Datasheet STPS16150CT, STPS16150CG Datasheet (SGS Thomson Microelectronics)

Page 1
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
RRM
Tj 175°C
V
(max) 0.75 V
F
FEATURES AND BENEFITS
HIGH JUNCTION TEMPERATURE CAPABILITY
GOOD TRADE OFF BETWEEN LEAKAGE
CURRENT AND FORWARD VOLTAGE DROP LOW LEAKAGE CURRENT
AVALANCHE CAPABILITY SPECIFIED
DESCRIPTION
Dual center tap schottky rectifier designed for high frequency Switched Mode Power Supplies.
2x8A
150 V
STPS16150CT/CG/CR
A1
K
A2
I2PAK
STPS16150CR
K
A2
A1
2
D
PAK
STPS16150CG
TO-220AB
STPS16150CT
A1
A1
A2
K
A2
K
ABSOLUTE RATINGS (limiting values, per diode)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
T
Repetitive peak reverse voltage 150 V RMS forward current 20 A Average forward current
δ = 0.5
TO-220AB D2PAK/I2PAK
Tc = 150°C per diode
per device Surge non repetitive forward current tp = 10 ms sinusoidal 150 A Repetitive peak avalanche power tp = 1µs Tj = 25°C 4700 W Storage temperature range - 65 to + 175 °C
stg
8
16
Tj Maximum operating junction temperature 175 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
July 2003 - Ed: 6C
A
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Page 2
STPS16150CT/CG/CR
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th (j-c)
R
th (c)
When the diodes 1 and 2 are used simultaneously :
Tj(diode 1) = P(diode1) x R
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol Parameter Tests conditions Min. Typ. Max. Unit
I
R
V
F
Pulse test : * tp=5ms,δ<2%
To evaluate the conduction losses use the following equation: P=0.64xI
Fig. 1: Average forward power dissipation versus average forward current (per diode).
Junction to case TO-220AB / D2PAK/I2PAK Per diode 3 °C/W
Total 1.8
TO-220AB / D2PAK/I2PAK Coupling 0.6
(Per diode) + P(diode 2) x R
th(j-c)
* Reverse leakage current Tj = 25°C VR=V
th(c)
RRM
3.0 µA
Tj = 125°C 4.0 mA
** Forwardvoltage drop Tj = 25°CI
Tj = 125°C I Tj=25°CI Tj = 125°C I
** tp = 380 µs, δ <2%
+ 0.014 I
F(AV)
F2(RMS)
= 8 A 0.92 V
F
= 8 A 0.70 0.75
F
=16A 1
F
= 16 A 0.8 0.86
F
Fig. 2: Average forward current versus ambient temperature (δ = 0.5, per diode).
PF(av)(W)
8 7 6 5
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
4 3
δ
=tp/T
T
tp
2 1 0
012345678910
IF(av) (A)
Fig. 3: Normalized avalanche power derating
versus pulse duration.
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
IF(av)(A)
9 8 7 6 5 4 3 2 1 0
0 25 50 75 100 125 150 175
δ
=tp/T
T
tp
Rth(j-a)=15°C/W
Tamb(°C)
Rth(j-a)=Rth(j-c)
Fig. 4: Normalized avalanche power derating versus junction temperature.
P(t)
ARM p
P (25°C)
ARM
1.2 1
0.8
0.6
0.4
0.2 0
0 25 50 75 100 125 150
T (°C)
j
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Page 3
STPS16150CT/CG/CR
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values, per diode).
IM(A)
120 100
80 60 40
IM
20
0 1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Tc=50°C
Tc=75°C
Tc=125°C
Fig. 7: Reverse leakage current versus reverse voltage applied (typical values, per diode).
IR(µA)
1E+5 1E+4 1E+3 1E+2 1E+1
Tj=175°C
Tj=150°C
Tj=125°C
Tj=75°C
Fig. 46 Relative variation of thermal impedance junction to case versus pulse duration (per diode).
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.5
0.6
δ = 0.2
0.4
δ = 0.1
0.2
Single pulse
0.0 1E-3 1E-2 1E-1 1E+0
tp(s)
δ
=tp/T
T
tp
Fig. 8: Junction capacitance versus reverse voltage applied (typical values, per diode).
C(pF)
1000
100
F=1MHz
Tj=25°C
1E+0
VR(V)
1E-1
0 25 50 75 100 125 150
Tj=25°C
Fig. 9: Forward voltage drop versus forward current (maximum values, per diode).
IFM(A)
100.0
10.0
1.0
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Tj=125°C
Tj=125°C
Typical values
Tj=25°C
VFM(V)
VR(V)
10
1 2 5 10 20 50 100 200
Fig. 10: Thermal resistance junction to ambient ver­sus copper surface under tab (Epoxy printed circuit board,copperthckness: 35µm) (STPS16150CGonly).
Rth(j-a) (°C/W)
80 70 60 50 40 30 20 10
0
0 2 4 6 8 101214161820
S(cm²)
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Page 4
STPS16150CT/CG/CR
PACKAGE MECHANICAL DATA
TO-220AB
H2
Dia
L5
L6
L2
F2 F1
F
G1
G
L9
L4
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
C
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
L7
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551
M
E
L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
PACKAGE MECHANICAL DATA
2
PAK
I
E
L2
L1
b2
L
b1
b
e
c2
D
A1
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046
c 0.45 0.60 0.018 0.024
c2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
E 10.0 10.4 0.394 0.409
L 13.1 13.6 0.516 0.535 L1 3.48 3.78 0.137 0.149
c
L2 1.27 1.40 0.050 0.055
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Page 5
PACKAGE MECHANICAL DATA
2
PAK
D
E
L2
L
L3
A1
B2 B
G
2.0 MIN. FLAT ZONE
C2
STPS16150CT/CG/CR
DIMENSIONS
A
A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
REF.
D
B 0.70 0.93 0.027 0.037 B2 1.25 1.40 0.049 0.055
C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054
C
R
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
A2
L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069
V2
R 0.40 0.016
V2
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30
3.70
8.90
5.08
1.30
Ordering type Marking Package Weight Base qty Delivery mode
STPS16150CT STPS16150CT TO-220AB 2.2 g 50 Tube
STPS16150CG STPS16150CG D
STPS16150CG-TR STPS16150CG D
STPS16150CR STPS16150CR I
Epoxy meets UL94, V0
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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2
PAK 1.48 g 50 Tube
2
PAK 1.48 g 1000 Tape & reel
2
PAK 1.49 g 50 Tube
http://www.st.com
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