Datasheet STPS1150 Datasheet (ST)

Features

STPS1150

Power Schottky rectifier

■ Negligible switching losses

■ Low forward voltage drop for higher efficiency

and extented battery life

■ Low thermal resistance

■ Surface mount miniature package

■ Avalanche capability specified

Description

These 150 V power Schottky rectifiers are suited
for switch mode power supplies on up to 24 V rails
and high frequency converters.

Packaged in STmite/STmite flat, SMA and axial,
this device is intended for use in consumer and
computer applications like TV, STB, PC and DVD
where low drop forward voltage is required to
reduce power dissipation.

A

K

STmite

(JEDEC DO-216AA)

STPS1150M

A

K

SMA

(JEDEC DO-214AC)

STPS1150A

Table 1. Device summary

I

F(AV)

V

RRM

Tj (max) 175 °C

(max) 0.67 V

V

F

STmite flat

STPS1150MF

A

K

DO-41

STPS1150

1 A

150 V

February 2011 Doc ID 9472 Rev 5 1/11

www.st.com

11

Characteristics STPS1150

d

-

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

Repetitive peak reverse voltage 150
Forward rms current 15

STmite/flat Tc = 160 °C δ = 0.5

I

F(AV)

I

FSM

P

ARM

T

Ptot

--------------

1. condition to avoid runaway for a diode on its own heatsink

dTj

Table 3. Thermal resistance

Average forward current

Surge non repetitive forward
current

SMA TL = 160 °C δ = 0.5
DO-41 T

= 150 °C δ = 0.5

L

STmite/flat
SMA 50

= 10 ms sinusoidal

t

p

DO-41 75
Repetitive peak avalanche power tp = 1µs Tj = 25 °C 1500
Storage temperature range -65 to + 175 °C

stg

Maximum operating junction temperature

T

j

1

--------------------------

<

Rth j a–()

(1)

1

50

175 °C

Symbol Parameter Value Unit

R

R

th(j-c)

th(j-l)

Junction to case STmite/STmite flat 20

SMA 20

Junction to lead

Lead length = 10 mm DO-41 30

°C/W

V

A

A

A

W

Table 4. Static electrical characteristics

Symbol Parameter Tests conditions Min. Typ. Max. Unit

(1)

I

R

VF

1. tp = 5 ms, δ < 2%

2. t

p

Reverse leakage current

(2)

Forward voltage drop

= 380 µs, δ < 2%

Tj = 25 °C

VR = V

= 1 A

I

F

= 2 A

I

F

RRM

= 125 °C 0.2 1.0 mA

T

j

= 25 °C

T

j

T

= 125 °C 0.62 0.67

j

= 25 °C

T

j

T

= 125 °C 0.69 0.75

j

0.2 1.0 µA

0.78 0.82

0.85 0.89

To evaluate the conduction losses use the following equation:
P = 0.59 x I

F(AV)

+ 0.08 I

F2(RMS)

V

2/11 Doc ID 9472 Rev 5

STPS1150 Characteristics

03

00

Figure 1. Average forward power

dissipation versus average
forward current

P (W)

F(AV)

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2

δ = 0.05

I (A)

F(AV)

δ = 0.1

δ = 0.2

δ = 0.5

δ

δ = 1

=tp/T

Figure 3. Normalized avalanche power

derating versus pulse duration

P(tp)

ARM

P (1 µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)

I (A)

F(AV)

1.2

1.0

R

= 250 °C/W

T

t

th(j-a)

R

th(j-a)

p

0.8

R

th(j-a)

0.6

0.4

T

0.2

tp

0.0

δ = t / T

p

= 120 °C/W

SMA

= R

th(j-l)

STmite and STmite flat

R

= R

th(j-a)

th(j-c)

DO-41

R

= R

th(j-a)

th(j-l)

T (°C)

amb

0 25 50 75 100 125 150 175

Figure 4. Normalized avalanche power

derating versus junction
temperature

P(Tj)

