Datasheet STPS2150 Datasheet (ST)

Features

■ Negligible switching losses

■ Low forward voltage drop for higher efficiency

and extented battery life

■ Low thermal resistance

■ Surface mount miniature package

■ Avalanche capability specified

Description

150 V power Schottky rectifiers are suited for
switch mode power supplies on up to 24 V rails
and high frequency converters.

Packaged in SMA, SMA low profile, and axial, this
device is intended for use in consumer and
computer applications like TV, STB, PC and DVD
where low drop forward voltage is required to
reduce power dissipation.

STPS2150

Power Schottky rectifier

A

K

SMA

(JEDEC DO-214AC)

STPS2150A

A

K

SMAflat

(JEDEC DO-221AC)

STPS2150AF

Table 1. Device summary

I

F(AV)

V

RRM

(max) 175 °C

T

j

(max) 0.67 V

V

F

A

K

DO-15

STPS2150

2 A

150 V

September 2008 Rev 6 1/9

www.st.com

9

Characteristics STPS2150

1 Characteristics

Table 2. Absolute Ratings (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(AV)

I

FSM

P

ARM

T

dPtot

---------------

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal resistance

Repetitive peak reverse voltage 150

Average forward current

Surge non repetitive forward
current

SMA, SMAflat T

DO-15 TL = 130 °C δ = 0.5

SMA, SMAflat

DO-15 150

= 145 °C δ = 0.5

L

tp = 10 ms sinusoidal

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400

Storage temperature range -65 to + 175 °C

stg

Maximum operating junction temperature

T

j

1

------------------ --------

<

Rth j a–()

(1)

2

75

175 °C

Symbol Parameter Value Unit

SMA, SMAflat 20

R

th(j-l)

Table 4. Static electrical characteristics

Junction to lead

Lead length = 10 mm DO-15 30

°C/W

Symbol Parameter Tests conditions Min. Typ Max. Unit

V

A

A

W

(1)

I

R

VF

1. tp = 5 ms, δ < 2%

2. t

p

Reverse leakage current

(2)

Forward voltage drop

= 380 µs, δ < 2%

To evaluate the conduction losses use the following equation: P = 0.59 x I

T

= 25 °C

j

T

= 125 °C 0.5 1.5 mA

j

= V

V

R

RRM

Tj = 25 °C

= 2 A

I

T

= 125 °C 0.62 0.67

j

T

= 25 °C

j

= 125 °C 0.70 0.75

T

j

F

I

= 4 A

F

0.5 1.5 µA

0.78 0.82

0.86 0.89

+ 0.04 I

F(AV)

V

F2(RMS)

2/9

STPS2150 Characteristics

Figure 1. Average forward power

dissipation versus average
forward current

P (W)

F(AV)

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2

δ = 0.05

δ = 0.1

I (A)

F(AV)

δ = 0.2

δ = 0.5

=tp/T

δ

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

δ = 1

T

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)

I (A)

F(AV)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

tp

0.2

0.0

R

=100°C/W

th(j-a)

T

tp

=tp/T

δ

0 25 50 75 100 125 150 175

R

=200°C/W

th(j-a)

T (°C)

amb

R

th(j-a)=Rth(j-l)

Figure 4. Normalized avalanche power

derating versus junction
temperature

P(T)

ARM j

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

SMA / SMAflat

DO-15

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values, DO-15)

I (A)

M

10

9

8

7

6

5

4

3

2

I

M

1

0

1.E-03 1.E-02 1.E-01 1.E+00

t

=0.5

δ

t(s)

DO-15

Ta=25°C

Ta=75°C

Ta=125°C

Figure 6. Non repetitive surge peak forward

current versus overload duration
(maximum values, SMA)

I (A)

M

10

9

8

7

6

5

4

3

2

I

M

1

0

1.E-03 1.E-02 1.E-01 1.E+00

t

=0.5

δ

t(s)

3/9

SMA

Ta=25°C

Ta=75°C

Ta=125°C

Characteristics STPS2150

Figure 7. Non repetitive surge peak forward

current versus overload duration
(maximum values, SMAflat)

I(A)

M

6

5

4

3

2

I

M

1

0

1.E-03 1.E-02 1.E-01 1.E+00

t

δ

=0.5

t(s)

SMAflat

Ta=25°C

Ta=75°C

Ta=125°C

Figure 9. Relative variation of thermal

impedance junction to ambient
versus pulse duration (SMA)

Z/R

th(j-a) th(j-a)

1.0

SMA

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

Figure 11. Reverse leakage current versus

reverse voltage applied
(typical values)

I (µA)

