Datasheet STTH2R06 Datasheet (ST)

STTH2R06

High efficiency ultrafast diode

Features

■ Very low conduction losses

■ Negligible switching losses

■ Low forward and reverse recovery times

■ High junction temperature

Description

The STTH2R06 uses ST Turbo 2 600 V planar Pt
doping technology. It is specially suited for
switching mode base drive and transistor circuits.
Packaged in axial, SMA, SMB and SMC, this
device is intended for use in high frequency
inverters, free wheeling and polarity protection.

DO-41

STTH2R06

SMB

STTH2R06U

Table 1. Device summary

Symbol Value

I

F(AV)

V

RRM

T

j

(typ) 1.0 V

V

F

t

(typ) 35 ns

rr

KA

SMA

STTH2R06A

SMC

STTH2R06S

2 A

600 V

175 °C

December 2009 Doc ID 10757 Rev 4 1/10

www.st.com

10

Characteristics STTH2R06

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

I

F(RMS)

I

F(AV)

I

T

Table 3. Thermal resistance

Repetitive peak reverse voltage 600 V

RRM

Forward rms current 7 A

DO-41 T

SMA T

Average forward current δ = 0.5

SMB T

SMC T

= 70 °C

L

= 85 °C

L

= 100 °C

L

= 115 °C

L

DO-41

= 10ms

t

Surge non repetitive forward current

FSM

SMA / SMB /

p

sinusoidal

SMC

Storage temperature range -65 to + 175 °C

stg

Operating junction temperature range -40 to + 175 °C

T

j

2A

40

30

Symbol Parameter Maximum Unit

DO-41 L = 5 mm 35

SMA 30

R

th(j-l)

Junction to lead

SMB 25

°C/W

SMC 20

Table 4. Static electrical characteristics

A

Symbol Parameter Test conditions Min. Typ. Max. Unit

= 25 °C

T

Reverse leakage

(1)

I

R

current

(2)

V

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: tp = 380 µs, δ < 2 %

Forward voltage drop

F

j

= 150 °C - 12 85

T

j

T

= 25 °C

j

= 150 °C - 1.0 1.25

T

j

VR = V

= 2 A

I

F

To evaluate the maximum conduction losses use the following equation:
P = 1 x I

2/10 Doc ID 10757 Rev 4

F(AV)

+ 0.125 I

F2(RMS)

RRM

--2
µA

--1.7

V

STTH2R06 Characteristics

Table 5. Dynamic electrical characteristics

Symbol Parameter

Reverse recovery time Tj = 25 °C

t

rr

Test conditions

= 0.5 A, Irr = 0.25 A,

I

F

IR = 1 A

= 1 A,

I

F

/dt = -50 A/µs

dI

F

Min. Typ. Max. Unit

--30

ns

-3550

VR = 30 V

Forward recovery time

t

fr

V

Forward recovery voltage - - 10 V

FP

= 25 °C

T

j

Figure 1. Conduction losses versus average

forward current

P(W)

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5

δ = 0.05

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

δ = 1

=tp/T

δ

Figure 3. Relative variation of thermal

impedance junction to case versus

I

F

dI
VFR = 1.1 x V

T

tp

= 2 A,

/dt = 100 A/µs

F

--100ns

Fmax

Figure 2. Forward voltage drop versus

forward current

I (A)

FM

10

9

8

7

6

5

4

3

2

1

0

0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00

(maximum values)

T =150°C

j

(typical values)

T =150°C

j

V (V)

FM

T =25°C

j

(maximum values)

Figure 4. Peak reverse recovery current

versus dI

/dt (typical values)

F

pulse duration

Z/R

th(j-a) th(j-a)

1.0

SMA/SMB/SMC: S = 1cm

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

2

CU

SMA

SMC

t (s)

p

DO-41

SMB

I (A)

RM

9

V =400V

R

T =125°C

j

8

7

6

5

4

3

2

1

0

0 50 100 150 200 250 300 350 400 450 500

I =0.5 x I

F F(AV)

I=I

F F(AV)

dI /dt(A/µs)

I =2 x I

F F(AV)

F

Doc ID 10757 Rev 4 3/10

Characteristics STTH2R06

5

Figure 5. Reverse recovery time versus dIF/dt

(typical values)

t (ns)

rr

300

250

200

I =2 x I

150

100

50

0

0 50 100 150 200 250 300 350 400 450 500

F F(AV)

I=I

F F(AV)

I =0.5 x I

F F(AV)

dI /dt(A/µs)

F

V =400V

R

T =125°C

j

Figure 7. Relative variations of dynamic

parameters versus junction

Figure 6. Reverse recovery charges versus

dI

/dt (typical values)

