Datasheet STPS16170C Datasheet (ST)

STPS16170C

High voltage power Schottky rectifier

Main product characteristics

I

F(AV)

V

RRM

T

j

(typ) 0.70 V

V

F

2 x 8 A

170 V

175° C

Features and benefits

■ High junction temperature capability

■ Good trade-off between leakage current and

forward voltage drop

■ Low leakage current

■ Avalanche capability specified

Description

Dual centre tab Schottky rectifier designed for
high frequency switch mode power supplies.

A1

A2

A2

K

A1

TO-220AB

STPS16170CT

K

A2

A1

DPAK

STPS16170CB

K

A2

K

A1

2

I

PAK

STPS16170CR

K

A2

A1

D2PAK

STPS16170CG

Order codes

Part Number Marking

STPS16170CT STPS16170CT

STPS16170CG STPS16170CG

STPS16170CG-TR STPS16170CG

STPS16170CR STPS16170CR

STPS16170CB-TR PS16170CB

STPS16170CB PS16170CB

July 2006 Rev 1 1/10

www.st.com

Characteristics STPS16170C

1 Characteristics

Table 1. Absolute ratings (limiting values per diode, T

= 25° C unless otherwise specified)

amb

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

Repetitive peak reverse voltage 170 V

RMS forward current 20 A

Average forward current, δ = 0.5 Tc = 150° C Per diode 8

I

F(AV)

I

FSM

P

ARM

T

Total package

Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A

Releative peak avalanche power Tj = 25° C

Storage temperature range -65 to + 175 °C

stg

T

Maximum operating junction temperature

j

(1)

tp = 1µs

16

4700 W

175 °C

dV/dt Critical rate of rise of reverse voltage 10 000 V/µs

dP

1. thermal runaway condition for a diode on its own heatsink

tot

j

1

--------------------------<
R

th j a–()

--------------­dT

Table 2. Thermal parameters

Symbol Parameter Value Unit

Per diode 3

R

th(j-c)

R

th(c)

Table 3. Static electrical characteristics

Junction to case

°C/WTo ta l 1 .8

Coupling 0.6

A

Symbol Parameter Test conditions Min. Typ Max. Unit

(1)

I

R

V

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: t

Reverse leakage current

(2)

Forward voltage drop

F

= 380 µs, δ < 2 %

p

Tj = 25° C

VR = V

= 8 A

I

F

= 16 A

I

F

RRM

= 125° C 15 mA

T

j

= 25° C

T

j

T

= 125° C 0.70 0.75

j

= 25° C

T

j

Tj = 125° C 0.8 0.86

15 µA

0.92

1

To evaluate the conduction losses use the following equation:
P = 0.64 x I

2/10

+ 0.014 x I

F(AV)

F2(RMS)

V

STPS16170C Characteristics

Figure 1. Conduction losses versus average

forward current (per diode)

P

(W)

F(AV)

8

7

6

5

4

3

2

1

0

012345678910

δ=0.05

I

F(AV)

δ=0.2

δ=0.1

(A)

δ=0.5

δ

=tp/T

δ=1

T

tp

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM

p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 2. Average forward current versus

ambient temperature (δ = 0.5, per
diode)

I (A)

F(av)

9

8

Rth(j-a)=Rth(j-c)

7

6
5

Rth(j-a)=15°C/W

4

3
2

1
0

T

T

(°C)

δ

=tp/T

tp

amb

0 25 50 75 100 125 150 175

Figure 4. Normalized avalanche power

derating versus junction
temperature

P(t)

ARM

p

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values, per diode)

IM(A)

120

100

80

60

40

I

M

20

0

1.E-03 1.E-02 1.E-01 1.E+00

t

δ

=0.5

t(s)

TC=50°C

TC=75°C

TC=125°C

Figure 6. Relative variation of thermal

impedance junction to case versus
pulse duration

Z

th(j-c)/Rth(j-c)

1.0

Single pulse

TO-220AB

DPAK
I²PAK

D²PAK

0.1

1.E-03 1.E-02 1.E-01 1.E+00

3/10

tp(s)

Characteristics STPS16170C

Figure 7. Reverse leakage current versus

reverse voltage applied (typical
values, per diode)

IR(µA)

