Datasheet STPS3150 Datasheet (ST)

STPS3150

Power Schottky rectifier

Features

■ Negligible switching losses

■ Low forward voltage drop for higher efficiency

and extented battery life

■ Low thermal resistance

■ ECOPACK

®

2 compliant component

Description

150 V Power Schottky rectifier are suited for
switch mode power supplies on up to 24 V rails
and high frequency converters.

Packaged in Axial, SMB, and low-profile SMB, this
device is intended for use in consumer and
computer applications like TV, STB, PC and DVD
where low drop forward voltage is required to
reduce power dissipation.

A

K

SMB

STPS3150U

A

K

SMB flat

STPS3150UF

Table 1. Device summary

Symbol Value

I

F(AV)

V

RRM

(max) 175 °C

T

j

(max) 0.67 V

V

F

A

K

DO-201AD
STPS3150

3 A

150 V

July 2011 Doc ID 9474 Rev 5 1/10

www.st.com

10

Characteristics STPS3150

1 Characteristics

Table 2. Absolute Ratings (limiting values)

Symbol Parameter Value Unit

V

I

F(AV)

I

Repetitive peak reverse voltage 150

RRM

Average forward current

SMB T

DO-201AD TL = 140 °C δ = 0.5

SMB flat T

= 130 °C δ = 0.5

L

= 150 °C δ = 0.5

L

SMB

Surge non repetitive

FSM

forward current

DO-201AD 100

= 10 ms sinusoidal

t

p

3

80

SMB flat 80

T

1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Storage temperature range -65 to + 175 °C

stg

Operating junction temperature

T

j

dPtot

--------------­dTj

1

--------------------------

<

Rth j a–()

(1)

175 °C

Symbol Parameter Value Unit

V

A

A

SMB flat 10

R

th(j-l)

Junction to lead

°C/WSMB 20

Lead length = 10 mm DO-201AD 15

Table 4. Static electrical characteristics

Symbol Parameter Tests conditions Min. Typ. Max. Unit

Reverse leakage

(1)

I

R

current

(2)

V

1. tp = 5 ms, δ < 2%

2. tp = 380 µs, δ < 2%

Forward voltage drop

F

= 25 °C

T

j

= 125 °C 0.6 2.0 mA

T

j

= 25 °C

T

j

T

= 125 °C 0.63 0.67

j

= 25 °C

T

j

Tj = 125 °C 0.70 0.75

VR = V

= 3 A

I

F

= 6 A

I

F

RRM

0.4 2.0 µA

0.78 0.82

0.85 0.89

To evaluate the conduction losses use the following equation:
P = 0.59 x I

F(AV)

+ 0.023 I

F2(RMS)

V

2/10 Doc ID 9474 Rev 5

STPS3150 Characteristics

Figure 1. Average forward power

dissipation versus average
forward current

P (W)

F(AV)

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

δ = 0.05

I (A)

F(AV)

δ = 0.1

δ = 0.2

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3. Average forward current versus

ambient temperature (δ = 0.5)
(SMB flat)

I (A)

F(AV)

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0 25 50 75 100 125 150 175

δ

=tp/T

T

tp

R=R

th(j-a) th(j-l)

T (°C)

amb

SMB flat

R =40°C/W

th(j-a)

. S =2.5 cm

CU

2

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values)

I (A)

M

14

12

10

8

6

4

IM

2

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

DO-201AD

T =25°C

a

T =75°C

a

T =125°C

a

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)
(DO-201AD / SMB)

I (A)

F(AV)

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0 25 50 75 100 125 150 175

δ

=tp/T

T

tp

R =75°C/W

th(j-a)

T (°C)

R=R

th(j-a) th(j-I)

amb

DO-201AD

SMB

Figure 4. Non repetitive surge peak forward

current versus overload duration
(maximum values)

I (A)

M

12

11

10

9

8

7

6

5

4

3

IM

2

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMB

T =25°C

a

T =75°C

a

T =125°C

a

Figure 6. Non repetitive surge peak forward

current versus overload duration
(maximum values)

I (A)

M

50

45

40

35

30

25

20

15

IM

10

5

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMB flat

T =25°C

L

T =75°C

L

T =125°C

L

Doc ID 9474 Rev 5 3/10

Characteristics STPS3150

Figure 7. Normalized avalanche power

derating versus pulse duration

P(tp)

ARM

P (1µs)

ARM

1

0.1

0.01

0.001

0.10.01 1

10 100

Figure 9. Relative variation of thermal

impedance junction to ambient
versus pulse duration

Z/R

th(j-a) th(j-a)

