Page 1
®
STPS20150CT/CG/CR/CFP
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
V
RRM
T
j
V
(max) 0.75 V
F
2x10A
150 V
175°C
FEATURES AND BENEFITS
HIGH JUNCTION TEMPERATURE CAPABILITY
■
GOOD TRADE OFF BETWEEN LEAKAGE
■
CURRENT AND FORWARD VOLTAGE DROP
LOW LEAKAGE CURRENT
■
■ AVALANCHE CAPABILITY SPECIFIED
DESCRIPTION
Dual center tap schottky rectifier designed for
high frequency Switched Mode Power
Supplies.
A1
A2
K
A2
A1
D2PAK
STPS20150CG
A1
TO-220AB
STPS20150CT
K
K
A2
K
A1
I2PAK
STPS20150CR
A1
A2
K
A2
K
TO-220FPAB
STPS20150CFP
ABSOLUTE RATINGS (limiting values, per diode)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
Repetitive peak reverse voltage 150 V
RMS forward current 30 A
Average forward current
δ = 0.5
TO-220AB
D2PAK/I2PAK
Tc = 155°C Per diode 10 A
TO-220FPAB Tc = 135°C Per device 20
P
I
FSM
ARM
T
T
Surge non repetitive forward current tp = 10 ms sinusoidal 180 A
Repetitive peak avalanche power tp = 1µs Tj = 25°C 6700 W
Storage temperature range - 65 to + 175 °C
stg
Maximum operating junction temperature 175 °C
j
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
July 2003 - Ed: 6D
1/7
Page 2
STPS20150CT/CG/CR/CFP
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th(j-c)
R
th(c)
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x R
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol Parameter Tests conditions Min. Typ. Max. Unit
I
R
V
F
Pulse test : * tp=5ms,δ <2%
To evaluate the conduction losses use the following equation:
P=0.64xI
Junction to case TO-220AB / D2PAK/I2PAK Per diode 2.2 °C/W
TO-220FPAB 4.5
TO-220AB / D
2
PAK/I2PAK Total 1.3
TO-220FPAB 3.5
TO-220AB / D2PAK/I2PAK Coupling 0.3
TO-220FPAB 2.5
(Per diode) + P(diode 2) x R
th(j-c)
* Reverse leakage current Tj = 25°C VR=V
th(c)
RRM
5.0 µA
Tj = 125°C 5.0 mA
** Forwardvoltage drop Tj = 25° CI
Tj = 125°C I
Tj=25°CI
Tj = 125°C I
** tp = 380 µs, δ <2%
+ 0.011 I
F(AV)
F2(RMS)
= 10 A 0.92 V
F
= 10 A 0.69 0.75
F
=20A 1
F
= 20 A 0.79 0.86
F
2/7
Page 3
STPS20150CT/CG/CR/CFP
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
P (W)
F(AV)
10
9
8
7
6
5
4
3
2
1
0
01234567891 01 11 2
δ = 0.05
δ = 0.1
I (A)
F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Fig. 3: Normalized avalanche power derating versus pulse duration.
P( t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.1 0.01 1
p
10 100 1000
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5, per diode).
I (A)
F(AV)
12
11
10
9
8
7
6
5
4
3
2
1
0
0 25 50 75 100 125 150 175
δ
T
=tp/T
R =15°C/W
th(j-a)
tp
R =R (TO-220AB, I PAK and D PAK)
th(j-a) th(j-c)
R =R (TO-220FPAB)
th(j-a) th(j-c)
T (°C)
amb
22
Fig. 4: Normalized avalanche power derating
versus junction temperature.
