This high voltage Schottky barrier rectifier is
packaged in DPAK and IPAK, and designed for
high frequency miniature switched mode power
supplies such as adaptators and on board DC to
Order codes
Part numberMarking
STPS5H100BS5H100
STPS5H100B-TRS5H100
STPS5H100HS5H100H
DC converters.
Table 1.Absolute ratings (limiting values)
SymbolParameterValueUnit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
P
ARM
T
dV/dtCritical rate of rise of reverse voltage10000V/µs
dPtot
---------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Repetitive peak reverse voltage100V
RMS forward voltage10A
Average forward currentTc = 165° C δ = 0.55A
Surge non repetitive forward currenttp =10 ms sinusoidal75A
ambient versus copper surface
under tab (Epoxy printed circuit
board, copper thickness: 35 µm)
Rth(j-a) (°C/W)
100
90
80
70
60
50
40
30
20
10
0
02468 10 12 14 16 18 20
S(Cu) (cm²)
4/8
Page 5
STPS5H100Package information
2 Package information
●Cooling method: by conduction (C)
●Epoxy meets UL94, V0
Figure 11. DPAK dimensions
Dimensions
Ref
E
B2
L2
H
L4
B
G
0.60 MIN.
A1
A2
A
C2
A10.901.100.0350.043
A20.030.230.0010.009
B25.205.400.2040.212
R
D
C20.480.600.0180.023
R
C
L20.80 typ.0.031 typ.
V2
L40.601.000.0230.039
V20°8°0°8°
Figure 12. Footprint dimensions (in millimeters)
MillimetersInches
Min.Max.Min.Max.
A2.202.400.0860.094
B0.640.900.0250.035
C0.450.600.0170.023
D6.006.200.2360.244
E6.406.600.2510.259
G4.404.600.1730.181
H9.3510.100.3680.397
6.7
6.733
1.6
2.3
2.3
1.6
5/8
Page 6
Package informationSTPS5H100
Table 4.IPAK Dimensions
Dimensions
Ref.
MillimetersInches
Min.Typ. Max. Min.Typ. Max.
A2.202.40 0.0860.094
A10.901.10 0.0350.043
A30.701.30 0.0270.051
A
E
B2
L2
C2
B0.640.90 0.0250.035
B25.205.40 0.2040.212
B30.950.037
B50.300.035
D
C0.450.60 0.0170.023
C20.480.60 0.0190.023
H
L1
L
B3
B
V1
A1
D66.20 0.2360.244
E6.406.60 0.2520.260
e2.280.090
B5
e
G
C
A3
G4.404.60 0.1730.181
H16.100.634
L99.40 0.3540.370
L10.81.20 0.0310.047
L20.8010.031 0.039
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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