Datasheet STTH512 Datasheet (ST) [en, no]

STTH512

Ultrafast recovery - 1200 V diode

Main product characteristics

I

F(AV)

V

RRM

T

j

V

(typ) 1.25 V

F

(typ) 48 ns

t

rr

5 A

1200 V

175° C

Features and benefits

■ Ultrafast, soft recovery

■ Very low conduction and switching losses

■ High frequency and/or high pulsed current

operation

■ High reverse voltage capability

■ High junction temperature

■ Insulated package: TO-220FPAC

Electrical insulation = 2000 V

RMS

Capacitance = 12 pF

Description

The high quality design of this diode has
produced a device with low leakage current,
regularly reproducible characteristics and intrinsic
ruggedness. These characteristics make it ideal
for heavy duty applications that demand long term
reliability.

KA

A

K

TO-220AC

STTH512D

K

NC

DPAK

STTH512B

Order codes

Part Number Marking

STTH512D STTH512D

STTH512B STTH512B

STTH512B-TR STTH512B

STTH512FP STTH512FP

A

K

TO-220FPAC

STTH512FP

A

Such demanding applications include industrial
power supplies, motor control, and similar
mission-critical systems that require rectification
and freewheeling. These diodes also fit into
auxiliary functions such as snubber, bootstrap,
and demagnetization applications.

The improved performance in low leakage
current, and therefore thermal runaway guard
band, is an immediate competitive advantage for
this device.

March 2006 Rev 1 1/10

www.st.com

10

Characteristics STTH512

1 Characteristics

Table 1. Absolute ratings (limiting values at 25° C, unless otherwise specified)

Symbol Parameter Value Unit

V

RRM

Repetitive peak reverse voltage 1200 V

TO-220AC / TO-220FPAC 30

I

F(RMS)

I

F(AV)

I

FRM

I

FSM

T

Table 2. Thermal parameters

RMS forward current

DPAK 10

Average forward current, δ = 0.5

TO-220AC / DPAK T

TO-220FPAC T

= 145° C

c

= 105° C

c

Repetitive peak forward current tp = 5 µs, F = 5 kHz square 60 A

Surge non repetitive forward current tp = 10 ms Sinusoidal 55 A

Storage temperature range -65 to + 175 °C

stg

T

Maximum operating junction temperature 175 °C

j

5A

Symbol Parameter Value Unit

TO-220AC / DPAK 2.5

R

th(j-c)

Table 3. Static electrical characteristics

Junction to case

TO-220FPAC 5.8

A

°C/W

Symbol Parameter Test conditions Min. Typ Max. Unit

(1)

I

R

V

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: t

Reverse leakage current

(2)

Forward voltage drop

F

= 380 µs, δ < 2 %

p

= 25° C

j

Tj = 125° C 3 30

= 25° C

T

j

= 150° C 1.25 1.9

T

j

V

R

I

= 5 A

F

= V

RRM

5

2.2

T

To evaluate the conduction losses use the following equation:
P = 1.5 x I

Table 4. Dynamic characteristics

Symbol Parameter

t

rr

I

RM

Reverse recovery time

Reverse recovery current

F(AV)

+ 0.08 I

F2(RMS)

Test conditions

IF = 1 A, dIF/dt = -50 A/µs,

= 30 V, Tj = 25° C

V

R

= 1 A, dIF/dt = -100 A/µs,

I

F

= 30 V, Tj = 25° C

V

R

IF = 5 A, dIF/dt = -200 A/µs,
V

= 600 V, Tj = 125° C

R

Min. Typ Max. Unit

95

48 70

11 16 A

µA

VTj = 125° C 1.30 2.0

ns

2/10

STTH512 Characteristics

Table 4. Dynamic characteristics

= 5 A, dIF/dt = -200 A/µs,

I

S Softness factor

Forward recovery time

t

fr

V

Forward recovery voltage

FP

F

= 600 V, Tj = 125° C

V

R

= 5 A dIF/dt = 50 A/µs

I

F

= 1.5 x V

V

FR

I

= 5 A, dIF/dt = 50 A/µs,

F

, Tj = 25° C

Fmax

Tj = 25° C

2

400 ns

9.5 V

Figure 1. Conduction losses versus

average current

P(W)

13

12

11

10

9

8

7

6

5

4

3

2

1

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

δ = 0.05

δ = 0.1

I (A)

F(AV)

δ = 0.2

δ = 0.5

δ

δ = 1

T

=tp/T

Figure 3. Relative variation of thermal

impedance junction to case
versus pulse duration

Z/R

th(j-c) th(j-c)

1.0

Single pulse
TO-220AC

0.9

DPAK

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00

t (s)

p

Figure 5. Peak reverse recovery current

versus dI

/dt (typical values)

F

Figure 2. Forward voltage drop versus

forward current

I (A)

FM

50

45

40

35

30

25

20

15

10

tp

5

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

T=150°C

j

(maximum values)

T=150°C

j

(typical values)

V (V)