P( t )
ARM p
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
0 25 50 75 100 125 150
T (°C)
j
Fig. 5-1: Non repetitive surge peak forward cur-
rent versus overload duration (maximumvalues,
per diode). TO-220AB, I²PAK and D²PAK
I (A)
M
150
125
100
75
50
IM
25
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
22
TO-220AB, I PAK and D PAK
T =50°C
C
T =75°C
C
T =125°C
C
Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximumvalues,
per diode). TO-220FPAB
I (A)
M
100
90
80
70
60
50
40
30
IM
20
10
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
TO-220FPAB
T =50°C
C
T =75°C
C
T =125°C
C
3/7
Page 4
STPS20150CT/CG/CR/CFP
Fig. 6-1: Relative variation of thermal impedance
junction to case versus pulse duration.TO-220AB,
I²PAK and D²PAK
Z/ R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
δ = 0.1
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
22
TO-220AB, I PAK and D PAK
t (s)
p
δ
=tp/T
T
tp
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
I (µA)
R
1E+5
1E+4
1E+3
1E+2
1E+1
T=175°C
j
T=150°C
j
T=125°C
j
T=100°C
j
Fig. 6-2: Relative variation of thermal impedance
junction to case versus pulse duration.
TO-220FPAB
Z/ R
th(j-c) th(j-c)
1.0
TO-220FPAB
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.2
0.1
Single pulse
0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
t (s)
p
δ
=tp/T
T
tp
Fig. 8: Junction capacitance versus reverse voltage
applied (typical values, per diode).
C(nF)
1000
100
F=1MHz
T=25°C
j
1E+0
1E-1
0 25 50 75 100 125 150
T=25°C
j
V (V)
R
Fig. 8: Forward voltage drop versus forward
current (per diode).
I (A)
FM
100.0
T=125°C
j
(typical values)
10.0
T=125°C
j
T=25°C
1.0
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
4/7
j
V (V)
FM
V (V)
10
1 2 5 10 20 50 100 200
R
Fig. 9: Thermalresistancejunction to ambient versus
coppersurfaceundertab (Epoxy printed circuit board,
Cu = 35µm) (STPS20150CG only).
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
S(cm²)
Page 5
PACKAGE MECHANICAL DATA
2
PAK
D
E
L2
L
L3
A1
B2
B
G
2.0 MIN.
FLAT ZONE
C2
STPS20150CT/CG/CR/CFP
DIMENSIONS
REF.
A
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
D
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.049 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
C
R
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
A2
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
V2
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 0° 8° 0° 8°
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30
8.90
3.70
5.08
1.30
5/7
Page 6
STPS20150CT/CG/CR/CFP
PACKAGE MECHANICAL DATA
TO-220AB
H2
Dia
L5
L6
L2
F2
F1
F
G1
G
L9
L4
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
C
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
L7
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
M
E
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
PACKAGE MECHANICAL DATA
2
PAK
I
E
L2
L1
b2
L
b1
b
e
c2
D
A1
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
b 0.70 0.93 0.028 0.037
b1 1.14 1.17 0.044 0.046
b2 1.14 1.17 0.044 0.046
c 0.45 0.60 0.018 0.024
c2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
E 10.0 10.4 0.394 0.409
L 13.1 13.6 0.516 0.535
L1 3.48 3.78 0.137 0.149
c
L2 1.27 1.40 0.050 0.055
6/7
Page 7
PACKAGE MECHANICAL DATA
TO-220FPAB
H
L6
L2
L3
L5
D
L4
G1
G
F1
F2
F
Dia
STPS20150CT/CG/CR/CFP
DIMENSIONS
A
B
REF.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
L7
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
E
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
Millimeters Inches
Min. Max. Min. Max.
OTHER INFORMATION
Ordering type Marking Package Weight Base qty
Delivery
mode
STPS20150CT STPS20150CT TO-220AB 2.20 g 50 Tube
STPS20150CG STPS20150CG D
STPS20150CG-TR STPS20150CG D
STPS20150CR STPS20150CR I
2
PAK 1.48 g 50 Tube
2
PAK 1.48 g 1000 Tape & Reel
2
PAK 1.49 g 50 Tube
STPS20150CFP STPS20150CFP TO-220FPAB 2.0 g 50 Tube
■
EPOXY MEETS UL94,V0
Informationfurnished isbelievedto beaccurateand reliable.However,STMicroelectronics assumesno responsibility forthe consequences of
useof suchinformation nor forany infringement ofpatents or otherrights ofthird parties whichmay result fromits use. Nolicense isgranted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change withoutnotice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval ofSTMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
7/7