Datasheet STTH30L06 Datasheet (ST)

Turbo 2 ultrafast high voltage rectifier

Features

■ Ultrafast switching

■ Low reverse current

■ Low thermal resistance

■ Reduces switching and conduction losses

Description

The STTH30L06, which is using ST Turbo 2 600 V technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode PFC boost diode.

STTH30L06

K

A

D2PAK

STTH30L06G

Table 1. Device summary

Symbol Value

I

F(AV)

V

RRM

T

j

(typ) 1.10 V

V

F

t

(max) 65 ns

rr

STTH30L06W

A

K

DO-247

30 A

600 V

175 °C

September 2011 Doc ID 10762 Rev 5 1/8

www.st.com

8

Characteristics STTH30L06

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

I

F(RMS)

I

F(AV)

I

T

Table 3. Thermal resistance

Repetitive peak reverse voltage 600 V

RRM

Forward rms voltage 50 A

Average forward current Tc = 125 °C, δ = 0.5 30 A

Surge non repetitive forward current tp = 10 ms sinusoidal 300 A

FSM

Storage temperature range -65 to + 175 °C

stg

T

Maximum operating junction temperature 175 °C

j

Symbol Parameter Value (max) Unit

R

Table 4. Static electrical characteristics

Junction to case 1.1 °C/W

th(j-c)

Symbol Parameter Test conditions Min. Typ. Max. Unit

T

(1)

IR

V

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: t

Reverse leakage current

(2)

Forward voltage drop

F

= 380 µs, δ < 2%

p

= 25 °C

j

= 150 °C 80 800

T

j

= V

V

R

RRM

Tj = 25 °C

IF = 30 A

= 150 °C 1.0 1.25

T

j

25

1.55

µA

V

To evaluate the conduction losses use the following equation: P = 0.95 x I

Table 5. Dynamic Characteristics

F(AV)

+ 0.010 I

F2(RMS)

Symbol Parameter Test conditions Min. Typ. Max. Unit

I

= 0.5 A, Irr = 0.25 A,

F

Reverse recovery

t

rr

time

Reverse recovery

I

RM

current

Forward recovery

t

fr

time

V

Forward recovery

FP

voltage

= 25 °C

T

j

= 125 °C

T

j

= 25 °C

T

j

T

= 25 °C

j

IR =1 A

I

= 1 A, dIF/dt = 50 A/µs,

F

VR =30 V

I

= 30 A, VR = 400 V,

F

/dt = 100 A/µs

dI

F

= 30 A, dIF/dt = 100 A/µs,

I

F

= 1.1 x V

V

FR

= 30 A, dIF/dt = 100 A/µs,

I

F

V

= 1.1 x V

FR

Fmax

65 90

11.5 16 A

2.5 V

65

500 ns

2/8 Doc ID 10762 Rev 5

ns

STTH30L06 Characteristics

Figure 1. Conduction losses versus average

forward current

P(W)

50

45

40

35

30

25

20

15

10

5

0

δ = 0.05

0 5 10 15 20 25 30 35 40

δ = 0.2

δ = 0.1

I (A)

F(AV)

δ = 0.5

δ = 1

δ

=tp/T

T

tp

Figure 3. Relative variation of thermal

impedance junction to case versus pulse duration

Z/R

th(j-c) th(j-c)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00

t (s)

p

Figure 5. Reverse recovery time versus dIF/dt

(typical values)

t (ns)

rr

800 750 700 650 600 550 500 450 400 350 300 250 200 150 100

50

0

0 50 100 150 200 250 300 350 400 450 500

I =2 x I

F F(AV)

I=I

F F(AV)

dI /dt(A/µs)

F

I =0.5 x I

F F(AV)

V =400V

R

T=125°C

j

Figure 2. Forward voltage drop versus

forward current

I (A)

FM

100

90

80

70

60

50

40

30

20

10

0

0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50

T=150°C

j

(typical values)

T=150°C

j

(maximum values)

V (V)

FM

T=25°C

j

(maximum values)

Figure 4. Peak reverse recovery current

versus dI

I (A)

RM

45

V =400V

R

T=125°C

j

40

35

30

25

20

15

10

5

0

0 50 100 150 200 250 300 350 400 450 500

I =0.5 x I

F F(AV)

/dt (typical values)

F

I =2 x I

F F(AV)

