =125°C
j
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 100 200 300 400 500
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
4/8 Doc ID 10764 Rev 3
Page 5
STTH60L06 Characteristics
Figure 7. Reverse recovery softness factor
versus dI
/dt (typical values)
F
Figure 8. Relative variations of dynamic
parameters versus junction temperature
S factor
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0 50 100 150 200 250 300 350 400 450 500
dI /dt(A/µs)
F
I < 2 x I
F F(AV)
V =400V
R
T=125°C
j
Figure 9. Transient peak forward voltage
versus dI
V (V)
FP
8
I=I
F F(AV)
T=125°C
j
7
6
5
4
3
2
1
0
0 50 100 150 200 250 300 350 400 450 500
/dt (typical values)
F
dI /dt(A/µs)
F
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25 50 75 100 125
Q
RR
t
rr
S factor
I
RM
T (°C)
j
Figure 10. Forward recovery time versus dI
(typical values)
t (ns)
fr
400
350
300
250
200
150
100
50
0
0 100 200 300 400 500
dI /dt(A/µs)
F

Figure 11. Junction capacitance versus reverse voltage applied (typical values)

C(pF)
1000
F=1MHz
V =30mV
OSC RMS
T=25°C
j
I=I
F F(AV)
V =400V
R
Reference:T =125°C
I=I
F F(AV)
V =1.1 x V max.
FR F
T=125°C
j
j
/dt
F
100
V (V)
10
1 10 100 1000
R
Doc ID 10764 Rev 3 5/8
Page 6
Package information STTH60L06

2 Package information

● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
● Recommended torque value: 0.55 to 1.0 N·m
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 6. DO247 dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.85 5.15 0.191 0.203
V
D 2.20 2.60 0.086 0.102
E 0.40 0.80 0.015 0.031
V
Dia
F 1.00 1.40 0.039 0.055
F2 2.00 0.078
H
A
F3 2.00 2.40 0.078 0.094
G 10.90 0.429
L5
H 15.45 15.75 0.608 0.620
L
L2
L4
F2
L1
L3
V2
F3
D
L 19.85 20.15 0.781 0.793
L1 3.70 4.30 0.145 0.169
L2 18.50 0.728
L3 14.20 14.80 0.559 0.582
F
G
ME
6/8 Doc ID 10764 Rev 3
L4 34.60 1.362
L5 5.50 0.216
M 2.00 3.00 0.078 0.118
V5° 5°
V2 60° 60°
Dia. 3.55 3.65 0.139 0.143
Page 7
STTH60L06 Ordering information

3 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STTH60L06W STTH60L06W DO-247 4.40 g 30 Tube

4 Revision history

Table 8. Document revision history

Date Revision Changes
07-Sep-2004 1 First issue
10-Sep-2004 2
Junction to case value (Thermal parameter on page 2) changed from
0.70 °C/W to 0.75 °C/W
07-Sep-2011 3 Updated I
from 400 A to 600 A.
FSM
Doc ID 10764 Rev 3 7/8
Page 8
STTH60L06
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
8/8 Doc ID 10764 Rev 3
Loading...