
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
V
RRM
VF(max) 0.7V
Tj (max) 175°C
FEATURES
Negligible switching losses
■
Low forward voltage drop
■
Low capacitance
■
High reverse avalanche surge capability
■
2 x 10A
100V
STPS20100CT
A1
K
A2
A2
K
A1
DESCRIPTION
High voltage dual Schottky rectifier suited for
switchmode power supplies and other power
TO-220AB
STP20100CT
converters. Packaged in TO-220AB, this device
is intended for use in medium voltage operation,
and particularly, in high frequency circuitries
where low switching losses and low noise are
required.
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
Repetitive peak reverse voltage 100 V
RMS forward current
Average forward current δ = 0.5 Tc=110°C
VR= 60V
Surge non repetitive forward current tp=10ms
Per diode 30 A
Per diode
Per device
10
20
Per diode 200 A
sinusoidal
I
RRM
Repetitive peak reverse current tp=2µs
Per diode 1 A
F=1KHz
I
RSM
Non repetitive peak reverse current tp=100µs
Per diode 1 A
A
A
*:
Tstg
Tj
dV/dt
dPtot
Storage temperature range
Maximum junction temperature (*)
Critical rate of rise of reverse voltage
<
dTj Rth j a
August 2002 - Ed:2C
-65to+175 °C
175 °C
1000 V/µs
thermal runaway condition for a diode on its own heatsink
−1()
1/4

STPS20100CT
THERMAL RESISTANCES
Symbol Parameter Value Unit
Rth (j-c) Junction to case
Per diode
Total
1.6
0.9
Rth (c) Coupling 0.15
When the diodes 1 and 2 are used simultaneously :
Tj-Tc(diode 1)=P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
ELECTRICAL CHARACTERISTICS (Per diode)
STATIC CHARACTERISTICS
Symbol Parameter Test Conditions Min. Typ. Max. Unit
* Reverse leakage current VR=V
I
R
RRM
Tj = 25°C 150 µA
Tj = 125°C 100 mA
** Forward voltage drop IF = 20A Tj = 125°C 0.85 V
V
F
IF = 10A Tj = 125°C 0.60 0.70
IF = 20A Tj = 25°C 0.95
Pulse test : * tp = 5 ms, duty cycle<2%
** tp = 380 µs, duty cycle<2%
°C/W
°C/W
To evaluate the conduction losses use the following equation :
P=0.55xI
Fig. 1 : Average forward power dissipation versus
average forward current. (Per diode)
P
F(av)(W)
12
11
10
9
8
7
6
5
4
3
2
1
0
0123456789101112131415
F(AV)
=0.05
+ 0.015 x I
=0.1
I
F(av)(A)
F2(RMS)
=0.2
=0.5
=tp/T
Fig. 2 : Average current versus ambient
temperature. (duty cycle : 0.5) (Per diode)
I
F(av)(A)
12
=1
T
tp
10
8
6
4
2
0
0 25 50 75 100 125
=0.5
=tp/T
Rth(j-a)=Rth(j-c)
Rth(j-a)=15 C/W
T
tp
Tamb( C)
o
o
2/4

STPS20100CT
Fig. 3 : Non repetitive surge peak forward current
versus overload duration.
(Maximum values) (Per diode)
I
M(A)
180
160
140
120
100
80
60
IM
40
20
0
0.001 0.01 0.1 1
t
=0.5
t(s)
o
Tc=25 C
o
Tc=50 C
o
Tc=110 C
Fig. 5 : Reverse leakage current versus reverse
voltage applied. (Typical values) (Per diode)
I
50.000
10.000
R(mA)
o
Tj=125 C
Fig. 4 : Relative variation of thermal transient
impedancejunctiontocase versus pulseduration.
Fig. 6 : Junction capacitance versus reverse
voltage applied. (Typical values) (Per diode)
C(pF)
2000
1000
o
Tj=125 C
F=1MHz
1.000
0.100
0.010
0.001
0 102030405060708090100
o
Tj=100 C
o
Tj=75 C
o
Tj=50 C
V
R(V)
Fig. 7 : Forward voltage drop versus forward
current. (Maximum values) (Per diode)
V
FM(V)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1 1 10 100
o
Tj=125 C
I
FM(A)
V
100
110100
R(V)
3/4

STPS20100CT
PACKAGE MECHANICAL DATA
TO-220AB (JEDEC outline)
OPTIONAL
H2
A
C
REF.
Millimeters Inches
DIMENSIONS
Min. Max. Min. Max.
L5
Dia
L6
L7
A 4.30 4.60 0.169 0.181
C 1.22 1.32 0.048 0.052
D 2.40 2.72 0.094 0.107
E 0.33 0.70 0.013 0.028
F 0.61 0.93 0.024 0.037
L2
F1 1.14 1.70 0.045 0.067
F2 1.14 1.70 0.045 0.067
G 4.95 5.15 0.195 0.202
L9
F2
F1(x2)
D
L4
G1 2.40 2.70 0.094 0.106
H2 10.00 10.40 0.394 0.409
L2 16.00 Typ. 0.630Typ.
L4 13.00 14.00 0.512 0.551
L5 2.65 2.95 0.104 0.116
M
F
G1
G
E
L6 14.80 15.75 0.583 0.620
L7 6.20 6.60 0.244 0.260
L9 3.40 3.94 0.134 0.155
M 2.60 Typ. 0.102 Typ.
Dia. 3.75 3.89 0.148 0.153
Ordering type Marking Package Weight Base qty
Delivery
mode
STPS20100CT STPS20100CT TO-220AB 2.23g 50 Tube
■
Cooling method : by conduction (C)
■
Recommended torque value : 0.55N.m.
■
Maximum torque value : 0.7N.m.
■
Epoxy meets UL94,V0
Informationfurnished isbelieved tobe accurateand reliable.However, STMicroelectronicsassumes noresponsibility forthe consequencesof
useof suchinformation norfor anyinfringement ofpatents orother rightsof thirdparties whichmay resultfrom itsuse. Nolicense isgranted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change withoutnotice. This publication supersedesand replaces all informationpreviously supplied.
STMicroelectronics products are notauthorized for use as critical components inlife support devices or systems withoutexpress written approval ofSTMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
4/4