1.0

SMB

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

δ

T

=tp/T

Figure 11. Relative variation of thermal

impedance junction to lead
versus pulse duration

Z/R

th(j-l) th(j-l)

1.0

SMB flat

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

t (s)

p

tp

Figure 8. Normalized avalanche power

derating versus junction
temperature

P(T)

ARM j

P (25 °C)

ARM

1.2

1

0.8

0.6

0.4

0.2

t (µs)

p

1000

0

25 50 75 100 125

Figure 10. Relative variation of thermal

impedance junction to ambient
versus pulse duration

Z/R

th(j-a) th(j-a)

1.0

DO-201AD

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

Figure 12. Reverse leakage current versus

reverse voltage applied
(typical values)

I (µA)

R

1.E+04

T=150°C

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

0 25 50 75 100 125 150

j

T=125°C

j

T=100°C

j

T=75°C

j

T=50°C

j

T=25°C

j

V (V)

R

δ

=tp/T

T (°C)

j

150

T

tp

4/10 Doc ID 9474 Rev 5

STPS3150 Characteristics

Figure 13. Junction capacitance versus

reverse voltage applied
(typical values)

C(pF)

1000

100

V (V)

10

1 10 100 1000

R

F=1MHz

V =30mV

OSC RMS

T=25°C

j

Figure 15. Thermal resistance junction to

ambient versus copper surface
under each lead

R (°C/W)

th(j-a)

110

epoxy printed board copper thickness = 35 µm

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S (cm²)

Cu

SMB

Figure 14. Forward voltage drop versus

forward current

I (A)

FM

100

10

1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8

T=125°C

j

(typical values)

T=125°C

j

(maximum values)

V (V)

FM

T=25°C

j

(maximum values)

Figure 16. Thermal resistance junction to

ambient versus copper surface
under each lead

Rth(°C/W)

90

80

70

60

50

40

30

20

10

epoxy printed board copper thickness = 35 µm

0

5 10152025

R

th(j-a)

R

th(j-I)

L (mm)

leads

DO-201AD

Figure 17. Thermal resistance junction to ambient versus copper surface under each lead

(epoxy printed board copper thickness = 35 µm)

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMB flat

S (cm²)

CU

Doc ID 9474 Rev 5 5/10

Package information STPS3150

2 Package information

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 5. SMB dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

E1

Ref.

Millimeters Inches

Min. Max. Min. Max.

D

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

L 0.75 1.50 0.030 0.059

Figure 18. SMB footprint (dimensions in mm)

1.62

2.60

5.84

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1.62

2.18

STPS3150 Package information

Table 6. SMB Flat dimensions

Dimensions

Ref.

A

D

L

E

E1

c

A 0.90 1.10 0.035 0.043

(1)

b

(1)

c

L2

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.200 0.220

L

b

E1 4.05 4.60 0.189 0.181

L1

L 0.75 1.50 0.029 0.059

L1 0.40 0.016

L2 0.60 0.024

1. Applies to plated leads

Figure 19. SMB Flat footprint (dimensions in mm)

5.84

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

1.95 2.20 0.077 0.087

0.15 0.40 0.006 0.016

2.07

1.20 1.203.44

Doc ID 9474 Rev 5 7/10

Package information STPS3150

Table 7. DO-201AD dimensions

Dimensions

BB

Note 1 Note 1

ØD

A

EE

Note 2

ØC

REF.

Millimeters Inches

Min. Max. Min. Max.

A 9.50 0.374

B 25.40 1.000

C 5.30 0.209

(1)

D

1.30 0.051

E 1.25 0.049

(2)

Note 2

1. The lead diameter D is not controlled over zone E

2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”)

15 0.59

8/10 Doc ID 9474 Rev 5

STPS3150 Ordering information

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS3150U G315 SMB 0.107 g 2500 Tape and reel

STPS3150UF FG315 SMB flat 0.50 g 5000 Tape and reel

STPS3150 STPS3150 DO-201AD 1.12 g 600 Ammopack

STPS3150RL STPS3150 DO-201AD 1.12 g 1900 Tape and reel

4 Revision history

Table 9. Document revision history

Date Revision Changes

May-2003 2A Last update.

31-May-2006 3

08-Feb-2007 4 Added SMB flat and SMB flat e package.

20-Jul-2011 5 Updated Table 2.

Reformatted to current standard. Added ECOPACK statement.
Updated SMB footprint in Figure 12. Changed nF to pF in Figure 8.

Doc ID 9474 Rev 5 9/10

STPS3150

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