Datasheet STPS745 Datasheet (ST)

STPS745

Power Schottky rectifier

Main product characteristics

I

F(AV)

V

RRM

T

(max) 150° C

j

(max) 0.57 V

V

F

7.5 A

45 V

Features and Benefits

■ Very small conduction losses

■ Negligible switching losses

■ Extremely fast switching

■ Insulated package: TO-220FPAC

Insulating voltage = 2000 V DC
Capacitance = 12 pF

■ Avalanche capability specified

Description

Single Schottky rectifier suited for Switch Mode
Power Supply and high frequency DC to DC
converters.

AK

K

A

NC

2

PAK

D

STPS745G

A

K

TO-220AC

STPS745D

’’‘

TO-220FPAC

STPS745FP

A

K

Packaged either in TO-220AC, TO-220FPAC or

2

D

PAK, this device is intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.

March 2007 Rev 7 1/9

www.st.com

9

Characteristics STPS745

d

-

1 Characteristics

’

Table 1. Absolute Ratings (limiting values)

Symbo

l

V

RRM

I

F(RMS)

I

F(AV)

Repetitive peak reverse voltage 45 V

RMS forward voltage 20 A

Average forward current
δ = 0.5

Parameter Value Unit

TO-220AC /
D2PA K

= 160° C

T

c

7.5 A

TO-220FPAC Tc = 145° C

I

I

I

P

Surge non repetitive forward current tp = 10 ms Sinusoidal 150 A

FSM

Repetitive peak reverse current tp = 2 µs square F = 1 kHz 1 A

RRM

Non repetitive peak reverse current tp = 100 µs square 2 A

RSM

Repetitive peak avalanche power tp = 1 µs Tj = 25° C 2700 W

ARM

T

Storage temperature range

stg

TjMaximum operating junction temperature

(1)

-65 to +
175

175 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

Ptot

--------------

1. thermal runaway condition for a diode on its own heatsink

dTj

Table 2. Thermal resistances

1

--------------------------

<

Rth j a–()

Symbol Parameter Value Unit

2

PA K 3 .0

°C/W

R

th (j-c)

Junction to case

TO-220AC / D

TO-220FPAC 5.5

°C

Table 3. Static electrical characteristics (per diode)

Symbol Parameter Test Conditions Min. Typ. Max. Unit

= 25° C

T

(1)

I

V

1. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

R

(1)

Forward voltage drop

F

j

= 125° C 5 15 mA

T

j

= 125° C IF = 7.5 A 0.5 0.57

T

j

= 25° C IF = 15 A 0.84

j

= 125° C IF = 15 A 0.65 0.72

T

j

To evaluate the conduction losses use the following equation:
P = 0.42 x I

2/9

F(AV)

+ 0.020 I

F2(RMS)

V

= V

R

RRM

VT

100 µA

STPS745 Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P (W)

F(AV)

6

5

4

3

2

1

0

012345678910

δ = 0.05

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values)
(TO-220AC and D

2

PAK )

Figure 2. Average forward current versus

ambient temperature (

I (A)

F(AV)

9

R=R

8

7

6

5

R =40°C/W

δ

=tp/T

th(j-a)

T

tp

4

3

2

1

0

0 25 50 75 100 125 150 175

th(j-a) th(j-c)

R =15°C/W

th(j-a)

T (°C)

amb

δ = 0.5)

TO-220AC

TO-220FPAC

Figure 4. Normalized avalanche power

derating versus junction
temperature

P(t)

ARM p

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 6. Non repetitive surge peak

forwardcurrent versus overload
duration (maximum values)
(TO-220FPAC)

I (A)

M

120

100

80

60

40

IM

20

0

1E-3 1E-2 1E-1 1E+0

δ=0.5

t

t(s)

T =50°C

T =100°C

C

T =150°C

C

I (A)

M

80

70

60

50

C

40

30

20

IM

10

0
1E-3 1E-2 1E-1 1E+0

δ=0.5

t

t(s)

3/9

T =50°C

C

T =100°C

C

T =150°C

C

Characteristics STPS745

Figure 7. Relative variation of thermal

transient impedance junction to
case versus pulse duration

t (s)

p

2

PAK )

