Datasheet STPS160 Datasheet (ST)

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Page 1

Features

STPS160

Power Schottky rectifier

■ Very small conduction losses

■ Negligible switching losses

■ Low forward voltage drop

■ Surface mount miniature packages

■ Avalanche capability specified

Description

Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters.

Packaged in SMA and SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications.

SMA

(JEDEC DO-214AC)

STPS160A

Table 1. Device summary

Symbol Value

F(AV)

RRM

j (max)

F (max)

(JEDEC DO-214AA)

SMB

STPS160U

1 A

60 V

150 °C

0.57 V

March 2010 Doc ID 4608 Rev 9 1/9

www.st.com

Page 2

Characteristics STPS160

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

F(AV)

Repetitive peak reverse voltage 60 V

RRM

Average forward current TL = 130 °C δ = 0.5 1 A

Surge non repetitive forward current tp =10 ms sinusoidal 75 A

FSM

Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A

RRM

Non repetitive peak reverse current tp = 100 µs square 1 A

RSM

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W

ARM

Storage temperature range - 65 to + 150 °C

stg

Maximum operating junction temperature

(1)

150 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

Rth(j-a)

dPtot

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal resistance

Symbol Parameter Value Unit

SMA 30

th(j-l)

Junction to lead

SMB 23

°C/W

Table 4. Static electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

(1)

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

(2)

Forward voltage drop

= 25 °C

= 125 °C 1.1 4 mA

= 25 °C

= 125 °C 0.49 0.57

= 25 °C

= 125 °C 0.58 0.65

= 1 A

= 2 A

= V

RRM

4µA

0.67

0.8

To evaluate the conduction losses use the following equation:

P = 0.49 x I

2/9 Doc ID 4608 Rev 9

F(AV)

+ 0.08 I

F2(RMS)

Page 3

STPS160 Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P (W)

F(AV)

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2

δ = 0.05

δ = 0.1

I (A)

F(AV)

δ = 0.2

δ = 0.5

=tp/T

δ = 1

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

0.1

0.01

t (µs)

0.001

0.10.01 1

10 100 1000

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)

I (A)

F(AV)

1.2

R=R

1.0

0.8

0.6

0.4

0.2

0.0 0 25 50 75 100 125 150

=tp/T

SMA R =100°C/W

th(j-a)

S =1.5cm

(CU)

SMB R =80°C/W S =1.5cm

T (°C)

amb

th(j-a) th(j-I)

th(j-a)

(CU)

Figure 4. Normalized avalanche power

derating versus junction temperature

P(t)

ARM p

P (25°C)

ARM

1.2

0.8

0.6

0.4

0.2

25 50 75 100 125 150

T (°C)

Figure 5. Non repetitive surge peak forward

current versus overload duration (maximum values) (SMA)

I (A)

1E-3 1E-2 1E-1 1E+0

δ=0.5

t(s)

T =25°C

T =50°C

T =100°C

Doc ID 4608 Rev 9 3/9

Figure 6. Non repetitive surge peak forward

current versus overload duration (maximum values) (SMB)

I (A)

1E-3 1E-2 1E-1 1E+0

δ=0.5

t(s)

T =25°C

T =50°C

T =100°C

Page 4

Characteristics STPS160

Figure 7. Relative variation of thermal

impedance junction to ambient versus pulse duration (SMA)

Z/R

th(j-c) th(j-c)

1.0

epoxy printed circuit board, e = 35 µm

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

recommended pad layout

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

1E-2 1E-1 1E+0 1E+1 1E+2

(Cu)

t (s)

=tp/T

Figure 9. Reverse leakage current versus

reverse voltage applied (typical values)

I (µA)

1E+3

T=105°C

1E+2

1E+1

T=75°C

Figure 8. Relative variation of thermal

impedance junction to ambient versus pulse duration (SMB)

Z/R

th(j-c) th(j-c)

1.0

epoxy printed circuit board, e = 35 µm

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

recommended pad layout

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

1E-2 1E-1 1E+0 1E+1 1E+2 1E+3

(Cu)

t (s)

=tp/T

Figure 10. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

200

F=1MHz

100

T=25°C

1E+0

1E-1

0 5 10 15 20 25 30 35 40 45 50 55 60

T=25°C

V (V)

Figure 11. Forward voltage drop versus

forward current (maximum values)

I (A)

1E+1

T=125°C

1E+0

1E-1

1E-2

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6

V (V)

T=25°C

V (V)

1 2 5 10 20 50 100

Figure 12. Thermal resistance junction to

ambient versus copper surface under each lead (SMA)

R (°C/W)

th(j-a)

140

120

100

012345

S(Cu)(cm²)

Epoxy printed circuit board Fr4

copper thickness: 35 µm

4/9 Doc ID 4608 Rev 9

Page 5

STPS160 Characteristics

Figure 13. Thermal resistance junction to ambient versus copper surface under

each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMB)

R (°C/W)

th(j-a)

100

012345

S(Cu)(cm²)

Doc ID 4608 Rev 9 5/9

Page 6

Package information STPS160

2 Package information

● Epoxy meets UL94, V0

● Band indicates cathode

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. SMA dimensions

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

Figure 14. Footprint, dimensions in mm (inches)

1.4

(0.055) (0.055)

2.63

(0.103)

1.4

5.43

(0.214)

6/9 Doc ID 4608 Rev 9

1.64

(0.064)

Page 7

STPS160 Package information

Table 6. SMB dimensions

Dimensions

Ref.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

L 0.75 1.50 0.030 0.059

Figure 15. Footprint, dimensions in mm (inches)

1.62

2.60

(0.064) (0.102)

1.62

(0.064)

5.84

(0.300)

Millimeters Inches

Min. Max. Min. Max.

2.18

(0.086)

Doc ID 4608 Rev 9 7/9

Page 8

Ordering information STPS160

3 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS160A GA6 SMA 0.068 g 5000 Tape and reel

STPS160U E16 SMB 0.107 g 2500 Tape and reel

4 Revision history

Table 8. Document revision history

Date Revision Changes

Jul-2003 6A Last update.

Aug-2004 7

SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc).

Reformatted to current standards. I

16-Feb-2007 8

18-Mar-2010 9 Updated package illustration on page 1.

Package dimensions and footprints updated. Ecopack statement added.

F(RMS)

removed from Tabl e 2 .

8/9 Doc ID 4608 Rev 9

Page 9

STPS160

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Doc ID 4608 Rev 9 9/9