Datasheet STPS5H100 Datasheet (ST)

Page 1
Main product characteristics

STPS5H100

High voltage power Schottky rectifier

I
F(AV)
V
RRM
T
(max) 175° C
j
(max) 0.61 V
V
F
5 A
100 V
Features and benefits
■ Negligible switching losses
■ Low leakage current
■ Good trade off between leakage current and
K
A
NC
DPAK
STPS5H100B
K
NC
IPAK
STPS5H100H
forward voltage drop
■ Avalanche specification
Description
This high voltage Schottky barrier rectifier is packaged in DPAK and IPAK, and designed for high frequency miniature switched mode power supplies such as adaptators and on board DC to
Order codes
Part number Marking
STPS5H100B S5H100
STPS5H100B-TR S5H100
STPS5H100H S5H100H
DC converters.

Table 1. Absolute ratings (limiting values)

Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
P
ARM
T
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
dPtot
---------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Repetitive peak reverse voltage 100 V
RMS forward voltage 10 A
Average forward current Tc = 165° C δ = 0.5 5 A
Surge non repetitive forward current tp =10 ms sinusoidal 75 A
Repetitive peak reverse current tp = 2 µs F = 1 KHz 1 A
Non repetitive peak reverse current tp = 100 µs square 2 A
Repetitive peak avalanche power tp = 1 µs Tj = 25° C 7200 W
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature
T
j
1
--------------------------
<
Rth j a–()
(1)
175 °C
A
K
March 2007 Rev 9 1/8
www.st.com
8
Page 2
Characteristics STPS5H100

1 Characteristics

Table 2. Thermal resistance

Symbol Parameter Value Unit
R
th(j-c)

Table 3. Static electrical characteristics

Junction to case 2.5 °C/W
Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
I
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
R
(2)
Forward voltage drop
F
Tj = 25° C
VR = V
= 5 A
I
F
= 10 A
I
F
RRM
= 125° C 1.3 4.5 mA
T
j
= 25° C
T
j
T
= 125° C 0.57 0.61
j
= 25° C
T
j
T
= 125° C 0.66 0.71
j
3.5 µA
0.73
0.85
To evaluate the conduction losses use the following equation: P = 0.51 x I
F(AV)
+ 0.02I
F2(RMS)
V
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Page 3
STPS5H100 Characteristics
Figure 1. Average forward power dissipation
versus average forward current
PF(av)(W)
4.0
3.5
3.0
2.5
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IF(av) (A)
δ
=tp/T
T
tp
Figure 3. Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
IF(av)(A)
6
Rth(j-a)=Rth(j-c)
5
4
T
Rth(j-a)=80°C/W
tp
Tamb(°C)
3
2
1
=tp/T
δ
0
0 20 40 60 80 100 120 140 160 180
Figure 4. Normalized avalanche power
derating versus junction temperature
P(t)
ARM p
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
0 25 50 75 100 125 150
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum values)
IM(A)
120 110 100
90 80 70 60 50 40 30
IM
20 10
0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Tc=50°C
Tc=75°C
Tc=125°C
Figure 6. Relative variation of thermal
impedance junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.5
0.6
δ = 0.2
0.4
δ = 0.1
0.2
Single pulse
tp(s)
0.0 1E-3 1E-2 1E-1 1E+0
3/8
δ
=tp/T
T
tp
Page 4
Characteristics STPS5H100
Figure 7. Reverse leakage current versus
reverse voltage applied
IR(µA)
5E+3
1E+3
Tj=125°C
1E+2
1E+1
1E+0
1E-1
1E-2
0 102030405060708090100
Tj=25°C
VR(V)
Figure 9. Forward voltage drop versus
forward current (maximum values)
IFM(A)
50.0
10.0
1.0
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Tj=125°C
Tj=25°C
VFM(V)
Figure 8. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
1000
F=1MHz Tj=25°C
100
VR(V)
10
1 10 100
Figure 10. Thermal resistance junction to
ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35 µm)
Rth(j-a) (°C/W)
100
90 80 70 60 50 40 30 20 10
0
0 2 4 6 8 10 12 14 16 18 20
S(Cu) (cm²)
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Page 5
STPS5H100 Package information

2 Package information

● Cooling method: by conduction (C)
● Epoxy meets UL94, V0

Figure 11. DPAK dimensions

Dimensions
Ref
E
B2
L2
H
L4
B
G
0.60 MIN.
A1
A2
A
C2
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B2 5.20 5.40 0.204 0.212
R
D
C2 0.48 0.60 0.018 0.023
R
C
L2 0.80 typ. 0.031 typ.
V2
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°

Figure 12. Footprint dimensions (in millimeters)

Millimeters Inches
Min. Max. Min. Max.
A 2.20 2.40 0.086 0.094
B 0.64 0.90 0.025 0.035
C 0.45 0.60 0.017 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
6.7
6.7 3 3
1.6
2.3
2.3
1.6
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Page 6
Package information STPS5H100

Table 4. IPAK Dimensions

Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A3 0.70 1.30 0.027 0.051
A
E
B2
L2
C2
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
B3 0.95 0.037
B5 0.30 0.035
D
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.019 0.023
H
L1
L
B3
B
V1
A1
D 6 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
e2.28 0.090
B5
e
G
C
A3
G 4.40 4.60 0.173 0.181
H 16.10 0.634
L 9 9.40 0.354 0.370
L1 0.8 1.20 0.031 0.047
L2 0.80 1 0.031 0.039
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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V1 10° 10°
Page 7
STPS5H100 Ordering information

3 Ordering information

Ordering type Marking Package Weight Base qty Delivery mode
STPS5H100B S5H100
STPS5H100B-TR S5H100 2500 Tape and reel
STPS5H100H S5H100H IPAK 0.40 g 75 Tube

4 Revision history

Date Revision Description of changes
Jul-2003 6B Last issue.
03-Nov-2005 7 DPAK footprint dimensions updated.
15-Feb-2006 8 ECOPACK statement added.
05-Mar-2007 9 IPAK package added.
DPAK 0.30 g
75 Tube
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Page 8
STPS5H100
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