Datasheet STPS30120DJF Datasheet (ST)

Page 1
Features
STPS30120DJF
Power Schottky rectifier
■ Very small conduction losses
■ Negligible switching losses
■ Low forward voltage drop
■ Low thermal resistance
■ High avalanche capability specified
■ ECOPACK
®
2 compliant component
Description
Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters.
Packaged in PowerFLAT™, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications.
A
A
K
A
PowerFLAT 5x6 STPS30120DJF

Table 1. Device summary

Symbol Value
K
K
A
TM: PowerFLAT is a trademark of STMicroelectronics
I
F(AV)
V
RRM
(max) 150 °C
T
j
V
(typ) 0.61 V
F
30 A
120 V
May 2011 Doc ID 15671 Rev 5 1/7
www.st.com
7
Page 2
Characteristics STPS30120DJF

1 Characteristics

Table 2. Absolute Ratings (limiting values, anode terminals short circuited)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
P
T
1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Symbol Parameter Value Unit
Repetitive peak reverse voltage 120 V
RRM
Forward rms current 45 A
Average forward current Tc = 80 °C, δ = 0.5 30 A
Surge non repetitive forward current tp = 10 ms sinusoidal 200 A
FSM
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 12500 W
ARM
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature
T
j
dPtot
dTj
<
Rth(j-a)
1
(1)
150 °C
R

Table 4. Static electrical characteristics (anode terminals short circuited)

Junction to case 2.5 °C/W
th(j-c)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Reverse leakage
(1)
I
R
current
(1)
V
Forward voltage drop
F
1. Pulse test: tp = 380 µs, δ < 2%
= 25 °C
T
j
= 125 °C 5.5 16 mA
T
j
= 25 °C
T
j
T
= 125 °C 0.61 0.67
j
= 25 °C
T
j
T
= 125 °C 0.68 0.75
j
= V
V
R
RRM
IF = 15 A
= 30 A
I
F
35 µA
0.84
0.92
To evaluate the conduction losses use the following equation: P = 0.61 x I
F(AV)
+ 0.005 I
F2(RMS)
V
2/7 Doc ID 15671 Rev 5
Page 3
STPS30120DJF Characteristics
Figure 1. Average forward power dissipation
versus average forward current
P
(W)
F(AV)
30.0
25.0
20.0
δ=0.05
15.0
10.0
5.0
0.0
0 5 10 15 20 25 30 35 40
δ=0.1
I
F(AV)
δ=0.2
(A)
δ=0.5 δ=1
=tp/T
δ
T
tp
Figure 3. Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
I
(A)
F(AV)
35
R
30
25
20
15
10
5
0
T
tp
=tp/T
δ
0 25 50 75 100 125 150
th(j-a)=Rth(j-c)
T
amb
(°C)
Figure 4. Normalized avalanche power
derating versus junction temperature
P
ARM (Tj)
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum values)
IM(A)
200
180
160
140
120
100
80
60
40
I
M
20
0
1.E-03 1.E-02 1.E-01 1.E+00
t
=0.5
δ
t(s)
Figure 6. Relative variation of thermal
impedance, junction to case, versus pulse duration
Z
th(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
Tc=25°C
Tc=75°C
Tc=125°C
Doc ID 15671 Rev 5 3/7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
tp(s)
Page 4
Characteristics STPS30120DJF
0
00
000
Figure 7. Reverse leakage current versus
reverse voltage applied (typical values)
IR(mA)
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
VR(V)
1.E-04
0 102030405060708090100110120
Figure 9. Forward voltage drop versus
forward current
IFM(A)
60
55
50
45
40
35
30
25
20
15
10
5
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125°C
(Typical values)
(Typical values)
Tj=25°C
(Maximum values)
VFM(V)
Figure 8. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
10000
V
F=1MHz
osc
Tj=25°C
=30mV
1000
VR(V)
100
11
1
Figure 10. Thermal resistance junction to
ambient versus copper surface under tab
R
(°C/W)
th(j-a)
250
Epoxy printed circuit board FR4,
200
150
100
50
0
012345678910
copper thickness = 35 µm
SCu(cm²)
RMS
1
4/7 Doc ID 15671 Rev 5
Page 5
STPS30120DJF Package information

2 Package information

● Epoxy meets UL94,V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. PowerFLAT 5x6 dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
D2
E2
K
b
e
A
A1
D
L
A2
A 0.80 1.00 0.031 0.039
A1 0.02 0.05 0.001 0.002
A2 0.25 0.010
b 0.30 0.50 0.012 0.020
D 5.20 0.205
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
D2 4.11 4.31 0.162 0.170
e 1.27 0.050
E
E 6.15 0.242
E2 3.50 3.70 0.138 0.146
L 0.50 0.80 0.020 0.031
K 1.275 1.575 0.050 0.062

Figure 11. Footprint (dimensions in mm)

5.35
4.41
4.33
3.86
6.29
0.98
0.95
1.27
Doc ID 15671 Rev 5 5/7
0.62
Page 6
Ordering Information STPS30120DJF

Figure 12. Tape and reel specifications

Dot identifying Pin A1 location
2.0
4.0
Ø 1.55
0.30
12.0
5.30
1.20
All dimensions are typical values in mm

3 Ordering Information

0.20
6.30
8.0
User direction of unreeling
1.75
Ø 1.5
5.5
R 0.50

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STPS30120DJF-TR PS30 120 PowerFLAT 5x6 0.095 g 3000 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Changes
18-May-2009 1 First issue.
09-Nov-2009 2 Updated Table 1.
25-Feb-2010 3 Corrected order code and marking in Ta b l e 6.
30-Jul-2010 4 Replace Power QFN with PowerFLAT.
20-May-2011 5
Updated package graphics. Added mention of terminals to captions of Ta b le 2 and Ta bl e 4 . Updated base quantity and marking in Ta bl e 6. Added Figure 12.
6/7 Doc ID 15671 Rev 5
Page 7
STPS30120DJF
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Doc ID 15671 Rev 5 7/7
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