Datasheet STPS20H100C Datasheet (ST)

Page 1
STPS20H100C
100 V power Schottky rectifier
Features
■ Negligible switching losses
■ High junction temperature capability
■ Good trade off between leakage current and
■ Low leakage current
■ Avalanche rated
■ Insulated package: TO-220FPAB
– Insulating voltage = 2000 V DC – Capacitance = 45 pF
■ Avalanche capability specified
Description
Dual center tap Schottky rectifier designed for high frequency miniature switched mode power supplies such as adaptators and on board DC/DC converters.
A1
A2
A2
K
A1
TO-220AB
STPS20H100CT
STPS20H100CFP
STPS20H100CT-H
A2
K
A1
2
PAK
I
STPS20H100CR
STPS20H100CR-H
j

Table 1. Device summary

K
A2
K
A1
TO-220FPAB
K
A2
A1
D2PAK
STPS20H100CG
Symbol Value
I
F(AV)
V
RRM
T
(max) 175 °C
j
(max) 0.64 V
V
F
2 x 10 A
100 V
September 2011 Doc ID 5386 Rev 7 1/11
www.st.com
11
Page 2
Characteristics STPS20H100C

1 Characteristics

Table 2. Absolute ratings (limiting values, per diode)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
I
I
P
T
Repetitive peak reverse voltage 100 V
RRM
Forward rms current 30 A
TO-220AB
Average forward current δ = 0.5
2
PAK / I2PA K
D
TO-220FPAB T
Surge non repetitive forward current tp = 10 ms sinusoidal 250 A
FSM
Repetitive peak reverse current tp = 2 µs square F= 1 kHz 1 A
RRM
Non repetitive peak reverse current tp = 100 µs square 3 A
RSM
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 10800 W
ARM
Storage temperature range -65 to + 175 °C
stg
T
j
Maximum operating junction temperature
T
= 160 °C Per diode 10
c
= 145 °C Per device 20
c
(1)
175 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
<
Rth(j-a)
1
dPtot
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj

Table 3. Thermal resistance

Symbol Parameter Value Unit
2
TO-220AB / D
PAK / I 2PAK Per diode 1.6
°C/W
TO-220FPAB Per diode 4
th(j-c)
Junction to case
TO-220AB / D2PA K / I2PAK Total 0.9
R
°C/W
TO-220FPAB Total 3.2
TO-220AB / D2PA K / I2PAK Coupling 0.15
R
th(c)
TO-220FPAB Coupling 2.5
°C/W
A
When the diodes 1 and 2 are used simultaneously:
ΔTj(diode 1) = P(diode1) x R
2/11 Doc ID 5386 Rev 7
(Per diode) + P(diode 2) x R
th(j-c)
th(c)
Page 3
STPS20H100C Characteristics

Table 4. Static electrical characteristics (per diode)

Symbol Parameter Test conditions Min. Typ. Max. Unit
= 25 °C
T
Reverse leakage
(1)
I
R
current
(2)
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
Forward voltage drop
F
j
T
= 125 °C 2 6 mA
j
= 25 °C IF = 8 A 0.71
T
j
T
= 25 °C IF = 10 A 0.77
j
T
= 25 °C IF = 16 A 0.81
j
= 25 °C IF = 20 A 0.88
T
j
= 125 °C IF = 8 A 0.56 0.58
T
j
T
= 125 °C IF = 10 A 0.59 0.64
j
= 125 °C IF = 16 A 0.65 0.68
T
j
= 125 °C IF = 20 A 0.67 0.73
T
j
= V
V
R
RRM
To evaluate the conduction losses use the following equation: P = 0.55 x I
F(AV)
+ 0.009 I
F2(RMS)
4.5 µA
V
Doc ID 5386 Rev 7 3/11
Page 4
Characteristics STPS20H100C
Figure 1. Average forward power dissipation
versus average forward current (per diode)
P (W)
F(AV)
8
δ = 0.05
6
4
2
0
024681012
δ = 0.1
I (A)
F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1µs)
ARM
1
Figure 2. Average forward current versus
ambient temperature (δ = 0.5, per diode)
I (A)
F(AV)
12
R=R
10
R =15°C/W
th(j-a)
th(j-a) th(j-c)
8
R =40°C/W
th(j-a)
TO-220AB
TO-220FPAB
6
4
T
2
=tp/T
δ
0
0 25 50 75 100 125 150 175
tp
T (°C)
amb
Figure 4. Normalized avalanche power
derating versus junction temperature
P(T)
ARM j
P (25 °C)
ARM
1.2
1
0.1
0.01
t (µs)
0.001
0.10.01 1
10 100
p
1000
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum values, per diode)
I (A)
M
200
180
160
140
120
100
80
60
I
M
40
20
0
1E-3 1E-2 1E-1 1E+0
t
δ
=0.5
TO-220AB, D PAK, I PAK
t(s)
22
T =50°C
C
T =75°C
C
T =125°C
C
0.8
0.6
0.4
0.2
T (°C)
0
25 50 75 100 125
j
Figure 6. Non repetitive surge peak forward
current versus overload duration (maximum values, per diode)
I (A)
M
140
120
100
80
60
40
I
M
20
0 1E-3 1E-2 1E-1 1E+0
t
δ
=0.5
t(s)
TO-220FPAB
T =50°C
j
T =75°C
j
T =125°C
j
150
4/11 Doc ID 5386 Rev 7
Page 5
STPS20H100C Characteristics
Figure 7. Relative variation of thermal
impedance junction to case versus pulse duration (per diode)
Z/R
th(j-c) th(j-c)
1.0
TO-220AB, D PAK, I PAK
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
Single pulse
0.0 1E-3 1E-2 1E-1 1E+0
22
t (s)
p
δ
=t /T
T
p
Figure 9. Reverse leakage current versus
reverse voltage applied (typical values, per diode)
I (µA)
R
1E+4
T =150°C
1E+3
1E+2
1E+1
j
T =125°C
j
T =100°C
j
Figure 8. Relative variation of thermal
impedance junction to case versus pulse duration (per diode)
Z/R
th(j-c) th(j-c)
1.0
TO-220FPAB
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
Single pulse
tp
0.0 1E-2 1E-1 1E+0 1E+1
t (s)
p
Figure 10. Junction capacitance versus
reverse voltage applied (typical values, per diode)
C(pF)
1000
500
δ
=tp/T
T
F=1MHz
V =30mV
OSC RMS
T =25°C
j
tp
1E+0
T =25°C
1E-1
1E-2
0 102030405060708090100
j
V (V)
R
Figure 11. Forward voltage drop versus
forward current (maximum values, per diode)
I (A)
FM
100.0
T =150°C
j
(typical values)
10.0
T =125°C
j
(typical values)
1.0
V (V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2
FM
T =25°C
j
T =125°C
j
200
V (V)
100
1 2 5 10 20 50 100
R
Figure 12. Thermal resistance junction to
ambient versus copper surface under tab
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
S(Cu)(cm²)
Doc ID 5386 Rev 7 5/11
Page 6
Package information STPS20H100C

