Datasheet STPS1L40 Datasheet (ST)

Features

■ Very small conduction losses

■ Negligible switching losses

■ Low forward voltage drop

■ Surface mount miniature packages

■ Avalanche capability specified

Description

STPS1L40

Low drop power Schottky rectifier

A

K

SMA

(JEDEC DO-214AC)

STPS1L40A

K

SMB

(JEDEC DO-214AA)

STPS1L40U

A

Single chip Schottky rectifiers suited to switched
mode power supplies and high frequency DC to
DC converters.

Packaged in SMA, SMB and STmite flat this
device is especially intended for surface mounting
and used in low voltage, high frequency inverters,
free wheeling and polarity protection applications.

A

K

STmite flat

STPS1L40MF

Table 1. Device summary

Symbol Value

I

F(AV)

V

RRM

(max) 150 °C

T

j

(max) 0.42 V

V

F

1 A

40 V

June 2009 Doc ID 5507 Rev 6 1/11

www.st.com

11

Characteristics STPS1L40

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

Repetitive peak reverse voltage 40 V

RRM

SMA / SMB 8

I

F(RMS)

I

F(AV)

I

I

I

P

T

Forward rms current

STmite flat 2

Average forward current

SMA / SMB T

STmite flat T

Surge non repetitive forward current tp = 10 ms sinusoidal 60 A

FSM

Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A

RRM

Non repetitive peak reverse current tp = 100 µs square 1 A

RSM

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 900 W

ARM

Storage temperature range - 65 to + 150 °C

stg

Maximum operating junction temperature

T

j

= 130 °C δ = 0.5

L

= 135 °C δ = 0.5

C

(1)

1A

150 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

<

Rth(j-a)

1

dPtot

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal resistance

Symbol Parameter Value Unit

SMA 30

R

R

Table 4. Static electrical characteristics

th(j-l)

th(j-c)

Junction to lead

Junction to case

SMB 25

STmite flat 20

°C/W

A

Symbol Parameter Tests conditions Min. Typ. Max. Unit

T

= 25 °C

(1)

I

Reverse leakage current

R

(1)

V

1. Pulse test: tp = 380 µs, δ < 2%

Forward voltage drop

F

j

= 125 °C - 6 10 mA

T

j

= 25 °C

T

j

T

= 125 °C - 0.37 0.42

j

= 25 °C

T

j

T

= 125 °C - 0.5 0.61

j

V

I

F

I

F

To evaluate the conduction losses use the following equation:
P = 0.23 x I

2/11 Doc ID 5507 Rev 6

F(AV)

+ 0.19 I

F2(RMS)

= V

R

= 1 A

= 2 A

- - 35 µA

RRM

--0.5

V

- - 0.63

STPS1L40 Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P

(W)

F(AV)

0.8

0.7

δ = 0.05

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

δ = 0.1

δ = 0.2

I

F(AV)

(A)

δ = 0.5

δ = 1

δ = tp/T

T

t

p

Figure 3. Average forward current versus

ambient temperature (SMB, δ = 0.5)

I

(A)

F(AV)

1.2

R

= R

th(j-a)

R

th(j-a)

th(j-l)

= 100 °C/W

T

1.0

0.8

0.6

0.4

0.2

0.0

T

δ = tp/T

0 25 50 75 100 125 150

t

p

amb

SMB

(°C)

Figure 2. Average forward current versus

ambient temperature (SMA, δ = 0.5)

I

(A)

F(AV)

1.2

R

= R

th(j-a)

1.0

0.8

0.6

0.4

0.2

0.0

T

δ = tp/T

0 25 50 75 100 125

t

p

R

th(j-a)

th(j-l)

= 120 °C/W

T

amb

SMA

(°C)

Figure 4. Average forward current versus

ambient temperature
(STmite flat, δ = 0.5)

I

(A)

F(AV)

1.2

R

= R

th(j-a)

1.0

0.8

0.6

0.4

0.2

δ = tp/T

0.0

0 25 50 75 100 125

R

= 250 °C/W

th(j-a)

T

t

p

th(j-c)

T

amb

STmite flat

(°C)

150

150

Figure 5. Normalized avalanche power

derating versus pulse duration

P(tp)

ARM

P (1 µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 6. Normalized avalanche power

derating versus junction
temperature

P(Tj)

ARM

P (25 °C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

Doc ID 5507 Rev 6 3/11

T (°C)

j

Characteristics STPS1L40

Figure 7. Non repetitive surge peak forward

current versus overload duration
(maximum values, SMA)

IM(A)

7

6

5

4

3

2

I

M

1

0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00

δ = 0.5

t

t(s)

SMA

Ta= 25 °C

Ta= 75 °C

Ta= 125 °C

Figure 9. Non repetitive surge peak forward

current versus overload duration
(maximum values, STmite flat)

IM(A)

16

14

12

10

8

6

4

I

M

2

0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00

δ = 0.5

t

t(s)

STmite flat

Tc= 25 °C

Tc= 75 °C

Tc= 125 °C

Figure 8. Non repetitive surge peak forward

current versus overload duration
(maximum values, SMB)

IM(A)

7

6

5

4

3

2

I

M

1

0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00

δ

= 0.5

t

SMB

Ta= 25 °C

Ta= 75 °C

Ta= 125 °C

Figure 10. Relative variation of thermal

impedance junction to ambient
versus pulse duration (SMA)

