Datasheet STPS30H60-Y Datasheet (ST)

Features

■ High junction temperature capability

■ Avalanche rated

■ Low leakage current

■ Good trade-off between leakage current and

forward voltage drop

■ High frequency operation

■ AEC-Q 101 qualified

STPS30H60-Y

Automotive power Schottky rectifier

Datasheet − production data

A1

K

A2

K

Description

Dual centre tab Schottky rectifier suited for high
frequency switch mode power supply.

Packaged in D
use in automotive applications. In these
applications this device provides a good margin
between the remaining voltage applied on the
diode and the voltage capability of the diode.

2

PAK, this device is designed for

A2

A1

D2PAK

STPS30H60CGY-TR

Table 1. Device summary

Symbol Value

I

F(AV)

V

RRM

T

j

V

F (typ)

2 X 15 A

60 V

175 °C

0.535 V

March 2012 Doc ID 022824 Rev 1 1/7

This is information on a product in full production.

www.st.com

7

Characteristics STPS30H60-Y

1 Characteristics

Table 2. Absolute ratings (limiting values per diode)

Symbol Parameter Value Unit

V

I

F(RMS)

I

F(AV)

I

P

T

1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal parameters

Repetitive peak reverse voltage 60 V

RRM

Forward rms current 30 A

Average forward current, δ = 0.5 Tc = 155 °C

Surge non repetitive forward current tp = 10 ms sinusoidal 230 A

FSM

Relative peak avalanche power Tj = 125 °C tp = 10 µs 715 W

ARM

Operating junction temperature range

T

j

Storage temperature range -65 to + 175 °C

stg

dPtot

dTj

<

Rth(j-a)

1

(1)

Per diode 15
Total package 30

-40 to + 175 °C

Symbol Parameter Value Unit

R

R

Table 4. Static electrical characteristics

Junction to case

th(j-c)

Coupling 0.1

th(c)

Per diode 1.5

°C/WTotal 0.8

Symbol Parameter Test conditions Min. Typ. Max. Unit

(1)

I

V

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: t

Reverse leakage current

R

(2)

Forward voltage drop

F

= 380 µs, δ < 2%

p

= 25 °C

T

j

= 125 °C 8 25

T

j

T

= 25 °C

j

= 125 °C 435 470

T

j

= 25 °C

T

j

= 125 °C 535 570

T

j

= 25 °C

T

j

= 125 °C 635 690

T

j

V

= V

R

I

= 7.5 A

F

I

= 15 A

F

I

= 30 A

F

RRM

60 µA

550

660

820

A

mA

mV

To evaluate the conduction losses use the following equation:
P = 0.45 x I

2/7 Doc ID 022824 Rev 1

+ 0.008 x I

F(AV)

F2(RMS)

STPS30H60-Y Characteristics

Figure 1. Conduction losses versus

average forward current

P (W)

F(AV)

12

10

8

6

4

2

0

0 2 4 6 8 10 12 14 16 18

δ=0.05

δ=0.1 δ=0.2

I (A)

F(AV)

δ

δ=0.5

T

=tp/T

Figure 3. Normalized avalanche power

derating versus pulse duration

P(tp)

ARM

P (1 µs)

ARM

1

0.1

0.01

0.001

0.10.01 1

10 100 1000

t (µs)

Figure 2. Average forward current versus

ambient temperature
(δ = 0.5, per diode)

I (A)

F(AV)

δ=1

tp

18

16

14

12

10

8

6

4

2

0

0 25 50 75 100 125 150 175

R

th(j-a)

=15 °C/W

T (°C)

amb

R

th(j-a)=Rth(j-c)

Figure 4. Relative variation of thermal

impedance junction to case versus
pulse duration

Z/R

th(j-c) th(j-c)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

p

0.0

1.E-03 1.E-02 1.E-01 1.E+00

t (s)

p

Figure 5. Reverse leakage current versus

reverse voltage applied
(typical values, per diode)

I (mA)

R

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03
0 5 10 15 20 25 30 35 40 45 50 55 60

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=50°C

Tj=25°C

V (V)

R

Doc ID 022824 Rev 1 3/7

Figure 6. Junction capacitance versus

reverse voltage applied
(typical values, per diode)

C(nF)

10.0

1.0

V (V)

0.1
1 10 100

R

V

osc

F=1MHz

=30mV

Tj=25°C

RMS

Characteristics STPS30H60-Y

Figure 7. Forward voltage drop versus

forward current (per diode)

I (A)

FM

100

TJ=125 °C

TJ=125 °C

Maximum values

Maximum values

TJ=125 °C

TJ=125 °C

Typical values

Typical values

10

1

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4

Maximum values

V (V)

FM

TJ=25 °C

Figure 8. Thermal resistance junction to

ambient versus copper surface
under tab

R (°C/W)

th(j-a)

80

epoxy printed board FR4, copper thickness = 35 µm

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

S(cm²)

4/7 Doc ID 022824 Rev 1

STPS30H60-Y Package information

m

D

2 Package information

● Epoxy meets UL94, V0

● Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 5. D

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

2

PAK dimensions

.

Dimensions

Ref.

Millimeters Inches

Min. Max Min. Max.

A 4.40 4.60 0.173 0.181

A

L2

E

C2

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

L

L3

G

A1

B2
B

C

R

A2

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

M

*

V2

* FLAT ZONE NO LESS THAN 2m

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

V2 0° 8° 0° 8°

Figure 9. Footprint (dimensions in millimeters)

16.90

10.30

8.90

Doc ID 022824 Rev 1 5/7

3.70

L 15.00 15.85 0.590 0.624

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

5.08

1.30

Ordering information STPS30H60-Y

3 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode

2

STPS30H60CGY-TR STPS30H60CGY-TR D

PAK 1.48 g 1000 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Changes

20-Mar-2012 1 First issue.

6/7 Doc ID 022824 Rev 1

STPS30H60-Y

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Doc ID 022824 Rev 1 7/7