Page 1
®
LOW DROP POWER SCHOTTK Y RECTIFIER
MAIN PRODUCT CHARACTERISTIC S
STPS15L25D/G
I
F(AV)
V
RRM
15 A
25 V
Tj (max) 150 °C
V
(max) 0.35 V
F
FEATURES
VERY LOW FORWARD VOLTAGE DROP
FOR LESS POWER DISSIPATION AND REDUCED HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
DESCR IPTION
Single Schottky rectifier suited for Switched Mode
Power Supplies and high frequency DC to DC converters (V RM
Packaged in TO-220AC or D
).
S
2
PAK, this device is
especially intended for use as a Rectifier at the
secondary of 3.3V SMP S and DC/ DC units.
TO-220AC
STPS15L25D
K
A
A
K
NC
D2PAK
STPS15L25G
ABSOLUTE RATINGS
(limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
T
stg
Repetitive peak reverse voltage 25 V
RMS forward current 30 A
Average forward current Tc = 145°C δ = 0.5 15 A
Surge non repetitive forward current tp = 10ms Sinusoidal 250 A
Repetitive peak reverse current tp=2µs square F=1kHz 1 A
Non repetitive peak reverse current tp = 100µs square 4 A
Storage temperature range - 65 to + 150°C
Tj Max imum oper ating junction temperature * 150
dV/dt Critical rate of rise of reverse voltage 10000 V /µs
dPtot
* :
June 1999 - Ed : 4B
dTj
<
1
Rth(j−a
thermal runaway condition for a diode on its own heatsink
)
°
C
1/5
Page 2
STPS15L25D/G
THERMAL RE SISTA NC ES
Symbol Parameter Value Unit
R
th(j-c)
Junction to case
1
°
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameters Test conditions M in. Typ. Max. Unit
* Reverse leakage current Tj = 25° C VR = V
I
R
Tj = 125°C
* Forward voltage drop Tj = 25°C IF = 15A 0.46 V
V
F
Tj = 125°C I
Tj = 25°C I
Tj = 125°C I
Pulse test : * tp = 380 µs, δ < 2%
RRM
225 450 mA
= 15A 0.3 0.35
F
= 30A
F
= 30A 0.41 0.46
F
1.3 mA
0.56
To evaluate the maximum conduction losses use the following equation :
P = 0.24 x I
F(AV)
+ 0.0073 I
F2(RMS)
C/W
Fig.1 :
Average forward power dissipation versus
average forward current.
PF(av)(W)
8
7
6
5
4
3
2
1
0
0 2 4 6 8 10 12 14 16
2/5
δ = 0.05
δ = 0.1
IF(av) (A)
δ = 0.2
δ = 0.5
=tp/T
δ
δ = 1
T
Fig.2 :
Average forward current versus ambient
temperature ( δ = 0.5).
IF(av)(A)
16
14
12
10
8
6
δ
=tp/T
T
tp
4
tp
2
0
0 25 50 75 100 125 150
Rth(j-a)=Rth(j-c)
Rth(j-a)=50°C/W
Tamb(°C)
Page 3
STPS15L25D/G
Fig.3 :
Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
350
300
250
200
150
100
I
M
50
0
1E-3 1E-2 1E-1 1E+0
Fig.5 :
t
δ
=0.5
t(s)
Reverse leakage current versus reverse
Tc=25°C
Tc=75°C
Tc=100°C
voltage applied (typical values).
IR(mA)
1E+3
1E+2
Tj=150°C
Tj=125°C
Fig.4 :
Relative variation of thermal impedance
junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
0.0
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+0
Fig.6 :
Single pulse
Junction capacitance versus reverse
t(s)
δ
=tp/T
T
tp
voltage applied (typical values).
C(nF)
5.0
F=1MHz
Tj=25°C
1E+1
1E+0
1E-1
1E-2
0 5 10 15 20 25
Fig.7 :
Forward voltage drop versus forward
Tj=25°C
VR(V)
current (maximum values).
IFM(A)
200.0
100.0
Typical values
Tj=150°C
10.0
1.0
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
Tj=125°C
Tj=25°C
VFM(V)
1.0
0.1
12 5102030
Fig.8 :
Thermal resistance junction to ambient
VR(V)
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 µm).
(STPS15L25G only)
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0 4 8 1216202428323640
S(Cu) (cm²)
3/5
Page 4
STPS15L25D/G
PACKAGE ME CHANICAL D AT A
2
D
PAK
E
L2
L
L3
A1
B2
B
G
2.0 MIN.
FLAT ZONE
C2
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
A 4.40 4.60 0.173 0.181
A1 2. 49 2.69 0.098 0.106
A2 0. 03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
D
B2 1. 14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
C
R
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
A2
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
V2
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
FOOT PRINT DIMENSIONS
16.90
10.30
8.90
4/5
(in millimeters)
Cooling method: by conduction ( method C)
5.08
1.30
3.70
Page 5
PACKAGE ME CHANICAL D AT A
TO-220AC
H2
L5
Ø I
L6
L2
L9
F1
L4
F
G
STPS15L25D/G
DIMENSIONS
REF.
A
C
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
L7
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
M
E
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151
Millimeters Inches
Min. Max. Min. Max.
Cooling method : C
Recommended torque value : 0.55 m .N
Maximum torque value : 0.70 m.N
Ordering type Marking Package Weight Base qty
Delivery
mode
STPS15L25D STPS 15L25D TO-220AC 1.86g 50 Tube
STPS15L25G STPS15L25G D
STPS15L25G-TR STPS15L25G D
2
PAK 1.48g 50 Tube
2
PAK 1.48g 1000 Tape & reel
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwis e under any patent or patent rights of STMicroelec tronics. Specifications men tioned in this publication are subject to
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© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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