Datasheet STPS30U100DJF Datasheet (ST)

Page 1
STPS30U100DJF
ULVF™ power Schottky rectifier
Features
High current capability
Ultralow forward voltage drop
High frequency operation
High integration
Description
The STPS30U100DJF is a power Schottky rectifier featuring an ultralow forward voltage drop (ULVF), suited for high frequency switch mode power supply and DC to DC converters.
Packaged in PowerFLAT™, this device is intended to be used in notebook, game station and desktop adapters, providing these applications with good efficiency at both low and high load. Its low profile was especially designed to be used in applications with space-saving constraints.
A
A
K
A
PowerFLAT 5x6
STPS30U100DJF

Table 1. Device summary

Symbol Value
K
K
A
I
F(AV)
V
RRM
(max) 150 °C
T
j
V
(typ) 0.69 V
F
TM: ULVF and PowerFLAT are trademarks of
STMicroelectronics
30 A
100 V
May 2011 Doc ID 18121 Rev 3 1/8
www.st.com
8
Page 2
Characteristics STPS30U100DJF

1 Characteristics

Table 2. Absolute ratings (limiting values, anode terminals short circuited)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
T
1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Symbol Parameter Value Unit
Repetitive peak reverse voltage 100 V
RRM
Forward rms current 45 A
Average forward current Tc = 75°C, δ = 0.5 30 A
Surge non repetitive forward current tp = 10 ms sine-wave 200 A
FSM
Storage temperature range -65 to + 150 °C
stg
Maximum operating junction temperature
T
j
dPtot
dTj
<
Rth(j-a)
1
(1)
150 °C
R

Table 4. Static electrical characteristics (anode terminals short circuited)

Junction to case 2.5 °C/W
th(j-c)
Symbol Parameter Test conditions Min. Typ. Max. Unit
= 125 °C VR = 70 V - 8 - mA
T
j
(1)
I
V
Reverse leakage current
R
(2)
Forward voltage drop
F
T
= 25 °C
j
= 125 °C - 20 45 mA
T
j
= 125 °C IF = 5 A - 0.38 0.42
T
j
T
= 125 °C IF = 10 A - 0.475 0.53
j
= 25 °C
T
j
Tj = 125 °C - 0.69 0.77
VR = V
= 30 A
I
F
RRM
--17A
- - 0.855
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation: P = 0.590 x I
+ 0.006 x I
F(AV)
F2(RMS)
V
2/8 Doc ID 18121 Rev 3
Page 3
STPS30U100DJF Characteristics
Figure 1. Average forward power dissipation
versus average forward current (maximum values)
P (W)
F(AV)
35.0
T = 75 °C
30.0
25.0
20.0
c
δ = 0.5
δ = 0.2
δ = 0.1
δ = 0.05
δ = 1
15.0
10.0
δ = t / T
p
T
t
p
5.0
0.0
I (A)
F(AV)
0 5 10 15 20 25 30 35 40
Figure 3. Non repetitive surge peak forward
current versus overload duration (maximum values)
I (A)
M
180
160
140
120
100
80
60
40
I
M
20
0
δ = 0.5
t
1.E-03 1.E-02 1.E-01 1.E+00
T = 25 °C
c
T = 75 °C
c
T = 125 °C
c
t(s)
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
I (A)
F(AV)
35
30
R
th th
(j-a)
= R
(j-c)
25
20
15
10
δ = t / T
p
T
t
p
T (°C)
amb
5
0
0 25 50 75 100 125 150
Figure 4. Relative variation of thermal
impedance, junction to case, versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3 Single pulse
0.2
0.1
0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
Figure 5. Reverse leakage current versus
reverse voltage applied (typical values)
I (mA)
R
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03 0 10 2030405060708090100
T = 150 °C
j
T = 125 °C
j
T = 100 °C
j
T = 75 °C
j
T = 50 °C
j
T = 25 °C
j
Figure 6. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
10000
1000
V (V)
R
100
1 10 100
Doc ID 18121 Rev 3 3/8
F = 1 MHz
V = 30 mV
osc RMS
T = 25 °C
j
V (V)
R
Page 4
Characteristics STPS30U100DJF
Figure 7. Forward voltage drop versus
forward current
I (A)
FM
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
T = 125 °C
j
(Maximum values)
T = 125 °C
j
(Typical values)
T = 25 °C
j
(Maximum values)
V (V)
FM
Figure 8. Thermal resistance, junction to
ambient, versus copper surface under tab
R (°C/W)
th(j-a)
250
200
150
100
50
0
012345678910
Epoxy printed circuit board FR4,
copper thickness = 35 µm
S (cm²)
cu
4/8 Doc ID 18121 Rev 3
Page 5
STPS30U100DJF Application information

2 Application information

It is mandatory to ensure a peak reverse voltage below the V
absolute rating. Therefore
RRM
ST recommends the use of an RC clamping snubber circuit in parallel with the STPS30U100DJF device.

Figure 9. Application schematic

R
DC/DC input
STPS30U100DJF
C
DC/DC output
Doc ID 18121 Rev 3 5/8
Page 6
Package information STPS30U100DJF

3 Package information

Epoxy meets UL94,V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. PowerFLAT 5x6 dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
D2
E2
K
b
e
A
A1
D
L
A2
A 0.80 1.00 0.031 0.039
A1 0.02 0.05 0.001 0.002
A2 0.25 0.010
b 0.30 0.50 0.012 0.020
D 5.20 0.205
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
D2 4.11 4.31 0.162 0.170
e 1.27 0.050
E
E 6.15 0.242
E2 3.50 3.70 0.138 0.146
L 0.50 0.80 0.020 0.031

Figure 10. Footprint (dimensions in mm)

6/8 Doc ID 18121 Rev 3
K 1.275 1.575 0.050 0.062
5.35
4.41
4.33
3.86
6.29
0.98
0.95
1.27
0.62
Page 7
STPS30U100DJF Ordering information

Figure 11. Tape and reel specifications

Dot identifying Pin A1 location
2.0
4.0
Ø 1.55
0.30
12.0
5.30
1.20
All dimensions are typical values in mm

4 Ordering information

0.20
6.30
8.0
User direction of unreeling
1.75
Ø 1.5
5.5
R 0.50

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STPS30U100DJF-TR PS30 U100 PowerFLAT 5x6 95 mg 3000 Tape and reel

5 Revision history

Table 7. Document revision history

Date Revision Changes
02-Nov-2010 1 First issue.
09-Dec-2010 2
20-May-2011 3
Added “maximum” to conduction loss calculation in
Section 1 on page 2.
Added reference E in Ta bl e 5 . Updated package graphics. Updated base quantity and marking in Ta b le 6 . Added
Figure 11.
Doc ID 18121 Rev 3 7/8
Page 8
STPS30U100DJF
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8/8 Doc ID 18121 Rev 3
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