The STTH10002 is a dual rectifier suited for
welding equipment, and high power industrial
applications.
Packaged in ISOTOP, this device is intended for
use in the secondary rectification of power
converters.
K1
A1
K2
A2
A1A1
K1
A2
K2
ISOTOP
STTH10002TV1
K2
A1
A2
K1
K2
K1
A2
ISOTOP
STTH10002TV2
Order codes
Part NumberMarking
STTH10002TV1STTH10002TV1
STTH10002TV2STTH10002TV2
April 2006 Rev 11/8
www.st.com
Page 2
CharacteristicsSTTH10002
1 Characteristics
Table 1.Absolute ratings (limiting values at T
= 25° C, unless otherwise specified)
j
SymbolParameterValueUnit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T
Table 2.Thermal parameters
Repetitive peak reverse voltage200V
RMS forward currentPer diode150A
Average forward current, δ = 0.5
Per diode T
Per device T
= 100° C
c
= 95° C
c
Surge non repetitive forward current tp = 10 ms Sinusoidal750A
Storage temperature range-55 to + 175° C
stg
T
Maximum operating junction temperature150° C
j
50A
SymbolParameterValueUnit
Per diode1
R
R
th(j-c)
th(c)
Junction to case
Coupling0.1
When the two diodes 1 and 2 are used simultaneously:
∆Tj(diode 1) = P (diode 1) X R
Table 3.Static electrical characteristics
(Per diode) + P (diode 2) x R
th(j-c)
th(c)
° C/WTotal0.55
SymbolParameterTest conditionsMin.TypMax.Unit
(1)
I
R
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: t
Reverse leakage current
(2)
Forward voltage drop
F
= 380 µs, δ < 2 %
p
= 25° C
j
= 125° C50500
T
j
T
= 25° C
j
T
= 125° CIF = 100 A0.901.0
j
Tj = 150° C
= V
V
R
RRM
I
= 50 A1
F
= 100 A1.15
I
F
I
= 50 A0.720.80
F
= 100 A
I
F
0.860.97
50
T
To evaluate the conduction losses use the following equation:
P = 0.63 x I
F(AV)
+ 0.0034 I
F2(RMS)
µA
V
2/8
Page 3
STTH10002Characteristics
/
Table 4.Dynamic characteristics
SymbolParameter
t
rr
I
RM
t
fr
V
FP
Reverse recovery time
Reverse recovery current
Forward recovery time
Forward recovery voltage
Test conditions
IF = 1 A, dIF/dt = -50 A/µs,
V
= 30 V, Tj = 25 °C
R
= 1 A, dIF/dt = -200 A/µs,
I
F
= 30 V, Tj = 25 °C
V
R
= 50 A, dIF/dt = 200 A/µs,
I
F
= 160 V, Tj = 125 °C
V
R
IF = 50 A, dIF/dt = 200 A/µs
V
= 1.1 x V
FR
, Tj = 25 °C
Fmax
IF = 50 A, dIF/dt = 200 A/µs,
Tj = 25 °C
Min.TypMax.Unit
5365ns
3037
1013A
180ns
1.6V
Figure 1.Peak current versus duty cycleFigure 2.Forward voltage drop versus
forward current (typical values, per
diode)
IM(A)
600
500
400
300
200
100
0
0.00.10.20.30.40.50.60.70.80.91.0
P = 100WP = 100 W
P = 60WP = 60 W
P = 30WP = 30 W
δ
T
T
I
I
M
M
=tp/T
=tp/T
d
δ
tp
tp
IFM(A)
300
250
200
150
100
50
0
0.00.20.40.60.81.01.21.41.6
Tj=150°C
Tj=25°C
VFM(V)
Figure 3.Forward voltage drop versus
300
250
200
150
100
50
0
forward current (maximum values,
per diode)
IFM(A)
Tj=150°C
Tj=25°C
VFM(V)
0.00.20.40.60.81.01.21.41.6
Figure 4.Relative variation of thermal
impedance, junction to case,
versus pulse duration
Z
R
th(j-c)
th(j-c)
1.0
Single pulse
ISOTOP
0.1
1.E-031.E-021.E-011.E+001.E+01
tp(s)
3/8
Page 4
CharacteristicsSTTH10002
Figure 5.Junction capacitance versus
reverse applied voltage (typical
values)
C(pF)
1000
100
1101001000
V
F=1MHz
=30mV
osc
Tj=25°C
RMS
VR(V)
Figure 7.Reverse recovery time versus dIF/dt
(typical values)
tRR(ns)
120
110
100
90
80
70
60
50
40
30
20
10
0
101001000
Tj=125 °C
Tj=25 °C
IF= 50 A
V
= 160 V
R
dIF/dt(A/µs)
Figure 6.Reverse recovery charges versus
dI
/dt (typical values)
F
QRR(nC)
450
IF= 50 A
400
V
=160 V
R
350
300
250
200
150
100
50
0
101001000
Tj=125 °C
Tj=25 °C
dIF/dt(A/µs)
Figure 8.Peak reverse recovery current
versus dI
IRM(A)
20
IF= 50 A
V
=160V
R
16
12
8
4
0
101001000
/dt (typical values)
F
Tj=125 °C
Tj=25 °C
dIF/dt(A/µs)
Figure 9.Dynamic parameters versus
junction temperature
QRR;IRM[Tj]/QRR;IRM[Tj=125°C]
1.4
IF= 50 A
V
=160V
R
1.2
1.0
I
0.8
0.6
0.4
0.2
0.0
255075100125150
RM
Q
RR
Tj(°C)
4/8
Page 5
STTH10002Ordering information scheme
2 Ordering information scheme
STTH 100 02 TVx
Ultrafast switching diode
Average forward current
100 = 100 A
Repetitive peak reverse voltage
02 = 200 V
Package
TVx = ISOTOP
5/8
Page 6
Package informationSTTH10002
3 Package information
Table 5.ISOTOP dimensions
DIMENSIONS
REF.
E
G2
A
A1
E2
F1F
C
C2
A11.8012.200.4650.480
A18.909.100.3500.358
B7.88.200.3070.323
C0.750.850.0300.033
C21.952.050.0770.081
MillimetersInches
Min.Max.Min.Max.
D37.8038.201.4881.504
D131.5031.701.2401.248
P1
E25.1525.500.9901.004
E123.8524.150.9390.951
D1
S
D
B
G
E224.80 typ. 0.976 typ.
G14.9015.100.5870.594
G112.6012.800.4960.504
G23.504.300.1380.169
ØP
G1
F4.104.300.1610.169
F14.605.000.1810.197
E1
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6/8
P4.004.300.1570.69
P14.004.400.1570.173
S30.1030.301.1851.193
Page 7
STTH10002Ordering information
4 Ordering information
Part NumberMarkingPackageWeightBase qtyDelivery mode
STTH10002TV1STTH10002TV1ISOTOP27 g10Tube
STTH10002TV2STTH10002TV2ISOTOP27 g10Tube
5 Revision history
DateRevisionDescription of Changes
05-Apr-20061First issue
7/8
Page 8
STTH10002
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