Datasheet STTH506 Datasheet (ST)

STTH506

Turbo 2 ultrafast - high voltage rectifier

Main product characteristics

I

F(AV)

V

RRM

T

j

(typ) 1.1 V

V

F

(max) 30 ns

t

rr

5 A

600 V

175° C

Features and benefits

■ Ultrafast switching

■ Low reverse current

■ Low thermal resistance

■ Reduces conduction and switching losses

■ Insulated package TO-220FPAC

– Insulated voltage: 2500 V

RMS

– Typical package capacitance: 12 pF

Description

K

NC

STTH506B

A

K

TO-220AC

STTH506D

Order codes

Part Number Marking

STTH506B STTH506B

STTH506B-TR STTH506B

KA

A

DPAK

K

TO-220FPAC

STTH506FP

STTH506D STTH506D

The STTH506 uses ST Turbo2 600V technology.

STTH506FP STTH506FP

This device is specially suited for use in switching power supplies, and industrial applications.

Table 1. Absolute ratings (limiting values per diode at 25° C, unless otherwise specified)

A

Symbol Parameter Value Unit

V

RRM

Repetitive peak reverse voltage 600 V

TO-220AC, TO220FPAC 20 A

I

F(RMS)

I

F(AV)

I

FSM

T

1. thermal runaway condition for a diode on its own heatsink

RMS forward current

DPAK 10 A

T

= 145° C TO-220AC, DPAK 5 A

Average forward current, δ = 0.5

Surge non repetitive forward current

Storage temperature range -65 to + 175 °C

stg

T

Maximum operating junction temperature

j

dP

tot

j

1

--------------------------< R

th j a–()

--------------dT

c

T

= 120° C TO-220FPAC 5 A

c

tp = 10 ms Sinusoidal

(1)

TO-220AC, TO220FPAC 70 A

DPAK 55 A

175 °C

May 2006 Rev 1 1/9

www.st.com

Characteristics STTH506

1 Characteristics

Table 2. Thermal parameters

Symbol Parameter Value Unit

R

th(j-c)

Table 3. Static electrical characteristics

Junction to case

TO-220AC, DPAK 3.5

TO-220FPAC 6

° C/W

Symbol Parameter Test conditions Min. Typ Max. Unit

T

= 25° C

(1)

I

R

V

Reverse leakage current

(2)

Forward voltage drop

F

j

= 150° C 13 130

T

j

T

= 25° C

j

Tj = 150° C 1.10 1.40

V

R

= 5 A

I

F

= V

RRM

5

1.85

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: t

= 380 µs, δ < 2 %

p

To evaluate the conduction losses use the following equation: P = 1.07 x I

Table 4. Dynamic characteristics

Symbol Parameter

t

rr

I

RM

t

fr

V

FP

Reverse recovery time

Reverse recovery current

Forward recovery time

Forward recovery voltage

Figure 1. Conduction losses versus

average current

F(AV)

+ 0.066 I

F2(RMS)

Test conditions

= 0.5 A, Irr = 0.25 A, IR = 1 A,

I

F

= 25° C

T

j

= 1 A, dIF/dt = -50 A/µs,

I

F

= 30 V, Tj = 25° C

V

R

IF = 5 A, dIF/dt = -100 A/µs, V

= 400 V, Tj = 25° C

R

= 5 A dIF/dt = 100 A/µs

I

F

= 1.1 x V

V

FR

I

= 5 A dIF/dt = 100 A/µs

F

= 1.1 x V

V

FR

, Tj = 25° C

Fmax

, Tj = 25° C

Fmax

Figure 2. Forward voltage drop versus

Min. Typ Max. Unit

30

35 50

3.5 5

180 ns

4V

forward current

µA

V

ns

P (W)

F(AV)

9

8

7

6

5

4

3

2

1

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

δ = 0.05

δ = 0.1

I (A)

F(AV)

δ = 0.2

δ = 0.5

δ

=tp/T

δ = 1

T

tp

2/9

I (A)

FM

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

T=150°C

(typical values)

j

T=150°C

j

(maximum values)

V (V)

FM

T=25°C

j

(maximum values)

STTH506 Characteristics

Figure 3. Relative variation of thermal

impedance junction to case versus pulse duration (TO-220AC, DPAK)

Z/R

th(j-c) th(j-c)

1.0

Single pulse

0.9

TO-220AC

DPAK

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00

t (s)

p

Figure 5. Peak reverse recovery current

versus dI

I (A)

RM

14

V =400V

R

T=125°C

j

12

10

8

6

I =0.25 x I

FF(AV)

4

2

0

0 50 100 150 200 250 300 350 400 450 500

/dt (typical values)

F

I=I

FF(AV)

I =0.5 x I

FF(AV)

dI /dt(A/µs)

F

I =2 x I

FF(AV)

Figure 4. Relative variation of thermal

impedance junction to case versus pulse duration (TO-220FPAC)

