Datasheet STPS120MF Datasheet (ST)

Power Schottky rectifier in flat package

Features

■ Very low profile package: 0.85 mm

■ Backward compatible with standard STmite

footprint

■ Very small conduction losses

■ Negligible switching losses

■ Extremely fast switching

■ Low forward voltage drop for higher efficiency

and extended battery life

■ Low thermal resistance

■ Avalanche capability specified

■ Hologen free molding compound

Description

STPS120MF

K

STmite flat

(DO222-AA)

Table 1. Device summary

I

F(AV)

V

RRM

(max) 150 °C

T

j

V

(max) 0.41 V

F

A

1 A

20 V

Single Schottky rectifier suited for switch mode
power supplies and high frequency dc to dc
converters.

Packaged in STmite flat, this device is intended
for use in low voltage, high frequency inverters,
free wheeling and polarity protection applications.
Due to the very small size of the package this
device fits battery powered equipment (cellular,
notebook, PDA’s, printers) as well as chargers
and PCMCIA cards.

May 2008 Rev 1 1/7

www.st.com

Characteristics STPS120MF

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

P

ARM

T

stg

T

Repetitive peak reverse voltage 20 V

Forward current rms 2 A

Average forward current Tc = 140 °C δ = 0.5 1 A

Surge non repetitive forward current tp = 10 ms sinusoidal 50 A

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1400 W

Storage temperature range -65 to + 150 °C

Maximum operating junction temperature

j

(1)

150 °C

dV/dt Critical rate of rise of reverse voltage (rated VR, Tj = 25 °C) 10000 V/µs

dPtot

---------------

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal resistance

1

--------------------------

<

Rth j a–()

Symbol Parameter Value Unit

R

th(j-c)

R

th(j-a)

1. Mounted with minimum recommended pad size, PC board FR4

Table 4. Static electrical characteristics

Junction to case 20 °C/W

(1)

Junction to ambient 250 °C/W

Symbol Parameter Test conditions Min. Typ. Max. Unit

(1)

I

V

1. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

R

(1)

Forward voltage drop

F

Tj = 25° C

VR = V

V

R

V

R

I

= 1 A

F

= 2 A

I

F

RRM

= 10 V

= 5 V

= 100° C 275 850

T

j

= 25° C

T

j

T

= 100° C 145 450

j

= 25° C

T

j

T

= 100° C 105 300

j

= 25° C

T

j

T

= 100° C 0.36 0.41

j

= 25° C

T

j

T

= 100° C 0.42 0.48

j

1.3 3.9

0.6 2.0

0.4 10.

0.44 0.49

0.48 0.54

To evaluate the conduction losses use the following equation:
P = 0.34 x I

F(AV)

+ 0.07 I

F2(RMS)

µA

V

2/7

STPS120MF Characteristics

Figure 1. Conduction losses versus average

current

P (W)

F(AV)

0.6

δ=0.1

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

δ=0.05

I (A)

F(AV)

δ=0.2

δ

=tp/T

δ=0.5

δ=1

T

tp

Figure 3. Normalized avalanche power

derating versus pulse duration

P(tp)

ARM

P (1 µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)

I (A)

F(AV)

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0 25 50 75 100 125 150

R

th(j-a)

=250°C/W

T (°C)

amb

R

th(j-a)=Rth(j-c)

Figure 4. Normalized avalanche power

derating versus junction
temperature

P(Tj)

ARM

P (25 °C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values)

I (A)

M

6

5

4

3

2

I

M

1

0

1.E-03 1.E-02 1.E-01 1.E+00

t

=0.5

δ

t(s)

Ta=25°C

Ta=75°C

Ta=125°C

Figure 6. Relative variation of thermal

impedance junction to ambient
versus pulse duration

Z/R

th(j-a) th(j-a)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

3/7

t (s)

p

Characteristics STPS120MF

Figure 7. Reverse leakage current versus

reverse voltage applied (typical
values)

I (mA)

R

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03

1.E-04

0 2 4 6 8 101214161820

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=50°C

Tj=25°C

V (V)

R

Figure 9. Forward voltage drop versus

forward current (low level)

I (A)

FM

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6

Tj=100°C

Tj=100°C

(Maximum values)

(Maximum values)

Tj=100°C

Tj=100°C

(Typical values)

(Typical values)

Tj=25°C

(Maximum values)

V (V)

FM

Figure 8. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

1000

100

V (V)

R

10

0 2 4 6 8 10 12 14 16 18 20

F=1MHz

V

osc

T

Figure 10. Forward voltage drop versus

forward current (high level)

I (A)

FM

100.0

Tj=100°C

10.0

1.0

0.1

Tj=100°C

(Maximum values)

(Maximum values)

Tj=100°C

Tj=100°C

(Typical values)

(Typical values)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4

Tj=25°C

(Maximum values)

V (V)

FM

=30mV

=25°C

j

Figure 11. Thermal resistance junction to ambient versus copper surface under tab

(epoxy printed board FR4, Cu = 35 µm, typical values)

R (°C/W)

th(j-a)

250

225

200

175

150

125

100

75

50

25

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

4/7

S(cm²)

STPS120MF Package information

2 Package information

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.

Table 5. STmite flat dimensions

Dimensions

®

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

E1

D

L

b

L1

L2

A 0.80 0.85 0.95 0.031 0.033 0.037

b 0.40 0.55 0.65 0.016 0.022 0.026

b2 0.70 0.85 1.00 0.027 0.033 0.039

b2

c 0.10 0.15 0.25 0.004 0.006 0.009

E

L3

D 1.75 1.90 2.05 0.069 0.075 0.081

E 3.60 3.80 3.90 0.142 0.150 0.154

c

A

E1 2.80 2.95 3.10 0.110 0.116 0.122

L 0.50 0.55 0.80 0.020 0.022 0.031

L1 2.10 2.40 2.60 0.083 0.094 0.102

L2 0.45 0.60 0.75 0.018 0.024 0.030

L3 0.20 0.35 0.50 0.008 0.014 0.020

Figure 12. STmite flat recommended footprint (all dimensions in mm)

0.85 0.63 2.00

0.65

0.65

0.95 1.95

4.13

5/7

Ordering information STPS120MF

3 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS120MF F12 STmite flat 16 mg 12000 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Changes

15-May-2008 1 First issue.

6/7

STPS120MF

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2008 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

7/7