ARM

P (25 °C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 5. Non repetitive surge peak

forward current versus overload
duration - maximum values

I (A)

M

20

18

16

14

12

10

8

6

4

I

M

2

0

1.E-03 1.E-02 1.E-01 1.E+00

δ = 0.5

t

STmite

T = 25 °C

c

T = 75 °C

c

T = 125 °C

c

Doc ID 9472 Rev 5 3/11

t(s)

Figure 6. Non repetitive surge peak

forward current versus overload
duration - maximum values

I (A)

M

20

18

16

14

12

10

8

6

4

I

M

2

0

1.E-

t

δ = 0.5

1.E-02 1.E-01 1.E+

STmite flat

T = 25 °C

c

T = 75 °C

c

T = 125 °C

c

t(s)

Characteristics STPS1150

Figure 7. Non repetitive surge peak

forward current versus overload
duration - maximum values

I (A)

M

8

7

6

5

4

3

2

IM

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMA

T =25°C

a

T =75°C

a

T =125°C

a

Figure 9. Relative variation of thermal

impedance junction to case versus
pulse duration

Z/R

th(j-c) th(j-c)

1.0

0.9

STmite

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-04 1.E-03 1.E-02 1.E-01

Figure 11. Relative variation of thermal

impedance junction to ambient
versus pulse duration

Z/R

th(j-a) th(j-a)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

SMA

t (s)

p

t (s)

p

Figure 8. Non repetitive surge peak forward

current versus overload duration

- maximum values

I (A)

M

8

7

6

5

4

3

2

IM

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

DO-41

T =25°C

a

T =75°C

a

T =125°C

a

Figure 10. Relative variation of thermal

impedance junction to case versus
pulse duration

Z/R

th(j-c) th(j-c)

1.0

0.9

STmite flat

0.8

0.7

0.6

0.5

0.4

0.3
Single pulse

0.2

0.1

0.0

t (s)

p

1.E-04 1.E-03 1.E-02 1.E-01

Figure 12. Relative variation of thermal

impedance junction to ambient
versus pulse duration

Z/R

th(j-a) th(j-a)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

DO-41

Single pulse

t (s)

p

4/11 Doc ID 9472 Rev 5

STPS1150 Characteristics

Figure 13. Reverse leakage current versus

reverse voltage applied (typical
values)

I (µA)

R

1.E+04

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03

0 25 50 75 100 125 150

T=150°C

j

T=125°C

j

T=100°C

j

T=75°C

j

T=50°C

j

T=25°C

j

V (V)

R

Figure 15. Forward voltage drop versus

forward current (all packages)

I (A)

FM

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

(maximum values)

T=125°C

j

(typical values)

T=125°C

j

V (V)

FM

T=25°C

j

(maximum values)

Figure 17. Thermal resistance junction to

ambient versus copper surface
under tab (STmite flat)

R (°C/W)

th(j-a)

250

225

200

175

150

125

100

75

50

25

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

STmite flat

Epoxy printed circuit board,
copper thickness = 35 µm

S (cm²)

Cu

Figure 14. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

100

10

V (V)

1

1 10 100 1000

R

F=1MHz

V =30mV

OSC RMS

T=25°C

j

Figure 16. Thermal resistance junction to

ambient versus copper surface
under tab (STmite)

R (°C/W)

th(j-a)

250

225

200

175

150

125

100

75

50

25

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

STmite

Epoxy printed circuit board,
copper thickness = 35 µm

S (cm²)

Cu

Figure 18. Thermal resistance junction to

ambient versus copper surface
under each lead (SMA)

R (°C/W)

th(j-a)

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board,
copper thickness = 35 µm

S (cm²)

Cu

Doc ID 9472 Rev 5 5/11

Characteristics STPS1150

Figure 19. Thermal resistance versus lead length (DO-41)

R (°C/W)

th

120

R

100

80

th(j-a)

60

40

20

0

5 10152025

R

th(j-I)

L (mm)

leads

6/11 Doc ID 9472 Rev 5

STPS1150 Package information

2 Package information

● Band shows cathode.