I=I

F F(AV)

dI /dt(A/µs)

F

Figure 6. Reverse recovery charges versus

dI

/dt (typical values)

F

Q (nC)

rr

3500

V =400V

R

T=125°C

j

3000

2500

2000

1500

1000

500

0

0 100 200 300 400 500

I =2 x I

F F(AV)

I=I

F F(AV)

I =0.5 x I

F F(AV)

dI /dt(A/µs)

F

Doc ID 10762 Rev 5 3/8

Characteristics STTH30L06

Figure 7. Reverse recovery softness factor

versus dI

S factor

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 50 100 150 200 250 300 350 400 450 500

/dt (typical values)

F

dI /dt(A/µs)

F

I < 2 x I

F F(AV)

V =400V

R

T=125°C

j

Figure 9. Transient peak forward voltage

versus dI

V (V)

FP

10

I=I

F F(AV)

9

T=125°C

j

8

7

6

5

4

3

2

1

0

0 50 100 150 200 250 300 350 400 450 500

/dt (typical values)

F

dI /dt(A/µs)

F

Figure 11. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

1000

100

V (V)

10

1 10 100 1000

R

F=1MHz

V =30mV

OSC RMS

T=25°C

j

Figure 8. Relative variations of dynamic

parameters versus junction temperature

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

25 50 75 100 125

Q

RR

t

rr

S factor

I=I

F F(AV)

V =400V

R

Reference:T =125°C

I

RM

T (°C)

j

Figure 10. Forward recovery time versus dI

(typical values)

t (ns)

fr

500

450

400

350

300

250

200

150

100

50

0

2

D PAK

dI /dt(A/µs)

F

0 100 200 300 400 500

I=I

F F(AV)

V =1.1 x V max.

FR F

T =125°C

j

Figure 12. Thermal resistance junction to

ambient versus copper surface under tab

R (°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

2

D PAK

Printed circuit board FR4, copper thickness: 35 µm

S (cm²)

CU

F

/dt

4/8 Doc ID 10762 Rev 5

STTH30L06 Package information

m

D

2 Package information

● Epoxy meets UL94, V0

● Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 6. D

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

2

PAK dimensions

.

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A

L2

E

C2

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

L

L3

G

A1

B2

B

C

R

A2

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

M

*

V2

* FLAT ZONE NO LESS THAN 2m

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 13. D2PAK footprint (dimensions in mm)

16.90

10.30

8.90

Doc ID 10762 Rev 5 5/8

3.70

5.08

1.30

Package information STTH30L06

Table 7. DO247 dimensions

Dimensions

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 4.85 5.15 0.191 0.203

V

D 2.20 2.60 0.086 0.102

E 0.40 0.80 0.015 0.031

V

Dia

F 1.00 1.40 0.039 0.055

F2 2.00 0.078

H

A

F3 2.00 2.40 0.078 0.094

G 10.90 0.429

L5

H 15.45 15.75 0.608 0.620

L

L2

L4

F2

L1

L3

V2

F3

F

G

D

ME

L 19.85 20.15 0.781 0.793

L1 3.70 4.30 0.145 0.169

L2 18.50 0.728

L3 14.20 14.80 0.559 0.582

L4 34.60 1.362

L5 5.50 0.216

M 2.00 3.00 0.078 0.118

V5° 5°

V2 60° 60°

Dia. 3.55 3.65 0.139 0.143

6/8 Doc ID 10762 Rev 5

STTH30L06 Ordering information

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STTH30L06G STTH30L06G D

STTH30L06G-TR STTH30L06G D

STTH30L06W STTH30L06W DO-247 4.40 g 30 Tube

2

PAK 1.48 g 50 Tube

2

PAK 1.48 g 1000 Tape and reel

4 Revision history

Table 9. Document revision history

Date Revision Changes

07-Sep-2004 1 First issue.

21-Oct-2004 2 DOP3I package added.

On page 2:

11-Jan-06 3

10-Aug-2006 4 Reformatted to current standards. SOD-93 package removed.

06-Sep-2011 5 Updated I

–I –I

corrected from 30 A to 50 A

F(RMS)

corrected from 50 A to 30 A

F(AV)

from 160 A to 300 A. Removed TO-220 and DOP3l.

FSM

Doc ID 10762 Rev 5 7/8

STTH30L06

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8/8 Doc ID 10762 Rev 5