2 Package information

● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
● Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.

Table 5. TO-220AB dimensions

Dimensions
L2
F2
F1
F
G1
H2
Dia
G
L5
L9
L6
L4
Ref
A 4.40 4.60 0.173 0.181
A
C
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
L7
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
M
E
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
Millimeters Inches
Min. Max. Min. Max.
6/11 Doc ID 5386 Rev 7
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
Page 7
STPS20H100C Package information

Table 6. TO-220FPAB dimensions

Dimensions
Ref
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181
A
H
B
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
Dia
L6
L2
L3
L5
F1
L4
F2
D
L7
F 0.75 1 0.30 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 typ. 0.63 typ.
G1
F
E
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
G
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3 3.20 0.118 0.126
Doc ID 5386 Rev 7 7/11
Page 8
Package information STPS20H100C
m
D

Table 7. D2PAK dimensions

Dimensions
Ref
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A
L2
E
C2
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
L
L3
G
A1
B2
B
C
R
A2
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
M
*
V2
* FLAT ZONE NO LESS THAN 2m
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°

Figure 13. Footprint (dimensions in millimeters)

16.90
10.30
8.90
3.70
5.08
1.30
8/11 Doc ID 5386 Rev 7
Page 9
STPS20H100C Package information
Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory.

Table 8. I2PAK dimensions

Dimensions
L2
Ref.
Millimeters Inches
Min. Max. Min. Max.
A
E
c2
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
D
b1 1.14 1.70 0.044 0.067
c 0.49 0.70 0.019 0.028
L1
L
b1
A1
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
b
e
e1
c
E 10 10.40 0.394 0.409
L 13 14 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
Doc ID 5386 Rev 7 9/11
Page 10
Ordering information STPS20H100C

3 Ordering information

Table 9. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STPS20H100CT STPS20H100CT TO-220AB 2.20 g 50 Tube
STPS20H100CT-H STPS20H100CT TO-220AB 2.20 g 50 Tube
STPS20H100CFP STPS20H100CFP TO-220FPAB 2.0 g 50 Tube
STPS20H100CR STPS20H100CR I
STPS20H100CR-H STPS20H100CR I
STPS20H100CG STPS20H100CG D
STPS20H100CG-TR STPS20H100CG D
2
PAK 1.49 g 50 Tube
2
PAK 1.49 g 50 Tube
2
PAK 1.48 g 50 Tube
2
PAK 1.48 g 1000 Tape and reel

4 Revision history

Table 10. Document revision history

Date Revision Changes
Jul-2003 4G Previous release.
21-Mar-2007 5 Removed ISOWATT package.
Reformatted cover page to current standards - no
10-Sep-2007 6
technical changes. Updated dimensions A1, b, b1, c, c2, L, and L1 in Ta b le 8 .
22-Sep-2011 7 Updated Table 8.
10/11 Doc ID 5386 Rev 7
Page 11
STPS20H100C
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 5386 Rev 7 11/11
Loading...