Datasheet STPS15L30CDJF Datasheet (ST)

Features

STPS15L30CDJF

Low drop power Schottky rectifier

■ Very small conduction losses

■ Negligible switching losses

■ Extremely fast switching

■ Low forward voltage drop

■ Low thermal resistance

■ High avalanche capability specified

Description

Dual center tap Schottky rectifier suited for switch
mode power supply and high frequency DC to DC
converters.

Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency
inverters, free-wheeling and polarity protection
applications.

A1

A2

K

A2

A1

PowerFLAT 5x6

STPS15L30CDJF

Table 1. Device summary

K

K

A1

A2

Symbol Value

TM: PowerFLAT is a trademark of STMicroelectronics

I

F(AV)

V

RRM

(max) 150 °C

T

j

(typ) 0.34 V

V

F

2 x 7.5 A

30 V

May 2011 Doc ID 15664 Rev 4 1/7

www.st.com

7

Characteristics STPS15L30CDJF

1 Characteristics

Table 2. Absolute ratings (limiting values, per diode)

Symbol Parameter Value Unit

V

I

F(RMS)

I

F(AV)

I

I

P

T

1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Symbol Parameter Value Unit

Repetitive peak reverse voltage 30 V

RRM

Forward rms current 10 A

Average forward current δ = 0.5 Tc = 140 °C

Surge non repetitive forward current tp = 10 ms sinusoidal 75 A

FSM

Peak repetitive reverse current tp = 2 µs square F= 1 kHz 1 A

RRM

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2800 W

ARM

Storage temperature range -65 to + 175 °C

stg

Maximum operating junction temperature

T

j

dPtot

dTj

<

Rth(j-a)

1

(1)

Per diode 7.5

Per device 15

A

150 °C

R

R

Junction to case

th(j-c)

Coupling 0.7

th(c)

°C/WTotal 1.6

When diodes 1 and 2 are used simultaneously:

Per diode 2.5

Δ T

(diode 1) = P(diode1) x R

j

Table 4. Static electrical characteristics (per diode)

(per diode) + P(diode 2) x R

th(j-c)

th(c)

Symbol Parameter Test conditions Min. Typ. Max. Unit

Reverse leakage

(1)

I

R

current

(1)

V

Forward voltage drop

F

1. Pulse test: tp = 380 µs, δ < 2%

= 25 °C

T

j

T

= 125 °C - 70 140 mA

j

= 25 °C IF = 7.5 A - - 0.48

T

j

T

= 125 °C IF = 7.5 A - 0.34 0.39

j

T

= 25 °C IF = 15 A - - 0.57

j

= 125 °C IF = 15 A - 0.44 0.51

T

j

= V

V

R

RRM

--1mA

To evaluate the conduction losses use the following equation:
P = 0.27 x I

F(AV)

+ 0.016 I

F2(RMS)

V

2/7 Doc ID 15664 Rev 4

STPS15L30CDJF Characteristics

Figure 1. Average forward power dissipation

versus average forward current
(per diode)

P

(W)

F(AV)

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

012345678910

δ=0.05

δ=0.1

δ=0.2

I

F(AV)

(A)

δ=0.5

δ

=tp/T

δ=1

T

tp

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 2. Average forward current versus

ambient temperature
(δ = 0.5, per diode)

I

(A)

F(AV)

9

8

7

6

5

4

3

2

1

0

T

T

(°C)

tp

=tp/T

δ

0 25 50 75 100 125 150

amb

Figure 4. Normalized avalanche power

derating versus junction
temperature

P

ARM (Tj)

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values, per diode)

IM(A)

120

110

100

90

80

70

60

50

40

30

I

M

20

10

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

Figure 6. Relative variation of thermal

impedance, junction to case,
versus pulse duration

Z

th(j-c)/Rth(j-c)

1.0

0.9

0.8

Tc=25°C

Tc=75°C

Tc=125°C

Doc ID 15664 Rev 4 3/7

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00

tp(s)

Characteristics STPS15L30CDJF

Figure 7. Reverse leakage current versus

reverse voltage applied
(typical values, per diode)

IR(mA)

1.E+03

Tj=150°C

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

0 5 10 15 20 25 30

Tj=125°C

Tj=100°C

Tj=75°C

Tj=50°C

Tj=25°C

VR(V)

Figure 9. Forward voltage drop versus

forward current (per diode)

I (A)

FM

20

18

16

14

12

10

8

6

T = 125 °C

j

(Maximum values)

T = 125 °C

j

(Typical values)

4

2

0

0.0 0.1 0.2 0.3 0.4 0.5 0.6

T = 25 °C

j

(Maximum values)

V (V)

FM

Figure 8. Junction capacitance versus

reverse voltage applied
(typical values, per diode)

C(pF)

1000

V

F=1MHz

osc

Tj=25°C

=30mV

RMS

VR(V)

100

1 10 100

Figure 10. Thermal resistance junction to

ambient versus copper surface
under each lead

Rth(j-a)(°C/W)

300

Epoxy printed board FR4
copper thickness = 35 µm

200

100

Scu(mm²)

0

0 200 400 600 800 1000

4/7 Doc ID 15664 Rev 4

STPS15L30CDJF Package information

2 Package information

● Epoxy meets UL94,V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 5. PowerFLAT 5x6 dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

Ref.

D2

E2

K

b

e

A

A1

D

L

A2

A 0.80 1.00 0.031 0.039

A1 0.02 0.05 0.001 0.002

A2 0.25 0.010

b 0.30 0.50 0.012 0.020

D 5.20 0.205

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

D2 4.11 4.31 0.162 0.170

e 1.27 0.050

E

E 6.15 0.242

E2 3.50 3.70 0.138 0.146

L 0.50 0.80 0.020 0.031

K 1.275 1.575 0.050 0.062

Figure 11. Footprint (dimensions in mm)

5.35

4.41

4.33

3.86

6.29

0.98

0.95

1.27

Doc ID 15664 Rev 4 5/7

0.62

Ordering information STPS15L30CDJF

Figure 12. Tape and reel specifications

Dot identifying Pin A1 location

2.0

4.0

Ø 1.55

0.30

12.0

5.30

1.20

All dimensions are typical values in mm

3 Ordering information

0.20

6.30

8.0

User direction of unreeling

1.75

Ø 1.5

5.5

R 0.50

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS15L30CDJFTR PS15 L30C PowerFLAT 5x6 0.095 g 3000 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Changes

13-May-2009 1 First issue.

09-Nov-2009 2 Updated Table 1.

30-Jul-2010 3 Replace Power QFN with PowerFLAT. Updated Figure 9.

18-May-2011 4

Added reference E in Ta bl e 5 . Updated package graphics.
Removed dash from order code and updated marking in Ta bl e 6 .
Added Figure 12.

6/7 Doc ID 15664 Rev 4

STPS15L30CDJF

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2011 STMicroelectronics - All rights reserved

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

STMicroelectronics group of companies

Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

Doc ID 15664 Rev 4 7/7