Page 1
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
V
RRM
Tj 175°C
V
(max) 0.75 V
F
FEATURES AND BENEFITS
HIGH JUNCTION TEMPERATURE CAPABILITY
■
GOOD TRADE OFF BETWEEN LEAKAGE
■
CURRENT AND FORWARD VOLTAGE DROP
LOW LEAKAGE CURRENT
■
■ AVALANCHE CAPABILITY SPECIFIED
DESCRIPTION
Dual center tap schottky rectifier designed for
high frequency Switched Mode Power
Supplies.
2x8A
150 V
STPS16150CT/CG/CR
A1
K
A2
I2PAK
STPS16150CR
K
A2
A1
2
D
PAK
STPS16150CG
TO-220AB
STPS16150CT
A1
A1
A2
K
A2
K
ABSOLUTE RATINGS (limiting values, per diode)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
T
Repetitive peak reverse voltage 150 V
RMS forward current 20 A
Average forward current
δ = 0.5
TO-220AB
D2PAK/I2PAK
Tc = 150°C per diode
per device
Surge non repetitive forward current tp = 10 ms sinusoidal 150 A
Repetitive peak avalanche power tp = 1µs Tj = 25°C 4700 W
Storage temperature range - 65 to + 175 °C
stg
8
16
Tj Maximum operating junction temperature 175 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
July 2003 - Ed: 6C
A
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STPS16150CT/CG/CR
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th (j-c)
R
th (c)
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x R
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol Parameter Tests conditions Min. Typ. Max. Unit
I
R
V
F
Pulse test : * tp=5ms,δ <2%
To evaluate the conduction losses use the following equation:
P=0.64xI
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
Junction to case TO-220AB / D2PAK/I2PAK Per diode 3 °C/W
Total 1.8
TO-220AB / D2PAK/I2PAK Coupling 0.6
(Per diode) + P(diode 2) x R
th(j-c)
* Reverse leakage current Tj = 25°C VR=V
th(c)
RRM
3.0 µA
Tj = 125°C 4.0 mA
** Forwardvoltage drop Tj = 25° CI
Tj = 125°C I
Tj=25°CI
Tj = 125°C I
** tp = 380 µs, δ <2%
+ 0.014 I
F(AV)
F2(RMS)
= 8 A 0.92 V
F
= 8 A 0.70 0.75
F
=16A 1
F
= 16 A 0.8 0.86
F
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5, per diode).
PF(av)(W)
8
7
6
5
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
4
3
δ
=tp/T
T
tp
2
1
0
01234567891 0
IF(av) (A)
Fig. 3: Normalized avalanche power derating
versus pulse duration.
P( t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.1 0.01 1
p
10 100 1000
IF(av)(A)
9
8
7
6
5
4
3
2
1
0
0 25 50 75 100 125 150 175
δ
=tp/T
T
tp
Rth(j-a)=15°C/W
Tamb(°C)
Rth(j-a)=Rth(j-c)
Fig. 4: Normalized avalanche power derating
versus junction temperature.
P( t )
ARM p
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
0 25 50 75 100 125 150
T (°C)
j
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Page 3
STPS16150CT/CG/CR
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
IM(A)
120
100
80
60
40
IM
20
0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Tc=50°C
Tc=75°C
Tc=125°C
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
IR(µA)
1E+5
1E+4
1E+3
1E+2
1E+1
Tj=175°C
Tj=150°C
Tj=125°C
Tj=75°C
Fig. 46 Relative variation of thermal impedance
junction to case versus pulse duration (per diode).
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.5
0.6
δ = 0.2
0.4
δ = 0.1
0.2
Single pulse
0.0
1E-3 1E-2 1E-1 1E+0
tp(s)
δ
=tp/T
T
tp
Fig. 8: Junction capacitance versus reverse voltage
applied (typical values, per diode).
C(pF)
1000
100
F=1MHz
Tj=25°C
1E+0
VR(V)
1E-1
0 25 50 75 100 125 150
Tj=25°C
Fig. 9: Forward voltage drop versus forward
current (maximum values, per diode).
IFM(A)
100.0
10.0
1.0
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Tj=125°C
Tj=125°C
Typical values
Tj=25°C
VFM(V)
VR(V)
10
1 2 5 10 20 50 100 200
Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit
board,copperthckness: 35µm) (STPS16150CGonly).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0 2 4 6 8 1 01 21 41 61 82 0
S(cm²)
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Page 4
STPS16150CT/CG/CR
PACKAGE MECHANICAL DATA
TO-220AB
H2
Dia
L5
L6
L2
F2
F1
F
G1
G
L9
L4
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
C
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
L7
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
M
E
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
PACKAGE MECHANICAL DATA
2
PAK
I
E
L2
L1
b2
L
b1
b
e
c2
D
A1
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
b 0.70 0.93 0.028 0.037
b1 1.14 1.17 0.044 0.046
b2 1.14 1.17 0.044 0.046
c 0.45 0.60 0.018 0.024
c2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
E 10.0 10.4 0.394 0.409
L 13.1 13.6 0.516 0.535
L1 3.48 3.78 0.137 0.149
c
L2 1.27 1.40 0.050 0.055
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Page 5
PACKAGE MECHANICAL DATA
2
PAK
D
E
L2
L
L3
A1
B2
B
G
2.0 MIN.
FLAT ZONE
C2
STPS16150CT/CG/CR
DIMENSIONS
A
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
REF.
D
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.049 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
C
R
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
A2
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
V2
R 0.40 0.016
V2 0° 8° 0° 8°
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30
3.70
8.90
5.08
1.30
Ordering type Marking Package Weight Base qty Delivery mode
STPS16150CT STPS16150CT TO-220AB 2.2 g 50 Tube
STPS16150CG STPS16150CG D
STPS16150CG-TR STPS16150CG D
STPS16150CR STPS16150CR I
■
Epoxy meets UL94, V0
Informationfurnished isbelievedto beaccurateand reliable.However, STMicroelectronics assumesno responsibility forthe consequences of
useof suchinformation nor forany infringement ofpatents or otherrights ofthird parties whichmay result fromits use. Nolicense isgranted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change withoutnotice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval ofSTMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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2
PAK 1.48 g 50 Tube
2
PAK 1.48 g 1000 Tape & reel
2
PAK 1.49 g 50 Tube
http://www.st.com
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