1.E+05

1.E+04

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

0 25 50 75 100 125 150 175

Tj=175°C

Tj=150°C

Tj=125°C

Tj=75°C

Tj=25°C

VR(V)

Figure 9. Forward voltage drop versus

forward current (per diode)

IFM(A)

100.0

90.0

80.0

70.0

60.0

50.0

40.0

30.0

20.0

10.0

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8

Tj=125°C

Tj=125°C

(Maximum values)

(Maximum values)

Tj=125°C

Tj=125°C

(Typical values)

(Typical values)

Tj=25°C

(Maximum values)

VFM(V)

Figure 11. Thermal resistance junction to

ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm - D

R

(°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

SCU(cm²)

2

PAK)

D²PAK

Figure 8. Junction capacitance versus

reverse voltage applied (typical
values, per diode)

C(pF)

1000

100

10

1 10 100 1000

VR(V)

V

OSC

F=1MHz

=30mV

Tj=25°C

RMS

Figure 10. Thermal resistance junction to

ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm - DPAK)

R

(°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

SCU(cm²)

DPAK

4/10

STPS16170C Package information

2 Package information

Epoxy meets UL94, V0

Table 4. T0-220AB dimensions

Dimensions

L2

F2

F1

F

G1

H2

Dia

G

L5

L9

L6

L4

Ref.

Millimeters Inches

Min. Max. Min. Max.

A

C

A 4.40 4.60 0.173 0.181

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

L7

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

F2 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

D

G1 2.40 2.70 0.094 0.106

H2 10 10.40 0.393 0.409

L2 16.4 typ. 0.645 typ.

L4 13 14 0.511 0.551

M

E

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. 3.75 3.85 0.147 0.151

5/10

Package information STPS16170C

Table 5. I2PAK dimensions

Dimensions

L2

Ref.

Millimeters Inches

Min. Max. Min. Max.

A

E

c2

A 4.40 4.60 0.173 0.181

A1 2.40 2.72 0.094 0.107

b 0.61 0.88 0.024 0.035

b1 1.14 1.70 0.044 0.067

D

c 0.49 0.70 0.019 0.028

c2 1.23 1.32 0.048 0.052

L1

L

b1

A1

D 8.95 9.35 0.352 0.368

e 2.40 2.70 0.094 0.106

e1 4.95 5.15 0.195 0.203

E 10 10.40 0.394 0.409

b

e

e1

c

L 13 14 0.512 0.551

L1 3.50 3.93 0.138 0.155

L2 1.27 1.40 0.050 0.055

6/10

STPS16170C Package information

Table 6. DPAK dimensions

Dimensions

E

B2

L2

H

L4

B

G

A2

0.60 MIN.

R

A1

V2

A

C2

D

R

C

Figure 12. DPAK footprint (dimensions in mm)

Ref.

Millimeters Inches

Min. Max Min. Max.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

6.7

6.7 3 3

1.6

2.3

2.3

1.6

7/10

Package information STPS16170C

Table 7. D

L2

L

L3

2

PAK dimensions

E

A1

B2

B

G

* FLAT ZONE NO LESSTHAN 2mm

Dimensions

Ref.

Millimeters Inches

Min. Max Min. Max.

A 4.40 4.60 0.173 0.181

A

C2

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

D

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

C

R

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

A2

M

*

V2

L 15.00 15.85 0.590 0.624

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 13. D2PAK footprint (dimensions in mm)

16.90

10.30

8.90

3.70

5.08

1.30

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

8/10

STPS16170C Ordering information

3 Ordering information

Part Number Marking Package Weight Base qty Delivery mode

STPS16170CT STPS16170CT TO-220ABB 2.23 g 50 Tube

STPS16170CG STPS16170CG D2PAK 1.48 g 50 Tube

STPS16170CG-TR STPS16170CG D

STPS16170CR STPS16170CR I

2

PAK 1.48 g 1000 Tape and reel

2

PAK 1.49 g 50 Tube

STPS16170CB-TR PS16170CB DPAK 0.3 g 2500 Tape and reel

STPS16170CB PS16170CB DPAK 0.3 g 75 Tube

4 Revision history

Date Revision Description of Changes

13-Jul-2006 1 First issue

9/10

STPS16170C

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