Dual rectifiers suited for Switch Mode Power
Supply and high frequency DC to DC converters.
Packaged in ISOTOP™, this device is intended
for use in low voltage, high frequency inverters,
free wheeling operation, welding equipment and
telecom power supplies.
Table 1.Absolute ratings (limiting values, per diode, Tc = 25° C unless otherwise stated)
Order codes
Part numberMarking
STTH20003TVSTTH20003TV
SymbolParameterValueUnit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T
TM: ISOTOP is a registered trademark of STMicroelectronics
September 2006 Rev 21/7
Repetitive peak reverse voltage300V
RMS forward current180A
Average forward currentTc = 85° C δ = 0.5
Surge non repetitive forward currenttp = 10 ms sinusoidal100A
To evaluate the conduction losses use the following equation:
P = 0.75 x I
Table 4.Dynamic characteristics (per diode)
SymbolParameterTest conditionsMin Typ Max Unit
+ 0.0020 I
F(AV)
F2(RMS)
S
t
rr
I
RM
factor
t
fr
V
FP
Reverse recovery
time
Reverse recovery
current
Softness factorTj = 125° C
Forward recovery
time
Forward recovery
voltage
= 25° C
T
j
T
= 125° C
j
= 25° C
T
j
T
= 25° C
j
2/7
= 0.5 A Irr = 0.25 A IR = 1 A55
I
F
I
= 1 A dIF/dt = -50 A/µs
F
= 30 V
V
R
= 100 A VR = 200 V
I
F
dIF/dt = -200 A/µs
I
= 100 A VR = 200 V
F
dI
/dt = -200 A/µs
F
= 100 A dIF/dt = 200 A/µs
I
F
= 1.1 x V
V
FR
= 100 A dIF/dt = 200 A/µs
I
F
VFR = 1.1 x V
Fmax
Fmax
ns
90
18A
0.3
1400ns
5V
Page 3
STTH20003TVCharacteristics
Figure 1.Conduction losses versus
average forward current (per diode)
P1(W)
120
100
80
δ = 0.1
δ = 0.05
δ = 0.2
δ = 0.5
60
40
20
0
020406080100120
I (av) (A)
F
δ
=t /T
T
p
Figure 3.Relative variation of thermal
impedance junction to case versus
pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.8
0.6
0.4
0.2
Single pulse
0.0
1E-31E-21E-11E+05E+0
t (s)
p
δ
=t /T
T
p
δ = 1
Figure 2.Forward voltage drop versus
forward current (per diode)
I (A)
FM
500
100
Tj=125°C
(Typical values)
Tj=25°C
Tj=125°C
10
t
p
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
V (V)
FM
Figure 4.Peak reverse recovery current
versus dI
/dt (90% confidence, per
F
diode)
I (A)
RM
40
V =200V
R
T =125°C
j
35
30
I =0.5xI (av)
25
FF
20
15
10
t
p
5
0
050 100 150 200 250 300 350 400 450 500
dI /dt(A/µs)
F
IF=I (av)
F
I =2xI (av)
FF
Figure 5.Reverse recovery time versus
dI
/dt (90% confidence, per diode)
F
t (ns)
rr
260
240
220
200
180
160
140
120
100
80
60
40
20
0
050 100 150 200 250 300 350 400 450 500
I =2xI (av)
FF
I=I(av)
FF
dI /dt(A/µs)
F
I =0.5xI (av)
FF
V =200V
R
T =125°C
j
Figure 6.Softness factor (t
dI
/dt (typical values, per diode)
F
S factor
0.6
0.5
) versus
b/ta
V =200V
R
T =125°C
j
0.4
0.3
0.2
0.1
dI /dt(A/µs)
0.0
050 100 150 200 250 300 350 400 450 500
F
3/7
Page 4
CharacteristicsSTTH20003TV
Figure 7.Relative variations of dynamic
parameters versus junction
temperature (reference: T
= 125° C)
j
Figure 8.Transient peak forward voltage
versus dI
/dt (90% confidence, per
F
diode)
2.4
2.2
2.0
1.8
S factor
1.6
1.4
1.2
1.0
0.8
I
RM
0.6
0.4
0.2
0.0
255075100125
T (°C)
j
Figure 9.Forward recovery time versus dI
(90% confidence, per diode)
t (ns)
fr
1000
900
800
700
600
500
400
300
200
100
0
050 100 150 200 250 300 350 400 450 500
dI /dt(A/µs)
F
V =1.1 x V max.
FRF
I=I(av)
FF
T =125°C
j
F
/dt
V (V)
FP
8
I=I(av)
FF
T =125°C
j
7
6
5
4
3
2
1
0
050 100 150 200 250 300 350 400 450 500
dI /dt(A/µs)
F
4/7
Page 5
STTH20003TVPackage information
2 Package information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 1.3 Nm
●Maximum torque value: 1.5 Nm
Table 5.ISOTOP Dimensions
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
E
G2
C
A11.8012.200.4650.480
A18.909.100.3500.358
A
A1
E2
F1F
C2
B7.88.200.3070.323
C0.750.850.0300.033
C21.952.050.0770.081
D37.8038.201.4881.504
D131.5031.701.2401.248
E25.1525.500.9901.004
P1
D1
S
D
B
G
E123.8524.150.9390.951
E224.80 typ. 0.976 typ.
G14.9015.100.5870.594
G112.6012.800.4960.504
G23.504.300.1380.169
ØP
G1
E1
F4.104.300.1610.169
F14.605.000.1810.197
P4.004.300.1570.69
P14.004.400.1570.173
S30.1030.301.1851.193
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Reformatted to current standards. Thermal resistance updated
in Table 2.
Tu b e
6/7
Page 7
STTH20003TV
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