To evaluate the conduction losses use the following equation:
P = 0.42 x I
2/10
F(AV)
+ 0.01 I
F2(RMS)
= V
V
R
RRM
V T
200 µA
Page 3
STPS1545Characteristics
Figure 1.Average forward power dissipation
versus average forward current
P(W)
F(AV)
12
10
8
6
4
2
0
0 2 4 6 8 1012141618
δ = 0.05
δ = 0.1
δ = 0.2
I(A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3.Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P(1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.011
p
101001000
Figure 5.Non repetitive surge peak forward
current versus overload duration
(maximum values)
(TO-220AC, I
2
PAK D2PAK)
Figure 2.Average forward current versus
ambient temperature (
I(A)
F(AV)
18
R=R
16
14
12
10
8
6
4
2
=tp/T
δ
0
0255075100125150175
R =15°C/W
th(j-a)
T
tp
th(j-a) th(j-c)
T(°C)
amb
δ = 0.5)
TO-220AC
TO-220FPAC
Figure 4.Normalized avalanche power
derating versus junction
temperature
P(t)
ARM p
P(25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
255075100125150
T (°C)
j
Figure 6.Non repetitive surge peak forward
current versus overload duration
(maximum values) ( TO-220FPAC)
I (A)
M
200
180
160
140
120
100
80
60
IM
40
20
0
1E-31E-21E-11E+0
δ=0.5
t
t(s)
T =75°C
T =100°C
C
T =125°C
C
I (A)
M
120
100
80
C
60
40
IM
20
0
1E-31E-21E-11E+0
δ=0.5
t
t(s)
3/10
T =75°C
C
T =100°C
C
T =125°C
C
Page 4
CharacteristicsSTPS1545
Figure 7.Relative variation of thermal
impedance junction to case versus
pulse duration
(TO-220AC, I
Z/R
th(j-c) th(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
Single pulse
0.0
1E-41E-31E-21E-11E+0
2
PAK D2PAK)
t (s)
p
δ
T
=tp/T
Figure 9.Reverse leakage current versus
reverse voltage applied
(typical values)
I (µA)
R
5E+4
1E+4
1E+3
1E+2
T =150°C
j
T =125°C
j
T =100°C
j
T =75°C
j
T =50°C
j
Figure 8.Relative variation of thermal
impedance junction to case versus
pulse duration
( TO-220FPAC)
Z/R
th(j-c) th(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
t (s)
tp
Single pulse
0.0
1E-31E-21E-11E+01E+1
p
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
2000
1000
500
δ
=tp/T
T
F=1MHz
V =30mV
OSCRMS
T =25°C
j
tp
1E+1
1E+0
051015202530354045
T =25°C
j
V (V)
R
Figure 11. Forward voltage drop versus
forward current (maximum values)
I (A)
FM
100.0
10.0
1.0
0.1
0.00.20.40.60.81.01.21.41.6
T =125°C
j
(typical values)
T =125°C
j
V (V)
FM
T =25°C
j
200
V (V)
100
1251020 50
R
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, Cu=35 µm) (D
R(°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0510152025303540
S(Cu)(cm²)
2
PAK)
4/10
Page 5
STPS1545Package Information
2 Package Information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.55 Nm
●Maximum torque value: 0.7 Nm
Table 4.TO-220FPAC dimensions
Dimensions
Ref
MillimetersInches
Min.Max.Min.Max.
A 4.4 4.6 0.173 0.181
A
H
B
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
Dia
L6
L2
L3
L5
F1
L4
D
L7
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
G1
F
E
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
G
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
5/10
Page 6
Package InformationSTPS1545
Table 5.I2PAK dimensions
Dimensions
L2
Ref
MillimetersInches
Min.Max.Min.Max.
A
E
c2
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
b 0.70 0.93 0.028 0.037
b1 1.14 1.17 0.044 0.046
D
b2 1.14 1.17 0.044 0.046
c 0.45 0.60 0.018 0.024
L1
L
b1
A1
c2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
E 10.0 10.4 0.394 0.409
b
e
e1
c
L 13.1 13.6 0.516 0.535
L1 3.48 3.78 0.137 0.149
L2 1.27 1.40 0.050 0.055
6/10
Page 7
STPS1545Package Information
m
D
Table 6.D2PAK Package dimensions
Dimensions
Ref
MillimetersInches
Min.Max.Min.Max.
A
L2
E
C2
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
L
L3
G
A1
B2
B
C
R
A2
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
M
*
V2
* FLAT ZONE NO LESS THAN 2m
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
Figure 13. Footprint (dimensions in millimeters)
16.90
10.30
8.90
3.70
5.08
1.30
7/10
Page 8
Package InformationSTPS1545
Table 7.TO-220AC dimensions
Dimensions
L2
F1
Ref
MillimetersInches
Min.Max.Min.Max.
A 4.40 4.600.173 0.181
H2
Ø I
L5
L6
A
C
C
D 2.402.720.0940.107
E0.490.700.0190.027
L7
F0.610.880.0240.034
F11.141.700.0440.066
1.23 1.320.0480.051
F21.141.700.0440.066
G4.955.150.1940.202
L9
L4
F
G
D
G12.402.700.0940.106
H21010.400.3930.409
L216.4 typ. 0.645 typ.
M
L413140.5110.551
E
L52.652.950.1040.116
L615.2515.750.6000.620
L76.206.600.2440.259
L93.503.930.1370.154
M2.6 typ.0.102 typ.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
8/10
Diam.3.753.850.1470.151
Page 9
STPS1545Ordering Information
3 Ordering Information
Ordering typeMarkingPackageWeightBase qty
Delivery
mode
STPS1545D STPS1545D TO-220AC 1.86 g 50 Tube
STPS1545FP STPS1545FP TO-220FPAC 1.9 g 50 Tube
2
I
STPS1545R STPS1545R
STPS1545G STPS1545G D
STPS1545G-TR STPS1545G D
PAK 1.7 g 50 Tube
2
PA K1.48 g 50 Tube
2
PA K1.48 g 1000 Tape & Reel
4 Revision history
DateRevisionDescription of Changes
Jul-20035FLast release.
21-Mar-20076Removed ISOWATT package.
9/10
Page 10
STPS1545
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