δ

T

=tp/T

(TO-220AC and D

Z/R

th(j-c) th(j-c)

1.0

0.8

0.6

δ = 0.5

0.4

δ = 0.2

δ = 0.1

0.2

Single pulse

0.0
1E-4 1E-3 1E-2 1E-1 1E+0

Figure 9. Reverse leakage current versus

reverse voltage applied (typical
values)

I (µA)

R

5E+4

T =150°C

1E+4

1E+3

1E+2

1E+1

1E+0

1E-1

0 5 10 15 20 25 30 35 40 45

j

T =125°C

j

T =100°C

j

T =75°C

j

T =50°C

j

T =25°C

j

V (V)

R

Figure 11. Forward voltage drop versus

forward current (maximum values)

I (A)

FM

100.0

T =125°C

j

(typical values)

T =25°C

10.0

T =125°C

j

1.0

V (V)

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

FM

j

Figure 8. Relative variation of thermal

transient impedance junction to
case versus pulse duration
(TO-220FPAC)

Z/R

th(j-c) th(j-c)

1.0

0.8

0.6

δ = 0.5

0.4

δ = 0.2

δ = 0.1

0.2

t (s)

tp

Single pulse

0.0
1E-3 1E-2 1E-1 1E+0 1E+1

p

Figure 10. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

1000

500

200

V (V)

100

12 51020 50

R

Figure 12. Thermal resistance junction to

ambient versus copper surface
under tab (Epoxy printed circuit
board, copper thickness: 35 µm)

R (°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0 2 4 6 8 101214161820

S(Cu)(cm²)

δ

=tp/T

T

F=1MHz

V =30mV

OSC RMS

T =25°C

j

tp

4/9

STPS745 Package information

m

D

2 Package information

● Epoxy meets UL94, V0

● Cooling method: by conduction (C)

● Recommended torque value: 0.55 Nm

● Maximum torque value: 0.70 Nm

Table 4. D

2

PAK dimensions

Dimensions

Ref

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A

L2

E

C2

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

L

L3

G

A1

B2

B

C

R

A2

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

M

*

V2

* FLAT ZONE NO LESS THAN 2m

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 13. Footprint (dimensions in millimeters)

16.90

10.30

8.90

5/9

3.70

5.08

1.30

Package information STPS745

Table 5. TO-220FPAC dimensions

Dimensions

Ref

Millimeters Inches

Min. Max. Min. Max.

A 4.4 4.6 0.173 0.181

A

H

B

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

Dia

L6

L2

L3

L5

F1

L4

F

G1

G

D

L7

E

E 0.45 0.70 0.018 0.027

F 0.75 1 0.030 0.039

F1 1.15 1.70 0.045 0.067

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

L2 16 Typ. 0.63 Typ.

L3 28.6 30.6 0.126 1.205

L4 9.8 10.6 0.386 0.417

L5 2.9 3.6 0.114 0.142

L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

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STPS745 Package information

Table 6. TO-220AC dimensions

Dimensions

L2

F1

Ref

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

C

H2

Ø I

L5

L6

A

C

L7

F1 1.14 1.70 0.044 0.066

1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F2 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

L9

L4

F

G

D

G1 2.40 2.70 0.094 0.106

H2 10 10.40 0.393 0.409

L2 16.4 typ. 0.645 ty

M

E

L4 13 14 0.511 0.551

p.

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. 3.75 3.85 0.147 0.151

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

7/9

Ordering information STPS745

3 Ordering information

Ordering type Marking Package Weight Base qty

STPS745D STPS745D TO-220AC 1.86 g 50 Tube

Delivery

mode

STPS745G STPS745G

STPS745G-TR STPS745G

STPS745FP STPS745FP TO-220FPAC 1.9 g 50 Tube

4 Revision history

Date Revision Description of Changes

Jul-2003 6G Last release.

22-Mar-2007 7 Removed ISOWATT package.

D2PAK 1.48 g 50 Tube

D2PAK 1.48 g 1000 Tape & reel

8/9

STPS745

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