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK

Table 5. STmite dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

Dimensions

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

L3

D

b2

b

A 0.85 1.00 1.15 0.033 0.039 0.045

A1 -0.05 0.105 -0.002 0.004

b 0.40 0.65 0.016 0.025

b2 0.70 1.00 0.027 0.039

H

L2

L

R

C

R1

A1

0° to 6°

E

A

c 0.10 0.25 0.004 0.010

D 1.75 1.90 2.05 0.069 0.007 0.081

E 1.75 1.90 2.05 0.069 0.007 0.081

H 3.60 3.75 3.90 0.142 0.148 0.154

L 0.50 0.63 0.80 0.047 0.025 0.031

L2 1.20 1.35 1.50 0.047 0.053 0.059

L3

0.50
ref

0.019
ref

R 0.07 0.003

R1 0.07 0.003

Figure 20. Footprint (dimensions in mm)

1.82

1.10

2.03

0.50

Doc ID 9472 Rev 5 7/11

1.38

0.75

0.71

Package information STPS1150

Table 6. STmite flat dimensions

Dimensions

E1

D

E

c

L

b

L3

Figure 21. Footprint dimensions

0.85 0.63 2.00

(0.033) (0.079)

0.65

Ref.

L1

L2

A 0.80 0.85 0.95 0.031 0.033 0.037

b 0.40 0.55 0.65 0.016 0.022 0.026

b2 0.70 0.85 1.00 0.027 0.033 0.039

b2

c 0.10 0.15 0.25 0.004 0.006 0.009

D 1.75 1.90 2.05 0.069 0.075 0.081

E 3.60 3.80 3.90 0.142 0.150 0.154

A

E1 2.80 2.95 3.10 0.110 0.116 0.122

L 0.50 0.55 0.80 0.020 0.022 0.031

L1 2.10 2.40 2.60 0.083 0.094 0.102

L2 0.45 0.60 0.75 0.018 0.024 0.030

L3 0.20 0.35 0.50 0.008 0.014 0.020

0.65

(.025) (.026)

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

0.95

(0.037) (0.077)(0.026)

1.95

4.13

(0.163)

millimeters

(inches)

8/11 Doc ID 9472 Rev 5

STPS1150 Package information

Table 7. SMA dimensions

Dimensions

E1

D

E

A1

C

L

A2

b

Figure 22. Footprint (dimensions in mm)

1.4

2.63

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

1.4

1.64

5.43

Table 8. DO-41 (plastic) dimensions

ØD

CC

A

ØB

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.1 5.20 0.160 0.205

B 2 2.71 0.080 0.107

C25.4 1

D 0.712 0.863 0.028 0.034

Doc ID 9472 Rev 5 9/11

Ordering information STPS1150

3 Ordering information

Table 9. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS1150M 115 STmite 0.0155 g 12000 Tape and reel

STPS1150MF F115 STmite flat 0.016 g 12000 Tape and reel

STPS1150A 1150 SMA 0.068 g 5000 Tape and reel

STPS1150 STPS1150 DO-41 0.34 g 2000 Ammopack

STPS1150RL STPS1150 DO-41 0.34 g 5000 Tape and reel

4 Revision history

Table 10. Document revision history

Date Revision Changes

Jul-2003 2A Last update.

Aug-2004 3

31-May-2006 4

09-Feb-2011 5 Added STmite and STmite flat package.

SMA package dimensions update. Reference A1 max. changed
from 2.70mm (0.106) to 2.03mm (0.080).

Reformatted to current standard. Added ECOPACK statement.
Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10.

10/11 Doc ID 9472 Rev 5

STPS1150

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Doc ID 9472 Rev 5 11/11