Datasheet STTH12S06 Datasheet (ST)

Download

Page 1

Table 1. Main product characteristics

F(AV)

RRM

RM (typ.)

j (max)

F (typ)

rr (typ)

12 A

600 V

6 A

175 °C

1.5 V

14 ns

STTH12S06

Turbo 2 ultrafast high voltage rectifier

Features and benefits

■ Ultrafast recovery

■ Low reverse recovery current

■ Reduces losses in diode and switching

TO-220FPAC

STTH12S06FP

transistor

■ Low thermal resistance

■ Higher frequency operation

■ Insulated voltage: 1500 V

RMS

Description

ST's STTH12S06 is a state of the art Ultrafast recovery diode. By the use of 600 V Pt doping Planar technology, this diode will outperform the power factor correction circuits operating in hardswitching conditions. The extremely low reverse recovery current of the STTH12S06, reduces significantly the switching power losses of the MOSFET, and thus increases the

Table 2. Absolute ratings (limiting values at 125 °C, unless otherwise stated)

Symbol Parameter Value Unit

F(AV

FSM

RRM

stg

Repetitive peak reverse voltage 600 V

) Average forward current 12 A

Surge non repetitive forward current tp = 10 ms sinusoidal 100 A

Storage temperature range - 65 + 175 °C

Maximum operating junction temperature 175 °C

efficiency of the application. This allows designers to reduce the size of their heatsinks.

This device is also intended for applications in power supplies and power conversions systems, and other power switching applications.

October 2007 Rev 1 1/6

www.st.com

Page 2

Characteristics STTH12S06

1 Characteristics

Table 3. Thermal resistances

Symbol Parameter Value Unit

Rth (j-c) Junction to case 4.6 °C/W

Table 4. Static electrical characteristics

Symbol Parameter Tests conditions Min. Typ. Max. Unit

Table 5. Dynamic electrical characteristics

Reverse leakage current VR = 600 V

Forward voltage drop IF = 12 A

Symbol Tests conditions Min. Typ. Max. Unit

IF = 1 A dIF/dt = - 200 A/µs VR = 30 V 14 21 ns

VR = 400 V IF = 12A dIF/dt = - 200 A/µs

VR = 200 V IF = 12A

/dt = - 200 A/µs

S factor

Figure 1. Conduction losses versus

average current

P(W)

34 32 30 28 26 24 22 20 18 16 14 12 10

8 6 4 2 0

0 2 4 6 8 10 12 14 16

δ=0.05

δ=0.1

δ=0.2

(A)

F(AV)

δ=0.5

=tp/T

Tj = 125 °C

δ=1

Tj = 25 °C 30

= 125 °C 35 400

= 25 °C 3.4

= 150 °C 1.5 1.9

6.0 8.0 A

0.3

160 nC

Figure 2. Forward voltage drop versus

forward current

IFM(A)

100

Tj=150°C

01234567

Tj=150°C

(Maximum values)

Tj=150°C

(Typical values)

Tj=25°C

(Maximumvalues)

VFM(V)

µA

2/6

Page 3

STTH12S06 Characteristics

Figure 3. Relative variation of thermal

impedance, junction to case, versus pulse duration

)/R

th(j-c

th(j-c)

1.0

Single pulse

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

tp(s)

Figure 5. Reverse recovery time versus

/dt (typical values)

tRR(ns)

120

100

0 50 100 150 200 250 300 350 400 450 500 550 600

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

IF= 12 A V

=400V

Figure 4. Peak reverse recovery current

versus dI

IRM(A)

IF= 12 A

=400V

10 100 1000

/dt (typical values)

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

Figure 6. Reverse recovery charges versus

dIF/dt (typical values)

QRR(nC)

260

IF= 12 A

240

=400V

220

200

180

160

140

120

100

10 100 1000

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

Figure 7. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

100

VR(V)

1 10 100 1000

F=1MHz

=30mV

osc

Tj=25°C

RMS

3/6

Page 4

Package information STTH12S06

2 Package information

● Epoxy meets UL94, V0

● Cooling method: by conduction (C)

● Recommended torque value: 0.55 Nm

● Maximum torque value: 0.7 Nm

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Table 6. TO-220FPAC dimensions

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.4 4.6 0.173 0.181

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

E 0.45 0.70 0.018 0.027

Dia

F 0.75 1 0.030 0.039

F1 1.15 1.70 0.045 0.067

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

L2 16 Typ. 0.63 Typ.

L3 28.6 30.6 1.126 1.205

L4 9.8 10.6 0.386 0.417

L5 2.9 3.6 0.114 0.142

L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

4/6

Page 5

STTH12S06 Ordering information

3 Ordering information

Table 7. Ordering information

Part number Marking Package Weight Base qty Delivery mode

STTH12S06FP STTH12S06FP TO-220FPAC 1.64 50 Tube

4 Revision history

Table 8. Revision history

Date Revision Changes

02-Oct-2007 1 Initial release.

5/6

Page 6

STTH12S06

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

6/6