Datasheet STPS3L40-Y Datasheet (ST)

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Page 1

Features

■ Negligible switching losses

■ Low thermal resistance

■ Low forward voltage drop

■ Avalanche capability specified

■ ECOPACK

■ AEC-Q101 qualified

2 compliant component

STPS3L40-Y

Automotive power Schottky rectifier

SMC

STPS3L40SY

Description

Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. Packaged in SMC, this device is intended for use in DC/DC chargers for automotive application.

Table 1. Device summary

Symbol Value

F(AV)

RRM

(max) 150 °C

(max) 0.44 V

3 A

40 V

March 2011 Doc ID 018562 Rev 1 1/7

www.st.com

Page 2

Characteristics STPS3L40-Y

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

RRM

F(AV)

FSM

ARM

stg

dPtot

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal resistance

Repetitive peak reverse voltage 40 V

Average forward current TL = 120 °C δ = 0.5 3 A

Surge non repetitive forward current tp = 10 ms sinusoidal 75 A

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1300 W

Storage temperature range -65 to + 175 °C

Operating junction temperature range

Rth(j-a)

(1)

-40 to +150 °C

Symbol Parameter Value Unit

Table 4. Static electrical characteristics

Junction to lead 18 °C/W

th(j-l)

Symbol Parameter Test conditions Typ. Max. Unit

(1)

1. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

(1)

Forward voltage drop

= 25 °C

= 125 °C 16 40 mA

= 25 °C

= 125 °C 0.40 0.44

= 25 °C

= 125 °C 0.52 0.58

= V

= 3 A

IF = 6 A

RRM

100 µA

0.5

0.62

To evaluate the conduction losses use the following equation: P = 0.30 x I

2/7 Doc ID 018562 Rev 1

F(AV)

+ 0.047 I

F2(RMS)

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STPS3L40-Y Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P (W)

F(AV)

2.0

1.6

1.2

0.8

0.4

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

δ = 0.05

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

=tp/T

δ = 1

Figure 3. Non repetitive surge peak forward

current versus overload duration

Figure 2. Average forward current versus

ambient temperature (δ = 0.5) - SMC

I (A)

F(AV)

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0 25 50 75 100 125 150

=tp/T

R =75°C/W

th(j-a)

R=R

th(j-a) th(j-l)

T (°C)

amb

SMC

Figure 4. Normalized avalanche power

derating versus pulse duration

(maximum values)

I (A)

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t(s)

T =25°C

T =75°C

T =125°C

Figure 5. Normalized avalanche power

derating versus junction temperature

P(Tj)

ARM

P (25°C)

ARM

1.2

0.8

0.6

0.4

0.2

25 50 75 100 125 150

T (°C)

SMC

P(t)

ARM p

P (1µs)

ARM

0.1

0.01

t (µs)

0.001

0.10.01 1

10 100 1000

Figure 6. Relative variation of thermal

impedance junction to ambient versus pulse duration

Z/R

th(j-c) th(j-c)

1.0

SMC

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

=tp/T

Doc ID 018562 Rev 1 3/7

Page 4

Characteristics STPS3L40-Y

Figure 7. Reverse leakage current versus

reverse voltage applied (typical values)

I (mA)

1.E+02

T=125°C

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03

0 5 10 15 20 25 30 35 40

T=100°C

T=25°C

V (V)

Figure 9. Forward voltage drop versus

forward current

I (A)

100.00

10.00

Tj=125 °C

(Maximum values)

Tj=125 °C

1.00

(Typical values)

Tj=25°C

0.10

0.01

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

(Maximum values)

V (V)

Figure 8. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

1000

100

V (V)

110100

F=1MHz

V =30mV

OSC RMS

T=25°C

Figure 10. Thermal resistance junction to

ambient versus copper surface under each lead

R (°C/W)

th(j-a)

110

100

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

epoxy printed board FR4, copper thickness = 35 µm

S (cm²)

4/7 Doc ID 018562 Rev 1

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STPS3L40-Y Package information

2 Package information

● Epoxy meets UL94,V0

● Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. SMC package dimensions

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Dimensions

Ref

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 2.90 3.2 0.114 0.126

c 0.15 0.40 0.006 0.016

D 5.55 6.25 0.218 0.246

E 7.75 8.15 0.305 0.321

LE2

E1 6.60 7.15 0.260 0.281

E2 4.40 4.70 0.173 0.185

L 0.75 1.40 0.030 0.063

Figure 11. SMC footprint dimensions in mm (inches)

1.545.111.54

(0.061) (0.201)

8.19

(0.322)

Doc ID 018562 Rev 1 5/7

(0.061)

3.14

(0.124)

Page 6

Ordering information STPS3L40-Y

3 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS3L40SY S3L4Y SMC 0.24 g 2500 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Changes

10-Mar-2011 1 First issue.

6/7 Doc ID 018562 Rev 1

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STPS3L40-Y

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Doc ID 018562 Rev 1 7/7