Datasheet STPS5L60-Y Datasheet (ST)

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Page 1

Features

■ Negligible switching losses

■ Low forward voltage drop for higher efficiency

■ Low thermal resistance

■ Avalanche capability specified

■ AEC-Q101 qualified

■ ECOPACK

2 compliant component

Description

Power Schottky rectifier suited for switch mode power supplies and high frequency inverters.

This device is intended for use in low voltage output for small battery chargers and battery protection in automotive applications.

STPS5L60-Y

Automotive power Schottky rectifier

Datasheet − production data

SMC

STPS5L60SY

Table 1. Device summary

5 A

F(AV)

RRM

150 °C

j (max)

F (max)

60 V

0.53 V

March 2012 Doc ID 022951 Rev 1 1/7

This is information on a product in full production.

www.st.com

Page 2

Characteristics STPS5L60-Y

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

RRM

F(RMS)

F(AV)

FSM

ARM

dV/dt Critical rate of rise of reverse voltage (rated V

dPtot

---------------

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal parameters

Repetitive peak reverse voltage 60 V

Forward rms current 15 A

= 100 °C δ = 0.5

Average forward current

Surge non repetitive forward current

Repetitive peak avalanche power

Storage temperature range -65 to +175 °C

stg

Operating junction temperature

--------------------------

Rth j a–()

Half wave, single phase

= 10 ms

= 1 µs Tj = 25 °C

(1)

150 A

4000 W

-40 to +150 °C

, Tj = 25 °C) 10000 V/µs

Symbol Parameter Value Unit

Junction to leads 15 °C/W

th (j-l)

Table 4. Static electrical characteristics

Symbol Parameter Tests conditions Min. Typ. Max. Unit

(1)

1. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

(1)

Forward voltage drop

= 25 °C

= V

= 125 °C 40 100

= 25 °C

= 5 A

= 125 °C 0.42 0.48

RRM

0.47 0.52

0.22

mA Tj = 100 °C 10 25

VTj = 100 °C 0.43 0.49

To evaluate the conduction losses use the following equation: P = 0.39 x I

F(AV)

+ 0.028x I

F2(RMS)

2/7 Doc ID 022951 Rev 1

Page 3

STPS5L60-Y Characteristics

Figure 1. Conduction losses versus average

current

PF(av)(W)

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.

δ = 0.05

δ = 0.1

δ = 0.2

IF(av)(A)

δ = 0.5

=tp/T

δ = 1

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

0.1

Figure 2. Average forward current versus

ambient temperature (

IF(av)(A)

=tp/T

0 150

Rth(j-a)=Rth(j-l)

SMC Rth(j-a)=90°C/W

25 50 75 100 125

δ = 0.5)

Tamb(°C)

Figure 4. Normalized avalanche power

derating versus junction temperature

P(t)

ARM j

P (25°C)

ARM

0.01

t (µs)

0.001

0.10.01 1

10 100 1000

Figure 5. Non repetitive surge peak forward

current versus overload duration (maximum values)

IM(A)

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t(s)

SMC

Ta=25°C

Ta=75°C

Ta=125°C

T (°C)

25 50 75 100 125 150

Figure 6. Relative variation of thermal

impedance junction to ambient versus pulse duration

Z/R

th(j-a) th(j-a)

1.0

SMC

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

Doc ID 022951 Rev 1 3/7

Page 4

Characteristics STPS5L60-Y

Figure 7. Reverse leakage current versus

reverse voltage applied (typical values)

IR(mA)

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03 0 5 10 15 20 25 30 35 40 45 50 55 60

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=50°C

Tj=25°C

VR(V)

Figure 9. Forward voltage drop versus

forward current (low level)

IFM(A)

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=25°C

(Maximum values)

VFM(V)

Figure 8. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

1000

F=1MHz

Vosc=30mV

Tj=25°C

VR(V)

100

1 10 100

Figure 10. Forward voltage drop versus

forward current (high level)

IFM(A)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=25°C

(Maximum values)

VFM(V)

Figure 11. Thermal resistance junction to ambient versus copper surface under each lead

(epoxy printed board FR4, copper thickness = 35 µm)

R (°C/W)

th(j-a)

100

S (cm²)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

4/7 Doc ID 022951 Rev 1

SMC

Page 5

STPS5L60-Y Package information

2 Package information

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. SMC dimensions

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

(1)

2.90 3.20 0.114 0.126

(1)

0.15 0.40 0.006 0.016

D 5.55 6.25 0.218 0.246

LE2

E 7.75 8.15 0.305 0.321

E1 6.60 7.15 0.260 0.281

E2 4.40 4.70 0.173 0.185

L 0.75 1.50 0.030 0.059

1. Dimensions b and c apply to plated leads

Figure 12. Footprint, dimensions in mm (inches)

1.545.111.54

(0.061) (0.201)

8.19

(0.322)

Doc ID 022951 Rev 1 5/7

(0.061)

3.14

(0.124)

Page 6

Ordering information STPS5L60-Y

3 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS5L60SY S56Y SMC 0.245 g 2500 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Description of Changes

29-Mar-2012 1 Initial issue

6/7 Doc ID 022951 Rev 1

Page 7

STPS5L60-Y

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Doc ID 022951 Rev 1 7/7