FM

Figure 4. Relative variation of thermal

impedance junction to case versus
pulse duration

Z/R

th(j-c) th(j-c)

1.0

Single pulse
TO-220FPAC

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

t (s)

p

Figure 6. Reverse recovery time versus dI

(typical values)

T=25°C

j

(maximum values)

F

/dt

3/10

Characteristics STTH512

t (ns)

I (A)

RM

28

V =600V

R

26

T=125°C

j

24

22

20

18

16

14

12

10

8

6

4

2

0

0 100 200 300 400 500

I =0.5 x I

FF(AV)

I=I

FF(AV)

I =2 x I

FF(AV)

dI /dt(A/µs)

F

Figure 7. Reverse recovery charges

versus dI

Q (nC)

rr

2000

V =600V

R

T=125°C

j

1800

1600

1400

1200

1000

800

600

400

200

0

0 100 200 300 400 500

/dt (typical values)

F

I =2 x I

FF(AV)

I=I

FF(AV)

I =0.5 x I

FF(AV)

dI /dt(A/µs)

F

Figure 9. Relative variations of dynamic

parameters versus junction

rr

600

550

500

450

400

350

300

250

200

150

100

50

0

0 100 200 300 400 500

I =2 x I

FF(AV)

I=I

FF(AV)

dI /dt(A/µs)

F

I =0.5 x I

FF(AV)

Figure 8. Softness factor versus dI

F

/dt

V =600V

R

T=125°C

j

(typical values)

S factor

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0 100 200 300 400 500

dI /dt(A/µs)

F

I 2xI

≤

F F(AV)

V =600V

R

T=125°C

j

Figure 10. Transient peak forward voltage

versus dI

/dt (typical values)

F

temperature

V (V)

2.25

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

0.00

25 50 75 100 125

S factor

t

I

Q

rr

RM

RR

T (°C)

j

I=I

FF(AV)

V =600V

R

Reference:T =125°C

j

FP

50

I=I

FF(AV)

T=125°C

j

45

40

35

30

25

20

15

10

5

0

0 50 100 150 200 250 300

dI /dt(A/µs)

F

4/10

STTH512 Characteristics

Figure 11. Forward recovery time versus

dI

/dt (typical values)

F

t (ns)

fr

700

600

500

400

300

dI /dt(A/µs)

200

0 50 100 150 200 250 300 350 400 450 500

F

I=I

FF(AV)

V =1.5 x V max.

FR F

T=125°C

j

Figure 13. Thermal resistance junction to

ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, e

R (°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

cu

S (cm²)

CU

= 35 µm)

Figure 12. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

100

10

V (V)

1

1 10 100 1000

R

F=1MHz

V =30mV

OSC RMS

T=25°C

j

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Package mechanical data STTH512

2 Package mechanical data

Epoxy meets UL94, V0

Cooling method: by conduction (C)

Recommended torque value: 0.55 Nm (TO-220AC)

Maximum torque value: 0.7 Nm (TO-220AC)

Table 5. T0-220AC dimensions

DIMENSIONS

L2

F1

REF.

Millimeters Inches

Min. Max. Min. Max.

H2

Ø I

L5

A

C

L7

L6

A 4.40 4.60 0.173 0.181

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

L9

L4

F

G

D

H2 10.00 10.40 0.393 0.409

L2 16.40 typ. 0.645 typ.

L4 13.00 14.00 0.511 0.551

M

E

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. I 3.75 3.85 0.147 0.151

6/10

STTH512 Package mechanical data

Table 6. T0-220FPAC dimensions

DIMENSIONS

L3

L2

L4

G1

REF

Millimeters Inches

Min. Max. Min. Max.

A

H

B

A 4.4 4.6 0.173 0.181

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

Dia

L6

L7

E 0.45 0.70 0.018 0.027

F 0.75 1 0.030 0.039

F1 1.15 1.70 0.045 0.067

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

F1

L5

D

L2 16 Typ. 0.63 Typ.

L3 28.6 30.6 1.126 1.205

F

E

L4 9.8 10.6 0.386 0.417

L5 2.9 3.6 0.114 0.142

G

L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

7/10

Package mechanical data STTH512

Table 7. DPAK dimensions

DIMENSIONS

E

B2

L2

H

L4

B

G

0.60 MIN.

A1

A2

V2

A

C2

D

R

R

C

Figure 14. DPAK footprint (dimensions in mm)

REF.

Millimeters Inches

Min. Max Min. Max.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

6.7 3 3

6.7

1.6

2.3

2.3

1.6

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

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STTH512 Ordering information

3 Ordering information

Part Number Marking Package Weight Base qty Delivery mode

STTH512D STTH512D TO-220AC 1.86g 50 Tube

STTH512FP STTH512FP TO-220FPAC 2.2 50 Tube

STTH512B STTH512B DPAK 0.30 75 Tube

STTH512B-TR STTH512B DPAK 0.30 2500 Tape & reel

4 Revision history

Date Revision Description of Changes

02-Mar-2006 1 First issue.

9/10

STTH512

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