Z/R

th(j-c) th(j-c)

1.0

Single pulse

0.9

TO-220FPAC

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

t (s)

p

Figure 6. Reverse recovery time versus

dIF/dt (typical values)

t (ns)

rr

250

200

I =2 x I

150

100

50

0

0 50 100 150 200 250 300 350 400 450 500

FF(AV)

I=I

F F(AV)

dI /dt(A/µs)

F

I =0.5 x I

FF(AV)

V =400V

R

T=125°C

j

Figure 7. Reverse recovery charges versus

dI

/dt (typical values)

F

Q (nC)

rr

350

V =400V

R

T=125°C

j

300

250

200

150

100

50

0 50 100 150 200 250 300 350 400 450 500

I =2 x I

FF(AV)

dI /dt(A/µs)

F

I=I

FF(AV)

I =0.5 x I

FF(AV)

Figure 8. Softness factor versus

dIF/dt (typical values)

S factor

2.50

2.25

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0 50 100 150 200 250 300 350 400 450 500

dI /dt(A/µs)

F

3/9

I = 2 x I

FF(AV)

V = 400 V

R

T = 125° C

j

Characteristics STTH506

Figure 9. Relative variations of dynamic

parameters versus junction temperature

1.50

1.25

1.00

0.75

0.50

0.25

0.00

25 50 75 100 125

I and

RM

S factor

T (°C)

j

Q

RR

I=I

FF(AV)

V =400V

R

Reference:T =125°C

j

Figure 11. Forward recovery time versus

dI

/dt (typical values)

F

t (ns)

fr

220

200

180

160

140

120

100

80

60

40

20

0

0 100 200 300 400 500

dI /dt(A/µs)

F

I=I

FF(AV)

V =1.1 x V max.

FR F

T=125°C

j

Figure 10. Transient peak forward voltage

versus dI

V (V)

FP

26

I=I

FF(AV)

24

T=125°C

j

22

20

18

16

14

12

10

8

6

4

2

0

0 100 200 300 400 500

/dt (typical values)

F

dI /dt(A/µs)

F

Figure 12. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

100

10

V (V)

1

1 10 100 1000

R

F=1MHz

V =30mV

OSC RMS

T=25°C

j

Figure 13. Thermal resistance junction to

ambient versus copper surface under tab (printed circuit board FR4, e

R (°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

4/9

= 35 µm)

CU

S (cm²)

(Cu)

DPAK

STTH506 Package mechanical data

2 Package mechanical data

Epoxy meets UL94, V0

Cooling method: by conduction (C)

Recommended torque value: 0.80 Nm

Maximum torque value: 1.0 Nm

Table 5. DPAK Dimensions

Dimensions

E

B2

L2

H

L4

B

G

A2

0.60 MIN.

R

A1

V2

A

C2

D

R

C

Figure 14. DPAK Footprint dimensions (in mm)

Ref.

Millimeters Inches

Min. Max Min. Max.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

6.7

6.7 3 3

1.6

2.3

1.6

5/9

Package mechanical data STTH506

Table 6. TO-220AC Dimensions

Dimensions

L2

F1

Ref.

Millimeters Inches

Min. Max. Min. Max.

H2

Ø I

L5

A

C

L7

L6

A 4.40 4.60 0.173 0.181

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

L9

L4

F

G

D

H2 10.00 10.40 0.393 0.409

L2 16.40 typ. 0.645 typ.

L4 13.00 14.00 0.511 0.551

M

E

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. I 3.75 3.85 0.147 0.151

6/9

STTH506 Package mechanical data

Table 7. TO-220FPAC Dimensions

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.4 4.6 0.173 0.181

A

H

B

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

E 0.45 0.70 0.018 0.027

Dia

L6

L2

L3

L5

D

F1

L4

L7

F 0.75 1 0.030 0.039

F1 1.15 1.70 0.045 0.067

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

L2 16 Typ. 0.63 Typ.

F

G1

G

E

L3 28.6 30.6 1.126 1.205

L4 9.8 10.6 0.386 0.417

L5 2.9 3.6 0.114 0.142

L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

7/9

Ordering information STTH506

3 Ordering information

Part Number Marking Package Weight Base qty

STTH506B STTH506B DPAK 0.3 g 75 Tube

STTH506B-TR STTH506B DPAK 0.3 g 2500 Tape and reel

STTH506D STTH506D TO-220AC 1.86 50 Tube

STTH506FP STTH506FP TO-220FPAC 1.8 g 50 Tube

Delivery

mode

4 Revision history

Date Revision Description of Changes

18-May-2006 1 First issue.

8/9

STTH506

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no

liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this

document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products

or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such

third party products or services or any intellectual property contained therein.

time, without notice.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED

WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS

OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS,

NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void

any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.

liability of ST.

STMicroelectronics group of companies

9/9