To evaluate the conduction losses use the following equation:
P = 0.58 x I
2/7Doc ID 018564 Rev 1
F(AV)
+ 0.0045 I
F2(RMS)
= V
th(c)
10μA
RRM
V
Page 3
STPS41H100C-YCharacteristics
Figure 1.Conduction losses versus average
current
PF(av)(W)
16
14
12
10
8
6
4
2
0
0510152025
δ = 0.05
δ = 0.2
δ = 0.1
IF(av)(A)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3.Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P(1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.011
10100
p
1000
Figure 5.Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
300
250
200
150
100
IM
50
0
1.E-031.E-021.E-011.E+00
δ=0.5
t
t(s)
Tc=25°C
Tc=75°C
Tc=125°C
Figure 2.Average forward current versus
ambient temperature (δ = 0.5)
IF(av)(A)
22
20
18
16
14
12
10
8
6
4
2
=tp/T
δ
0
0255075100125150175
Rth(j-a)=50°C/W
T
tp
Rth(j-a)=Rth(j-c)
Tamb(°C)
Figure 4.Normalized avalanche power
derating versus junction
temperature
P(T)
ARM j
P(25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
T (°C)
0
255075100125
j
Figure 6.Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
δ = 0.1
0.3
0.2
Single pulse
0.1
0.0
1.E-031.E-021.E-011.E+00
tp(s)
δ
=tp/T
T
tp
150
Doc ID 018564 Rev 13/7
Page 4
CharacteristicsSTPS41H100C-Y
Figure 7.Reverse leakage current versus
reverse voltage applied
(typical values)
IR(mA)
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
1.E-04
0 102030 405060 708090100
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
VR(V)
Figure 9.Forward voltage drop versus
forward current
IFM(A)
100
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
10
1
0.00.20.40.60.81.01.2
Tj=125°C
(Typical values)
(Typical values)
VFM(V)
Tj=25°C
(Maximum values)
Figure 8.Junction capacitance versus
reverse voltage applied
(typical values)
C(nF)
10.0
1.0
F=1MHz
Vosc=30mV
Tj=25°C
VR(V)
0.1
110100
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
(epoxy printed board FR4, Cu = 35 µm) - STPS41H100CG only
S(cm²)
0
0510152025303540
4/7Doc ID 018564 Rev 1
Page 5
STPS41H100C-YPackage information
m
D
2 Package information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 5.D
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
2
PAK dimensions
.
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.404.600.1730.181
A
L2
E
C2
A12.492.690.0980.106
A20.030.230.0010.009
B0.700.930.0270.037
L
L3
G
A1
B2
B
C
R
A2
B21.141.700.0450.067
C0.450.600.0170.024
C21.231.360.0480.054
D8.959.350.3520.368
E10.0010.400.3930.409
G4.885.280.1920.208
L15.0015.850.5900.624
M
*
V2
* FLAT ZONE NO LESS THAN 2m
L21.271.400.0500.055
L31.401.750.0550.069
M2.403.200.0940.126
R0.40 typ.0.016 typ.
Figure 11. Footprint (dimensions in mm)
16.90
10.30
8.90
Doc ID 018564 Rev 15/7
V20°8°0°8°
5.08
1.30
3.70
Page 6
Ordering informationSTPS41H100C-Y
3 Ordering information
Table 6.Ordering information
Order codeMarkingPackageWeightBase qtyDelivery mode
STPS41H100CGY-TR STPS41H100CGYD
2
PAK1.48 g1000Tape and reel
4 Revision history
Table 7.Document revision history
DateRevisionChanges
21-Oct-20111Initial release.
6/7Doc ID 018564 Rev 1
Page 7
STPS41H100C-Y
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