Datasheet STPS6045HR Datasheet (ST)

Aerospace 2 x 30 A - 45 V Schottky rectifier

Features

■ Forward current: 2 x 30 A

■ Repetitive peak voltage: 45 V

■ Low forward voltage drop: 0.75 V

■ Maximum junction temperature: 175 °C

■ Negligible switching losses

■ Low capacitance

■ High reverse avalanche surge capability

■ Hermetic package

■ Target radiation qualification:

– 150 krad (Si) low dose rate
– 1 Mrad high dose rate

■ ESCC qualified

Description

This power Schottky rectifier is designed and
packaged to comply with the ESCC5000
specification for aerospace products. Housed in a
hermetically sealed surface mount package, it is
ideal for use in applications for aerospace and
other harsh environments.

STPS6045HR

TO-254

Figure 1. Device configuration

STPS6045CFSY1

STPS6045CFSYHRB

1

Terminal 1:
Terminal 2:
Terminal 3:

The case is not connected to any lead

Anode a
Common cathode
Anode b

3

2

The STPS6045HR is intended for use in medium
voltage applications and in high frequency circuits
where low switching losses and low noise are
required.

Table 1. Device summary

Order code

STPS6045CFSY1 -

STPS6045CFSYHRB 5106/018/01 ESCC flight -

November 2010 Doc ID 18184 Rev 1 1/8

ESCC part

number

Quality level EPPL Comment Package

Engineering

model

-

Single die TO-254

Lead

finish

Gold

Solder

dip

www.st.com

8

Characteristics STPS6045HR

1 Characteristics

Table 2. Absolute maximum ratings

Symbol Characteristic Value Unit

(6)

(3)

(2)

(1)

(4) (5)

300 A

45 V

1A

30

A

40

-65 to +175 °C

I

FSM

V

RRM

I

RRM

I

O

I

F(RMS)

T

OP

Forward surge current (per diode)

Repetitive peak reverse voltage

Repetitive peak reverse current

Average output rectified current (50% duty cycle):
per diode
per device

Forward rms current (per diode) 30 A

Operating temperature range
(case temperature)

T

T

STG

T

SOL

Junction temperature +175 °C

J

(7)

(6)

-65 to +175 °C

+260 °C

Storage temperature range

Soldering temperature

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

1. Sinusoidal pulse of 10 ms duration

2. Pulsed, duration 5 ms, F = 50 Hz

3. Pulsed, duration 2 µs, F = 1 kHz

4. For T

5. The per device ratings apply only when both anode terminals are tied together.

6. For solder dip lead finish devices all testing performed at T
inert atmosphere.

7. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same
lead shall not be resoldered until 3 minutes have elapsed.

Table 3. Thermal resistance

> +138 °C per device and T

case

> +144 °C per device, derate linearly to 0 A at +175 °C.

case

> +125 °C shall be carried out in a 100%

amb

Symbol Characteristic Value Unit

Thermal resistance, junction to case

(1)

R

th(j-c)

1. Package mounted on infinite heatsink

2. The per device ratings apply only when both anode terminals are tied togther.

per diode
per device

(2)

1.7

1.2

°C/W

2/8 Doc ID 18184 Rev 1

STPS6045HR Characteristics

Table 4. Electrical measurements at ambiant temperature (per diode), T

Symbol Characteristic

I

R

(1)

V

F1

(1)

V

F2

(1)

V

F3

(1)

V

F4

C Capacitance 4001 V

Z

th(j-c)

1. Pulse width ≤ 300 µs, Duty Cycle ≤ 2%

2. Performed only during screening tests parameter drift values (initial measurements), go-no-go

3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and
shall guarantee the R

Table 5. Electrical measurements at high and low temperatures (per diode)

Symbol Characteristic

s

MIL-STD-750

test method

Test conditions

= 22 ±3 °C

amb

Values

Min. Max.

Reverse current 4016 DC method, VR = 45V - 500 µA

Pulse method, I

= 5 A - 520 mV

F

Pulse method, IF = 10 A - 590 mV

Forward voltage 4011

Pulse method, IF = 20 A 650 mV

Pulse method, IF = 35 A 820

= 5 V, F = 1 MHz - 1.3 nF

R

= 15 to 40 A, tH = 50 ms

Relative thermal impedance,

(2)

junction to case

limits specified in maximum ratings.

th(j-c)

3101

MIL-STD-750

test method

I

H

IM = 50 mA, tmd = 100 µs

Test conditions

(1)

Calculate ΔV

Values

Min. Max.

(3)

F

Units

°C/W

Units

T

= +125 (+0, -5) °C

I

Reverse current 4016

R

(2)

V

F2

(2)

V

V

1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a
100% inspection may be performed.

2. Pulse width ≤ 300 µs, duty cycle ≤ 2%

Forward voltage 4011

F3

(2)

F4

case

DC method, VR = 45 V

T

= +125 (+0, -5) °C

case

pulse method, IF = 10 A

T

= +125 (+0, -5) °C

case

pulse method, IF = 20 A

T

= -55 (+0, -5) °C

case

pulse method, IF = 20 A

T

= +125 (+0, -5) °C

case

pulse method, IF = 35 A

-40mA

-530mV

-610mV

-800mV

-790mV

Doc ID 18184 Rev 1 3/8

Package Information STPS6045HR

2 Package Information

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK

Figure 2. Metal flange mount package (TO-254

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

(a)

) 3 lead, dimension definitions

R1

G

R2

B

H

ØF

C

3

2

1

N

L

D

E

A

ØM

K

K

a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections

ØI

J

4/8 Doc ID 18184 Rev 1

STPS6045HR Package Information

Table 6. Metal flange mount package (TO-254) 3-lead, dimension values

Dimension in millimetres Dimlension in inches

Reference

Min. Max. Min. Max.

A 13.59 13.84 0.535 0.545

B 13.59 13.84 0.535 0.545

C 20.07 20.32 0.790 0.800

D 6.3 6.7 0.248 0.264

E 1 3.9 0.039 0.154

ØF 3.5 3.9 0.138 0.154

G 16.89 17.4 0.665 0.685

H 6.86 BSC 0.270 BSC

(1)

ØI

J 3.81 BSC 0.150 BSC

K 3.81 BSC 0.150 BSC

L 12.95 14.5 0.510 0.571

ØM 3.05 Typ. 0.120 Typ.

N - 0.71 - 0.028

(2)

R1

(3)

R2

1. 3 locations

2. Radius of heatsink flange corner - 4 locations

3. Radius of body corner - 4 locations

0.89 1.14 0.035 0.045

- 1 - 0.039

1.65 Typ. 0.065

Doc ID 18184 Rev 1 5/8

Ordering Information STPS6045HR

3 Ordering Information

Table 7. Ordering information

Order code

STPS6045CFSY1 - -

STPS6045CFSYHRB 5106/018/01 - Solder dip 510601801 + BeO

ESCC part

number

EPPL Package Lead finish Marking

TO-254

Gold

STPS6045CFSY1

+ BeO

Mass

(g)

10.0

Packing

Strip
pack

6/8 Doc ID 18184 Rev 1

STPS6045HR Revision history

4 Revision history

Table 8. Document revision history

Date Revision Changes

03-Nov-2010 1 Initial release.

Doc ID 18184 Rev 1 7/8

STPS6045HR

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2010 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

8/8 Doc ID 18184 Rev 1