F

Q (nC)

rr

400

V =400V

R

T =125°C

j

350

I =2 x I

300

250

200

150

100

50

0

0 100 200 300 400 500

F F(AV)

I=I

F F(AV)

I =0.5 x I

F F(AV)

dI /dt(A/µs)

F

Figure 8. Transient peak forward voltage

versus dI

/dt (typical values)

F

temperature

.2

.0

.8

.6

.4

t

rr

I

RM

Q

RR

I=I

F F(AV)

V =400V

R

Reference:T =125°C

.2

T (°C)

.0

j

25 50 75 100 12

Figure 9. Forward recovery time versus dI

(typical values)

j

/dt

F

V (V)

FP

30

I=I

F F(AV)

T =125°C

j

25

20

15

10

5

dI /dt(A/µs)

0

0 50 100 150 200 250

F

Figure 10. Junction capacitance versus

reverse voltage applied
(typical values)

300

250

t (ns)

fr

I=I

F F(AV)

V =1.1 x V max.

FR F

T =125°C

j

100

C(pF)

F=1MHz

V =30mV

OSC RMS

T =25°C

j

200

150

100

50

dI /dt(A/µs)

0

0 50 100 150 200 250

F

10

1

1 10 100 1000

4/10 Doc ID 10757 Rev 4

V (V)

R

STTH2R06 Characteristics

R(°C/W)

Figure 11. Thermal resistance junction to

ambient versus copper surface

Figure 12. Thermal resistance versus lead

length (DO-41)

under each lead

120

100

th(j-a)

epoxy FR4, e = 35 µm

SMA

SMB

80

CU

R (°C/W)

120

100

80

th

R

th(j-a)

60

40

20

0

SMB

S (cm²)

CU

60

40

20

0

5 10152025

R

th(j-l)

L (mm)

lead

Doc ID 10757 Rev 4 5/10

Package information STTH2R06

2 Package information

● Epoxy meets UL 94, V0

● Band indicates cathode

● Bending method (DO-41): see Application note AN1471

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 6. DO-41 (plastic) dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

ØD

Ref.

ØB

Millimeters Inches

Min. Max. Min. Max.

A 4.07 5.20 0.160 0.205

CC

A

B 2.04 2.71 0.080 0.107

C25.4 1

D 0.71 0.86 0.028 0.034

Table 7. SMA dimensions

Dimensions

Ref.

E1

Millimeters Inches

Min. Max. Min. Max.

D

E

A1

C

L

A2

b

6/10 Doc ID 10757 Rev 4

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

STTH2R06 Package information

Figure 13. Footprint (dimensions in mm)

1.4

Table 8. SMB dimensions

2.63

5.43

1.4

1.64

Dimensions

E1

D

E

A1

C

L

A2

b

Figure 14. Footprint (dimensions in mm)

1.62

2.60

5.84

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

L 0.75 1.50 0.030 0.059

1.62

2.18

Doc ID 10757 Rev 4 7/10

Package information STTH2R06

Table 9. SMC dimensions

Dimensions

Ref.

E1

A1 1.90 2.45 0.075 0.096

D

E

A2 0.05 0.20 0.002 0.008

(1)

b

(1)

c

D 5.55 6.25 0.218 0.246

A1

C

LE2

A2

b

E 7.75 8.15 0.305 0.321

E1 6.60 7.15 0.260 0.281

E2 4.40 4.70 0.173 0.185

L 0.75 1.50 0.030 0.059

1. Dimensions b and c apply to plated leads

Figure 15. Footprint, dimensions in mm (inches)

(0.061) (0.201)

1.545.111.54

(0.061)

Millimeters Inches

Min. Max. Min. Max.

2.90 3.20 0.114 0.126

0.15 0.40 0.006 0.016

3.14

(0.124)

8.19

(0.322)

8/10 Doc ID 10757 Rev 4

STTH2R06 Ordering information

3 Ordering information

Table 10. Ordering information

Order code Marking Package Weight Base qty

STTH2R06 STTH2R06 DO-41 0.34 g 2000 Ammopack

STTH2R06RL STTH2R06 DO-41 0.34 g 5000 Tape and reel

STTH2R06A R6A SMA 0.068 g 5000 Tape and reel

STTH2R06U R6U SMB 0.11 g 2500 Tape and reel

STTH2R06S R62 SMC 0.243 g 2500 Tape and reel

4 Revision history

Table 11. Document revision history

Date Revision Changes

07-Sep-2004 1 First issue

1-Jun-2005 2 SMC package addition.

30-Sep-2009 3 Updated Ta b l e 6 package dimensions.

04-Dec-2009 4 Updated Ta b l e 9 package dimensions.

Delivery

mode

Doc ID 10757 Rev 4 9/10

STTH2R06

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10/10 Doc ID 10757 Rev 4