Z

th(j-a)/Rth(j-a)

1.0
SMA

0.9

Epoxy printed circuit board,

0.8

copper thickness = 35 µm,
recommended pad layout

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tp(s)

Figure 11. Relative variation of thermal

Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)

Z

th(j-a)/Rth(j-a)

1.0
SMB

0.9

Epoxy printed circuit board,

0.8

copper thickness = 35 µm,
recommended pad layout

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tp(s)

4/11 Doc ID 5507 Rev 6

Z

th(j-a)/Rth(j-a)

1.0

STmite flat

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

impedance junction to ambient
versus pulse duration (STmite flat)

Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout

Single pulse

tp(s)

STPS1L40 Characteristics

Figure 13. Reverse leakage current versus

reverse voltage applied
(typical values)

IR(mA)

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03
0 5 10 15 20 25 30 35 40

Tj= 150 °C

Tj= 125 °C

Tj= 100 °C

Tj= 75 °C

Tj= 50 °C

Tj= 25 °C

VR(V)

Figure 15. Forward voltage drop versus

forward current
(typical values, high level)

IFM(A)

10.00

1.00

0.10

Tj= 125 °C

Tj= 25 °C

Figure 14. Junction capacitance versus

reverse voltage applied
(typical values)

C(pF)

1000

100

10

1 10 100

VR(V)

V

osc

F = 1 MHz

= 30 mV

Tj= 25 °C

Figure 16. Forward voltage drop versus

forward current
(typical values, low level)

IFM(A)

3.0

2.5

2.0

1.5

1.0

Tj= 125 °C

Tj= 25 °C

RMS

0.01

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

VFM(V)

0.5

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

VFM(V)

Doc ID 5507 Rev 6 5/11

Characteristics STPS1L40

R

th(j-a)

ambient versus copper surface
under each lead (SMA)

(°C/W)

Epoxy printed circuit board, FR4
copper thickness = 35 µm

Scu(cm²)

SMA

Figure 18. Thermal resistance junction to

ambient versus copper surface
under each lead (SMB)

R

(°C/W)

th(j-a)

120

100

80

60

40

20

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board, FR4
copper thickness = 35 µm

SMB

Scu(cm²)

Figure 17. Thermal resistance junction to

140

120

100

80

60

40

20

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat)

R

(°C/W)

th(j-a)

250

225

200

175

150

125

100

75

50

25

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board, FR4
copper thickness = 35 µm

STmite flat

Scu(cm²)

6/11 Doc ID 5507 Rev 6

STPS1L40 Package information

2 Package information

● Epoxy meets UL94, V0

● Cathode band (SMA, SMB)

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 5. SMA dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

Ref.

E1

Millimeters Inches

Min. Max. Min. Max.

D

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

Figure 20. Footprint, dimensions in mm (inches)

1.4

(0.055) (0.055)

2.63

(0.103)

1.4

1.64

(0.064)

5.43

(0.214)

Doc ID 5507 Rev 6 7/11

Package information STPS1L40

Table 6. SMB dimensions

Dimensions

E1

D

Ref.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

L 0.75 1.50 0.030 0.059

Figure 21. Footprint, dimensions in mm (inches)

1.62

2.60

(0.064) (0.102)

5.84

(0.300)

1.62

(0.064)

Millimeters Inches

Min. Max. Min. Max.

2.18

(0.086)

8/11 Doc ID 5507 Rev 6

STPS1L40 Package information

Table 7. STmite flat dimensions

Dimensions

E1

D

E

c

L

b

L3

Figure 22. Footprint dimensions

0.85 0.63 2.00

(0.033) (0.079)

(.025) (.026)

0.65

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

L1

L2

A 0.80 0.85 0.95 0.031 0.033 0.037

b 0.40 0.55 0.65 0.016 0.022 0.026

b2 0.70 0.85 1.00 0.027 0.033 0.039

b2

c 0.10 0.15 0.25 0.004 0.006 0.009

D 1.75 1.90 2.05 0.069 0.075 0.081

E 3.60 3.80 3.90 0.142 0.150 0.154

A

E1 2.80 2.95 3.10 0.110 0.116 0.122

L 0.50 0.55 0.80 0.020 0.022 0.031

L1 2.10 2.40 2.60 0.083 0.094 0.102

L2 0.45 0.60 0.75 0.018 0.024 0.030

L3 0.20 0.35 0.50 0.008 0.014 0.020

0.65

0.95

(0.037) (0.077)(0.026)

1.95

4.13

(0.163)

millimeters

(inches)

Doc ID 5507 Rev 6 9/11

Ordering information STPS1L40

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS1L40A GB4 SMA 0.068 g 5000 Tape and reel

STPS1L40U GC4 SMB 0.107 g 2500 Tape and reel

STPS1L40MF F1L4 STmite flat 0.016 g 1200 Tape and reel

4 Revision history

Table 9. Document revision history

Date Revision Changes

Jul-2003 4A Last update.

Aug-2004 5

24-Jun-2009 6 Added STmite flat package.

SMA package dimensions update. Reference A1 max.
changed from 2.70 mm (0.106 inch.) to 2.03 mm (0.080).

10/11 Doc ID 5507 Rev 6

STPS1L40

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