R

1.E+04

T=150°C

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

0 25 50 75 100 125 150

j

T=125°C

j

T=100°C

j

T=75°C

j

T=50°C

j

T=25°C

j

V (V)

R

Figure 8. Relative variation of thermal

impedance junction to ambient
versus pulse duration (DO-15)

Z/R

th(j-a) th(j-a)

1.0

DO-15

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

Figure 10. Relative variation of thermal

impedance junction to ambient
versus pulse duration (SMAflat)

Z/R

th(j-a) th(j-a)

1.0

SMAflat

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

Figure 12. Junction capacitance versus

reverse voltage applied
(typical values)

C(pF)

1000

100

V (V)

10

1 10 100 1000

R

F=1MHz

V =30mV

OSC RMS

T=25°C

j

4/9

STPS2150 Characteristics

Figure 13. Forward voltage drop versus

forward current (maximum values,
low level)

I (A)

FM

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2

Tj=125°C

Tj=125°C

(Maximum values)

(Maximum values)

(Typical values)

(Typical values)

Tj=125°C

Tj=125°C

V (V)

FM

Tj=25°C

(Maximum values)

Figure 15. Thermal resistance junction to

ambient versus copper surface
under each lead - epoxy printed
circuit board FR4, copper
thickness = 35 µm (SMA)

R (°C/W)

th(j-a)

140

120

100

80

60

40

20

0

012345

S (cm²)

Cu

SMA

Figure 14. Forward voltage drop versus

forward current (maximum values,
high level)

I (A)

FM

100

T=125°C

j

(typical values)

10

1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8

(maximum values)

V (V)

FM

T=125°C

j

T=25°C

j

(maximum values)

Figure 16. Thermal resistance junction to

ambient versus copper surface
under each lead - epoxy printed
circuit board FR4, copper
thickness = 35 µm (SMAflat)

R (°C/W)

th(j-a)

200

180

160

140

120

100

80

60

40

20

0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0

S (cm²)

Cu

SMAflat

Figure 17. Thermal resistance versus lead length (DO-15)

R (°C/W)

th

120

R

100

80

60

40

20

0

5 10152025

th(j-a)

R

th(j-I)

L (mm)

leads

5/9

Package information STPS2150

2 Package information

● Epoxy meets UL94, V0.

®

In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.

Table 5. SMA package dimensions

Dimensions

E1

D

REF.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

E

A1

C

L

A2

Figure 18. SMA footprint dimensions in

millimeters (inches)

1.4

(0.055) (0.055)

2.63

(0.103)

5.43

(0.214)

1.4

1.64

(0.064)

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

b

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

Figure 19. Marking information

Cathode bar (

unidirectional

e3

x x x

y w w

z

devices only )

e3: ECOPACK ( Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week

6/9

STPS2150 Package information

Table 6. SMAflat dimensions

Dimensions

A

c

D

L 2x

L1 2x

E

E1

L

L2 2x

b

Figure 20. SMAflat footprint dimensions

optimized for SMAflat

5.52

(0.217)

1.20

(0.047)

3.12

(0.123)

millimeters

(inches)

1.20

(0.047)

1.52

(0.060)

(1)

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.90 1.10 0.035 0.043

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.95 0.088 0.116

E 4.80 5.60 0.189 0.220

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

L1 0.50 0.019

L2 0.50 0.019

Figure 21. Marking information

Cathode bar (

x x x

y w w

z

unidirectional

e3

devices only )

e3: ECOPACK ( Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week

1. SMA footprint may also be used.

Table 7. DO-15 package dimensions

A

D

B

7/9

Dimensions

CC

REF.

Millimeters Inches

Min. Max. Min. Max.

A 6.05 6.75 0.238 0.266

B 2.95 3.53 0.116 0.139

C 26 31 1.024 1.220

D 0.71 0.88 0.028 0.035

Ordering information STPS2150

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS2150A 2150 SMA 0.068 g 5000 Tape and reel

STPS2150 STPS2150 DO-15 0.4 g 2000 Ammopack

STPS2150RL STPS2150 DO-15 0.4 g 5000 Tape and reel

STPS2150AF F2150 SMAflat 0.035 g 1000 Tape and reel

4 Revision history

Table 9. Document revision history

Date Revision Description of changes

Jul-2003 3A Last update.

Aug-2004 4

31-May-2006 5

18-Sep-2008 6

SMA package dimensions update. Reference A1 max. changed
from 2.70mm (0.106) to 2.03mm (0.080).

Reformatted to current standard. Added ECOPACK statement.
Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10.

Reformatted to current standard. Added SMAflat package. Removed
IF(RMS) from Tabl e 2 .

8/9

STPS2150

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED,
AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS,
NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR
SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2008 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

9/9