Datasheet STPS1045B-Y Datasheet (ST)

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Page 1

Features

STPS1045B-Y

Automotive power Schottky rectifier

■ Negligible switching losses

■ Low forward voltage drop

■ Low capacitance

■ High reverse avalanche surge capability

■ Avalanche specification

■ AEC-Q101 qualified

Description

High voltage Schottky rectifier suited for switch mode power supplies and other power converters.

Packaged in DPAK, this device is intended for use in high frequency circuits where low switching losses are required.

DPAK

STPS1045BY

Table 1. Device summary

F(AV)

RRM

(max) 0.57 V

10 A

45 V

175 °C

May 2011 Doc ID 17265 Rev 1 1/7

www.st.com

Page 2

Characteristics STPS1045B-Y

1 Characteristics

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit

F(RMS)

F(AV)

RRM

FSM

RRM

ARM

Repetitive peak reverse voltage 45 V

/pin Forward rms current 7 A

Average forward current Tc = 150 °C δ = 0.5 10 A

Surge non repetitive forward current tp = 10 ms sinusoidal 75 A

Repetitive peak reverse current tp = 2 µs, F= 1 kHz 1 A

Repetitive peak avalanche power tp = 1 µs, T

Storage temperature range -65 to +175 °C

stg

Operating junction temperature range

(1)

25 °C 4000 W

j =

-40 to +175 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

dPtot

---------------

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal parameters

------------------------- -

Rth j a–()

Symbol Parameter Value Unit

th(j-c)

Table 4. Static electrical characteristics

Junction to case 3 °C/W

Symbol Parameter Test conditions Min. Typ. Max. Unit

Reverse leakage

(1)

current

(2)

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

Forward voltage drop

= 25 °C

= 125 °C - 7 15 mA

= 25 °C

= 125 °C - 0.50 0.57

= 25 °C

= 125 °C - 0.65 0.72

= V

= 10 A

= 20 A

RRM

- - 100 μA

- - 0.63

- - 0.84

To evaluate the conduction losses use the following equation: P = 0.42 x I

2/7 Doc ID 17265 Rev 1

F(AV)

+ 0.015 I

F2(RMS)

Page 3

STPS1045B-Y Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P(W)

F(AV)

0123456789101112

δ = 0.05

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

=tp/T

δ = 1

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

0.1

Figure 2. Average forward current versus

ambient temperature (

I (A)

F(AV)

R =70°C/W

0 25 50 75 100 125 150 175

th(j-a)

R=R

th(j-a) th(j-c)

R =15°C/W

th(j-a)

T (°C)

amb

δ = 0.5)

Figure 4. Normalized avalanche power

derating versus junction temperature

P(T)

ARM

P (25 °C)

1.2

0.8

ARM

0.01

t (µs)

0.001

0.10.01 1

10 100 1000

Figure 5. Non repetitive surge peak forward

current versus overload duration (maximum values)

I (A)

120

100

1E-3 1E-2 1E-1 1E+0

δ=0.5

t(s)

T =50°C

T =100°C

T =150°C

0.6

0.4

0.2

25 50 75 100 125 150

T (°C)

Figure 6. Relative variation of thermal

impedance junction to case versus pulse duration

Z/R

th(j-c) th(j-c)

1.0

0.8

0.6

δ = 0.5

0.4

δ = 0.2

δ = 0.1

0.2

0.0

Single pulse

1E-4 1E-3 1E-2 1E-1 1E+0

t (s)

=tp/T

Doc ID 17265 Rev 1 3/7

Page 4

Characteristics STPS1045B-Y

Figure 7. Reverse leakage current versus

reverse voltage applied (typical values)

I (µA)

1E+5

T =150°C

1E+4

1E+3

1E+2

1E+1

1E+0

1E-1

0 5 10 15 20 25 30 35 40 45

T =125°C

T =100°C

T =75°C

T =50°C

T =25°C

V (V)

Figure 9. Forward voltage drop versus

forward current

I (A)

100.0

10.0

1.0

0.1

T =125°C

(maximum values)

T =125°C

(typical values)

T =25°C

(maximum values)

V (V)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

Figure 8. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

1000

500

200

V (V)

100

12 51020 50

F=1MHz

V =30mV

OSC RMS

T =25°C

Figure 10. Thermal resistance junction to

ambient versus copper surface under tab

(°C/W)

th(j-a)

100

Epoxy printed circuit board, copper thickness: 35 µm

S(Cu)(cm )

0 2 4 6 8101214161820

4/7 Doc ID 17265 Rev 1

Page 5

STPS1045B-Y Package information

2 Package information

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Table 5. DPAK dimensions

Dimensions

Ref.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

0.60 MIN.

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

Millimeters Inches

Min. Max Min. Max.

Figure 11. DPAK footprint (dimensions in mm)

6.7 3 3

6.7

Doc ID 17265 Rev 1 5/7

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

1.6

2.3

1.6

Page 6

Ordering information STPS1045B-Y

3 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS1045BY-TR S1045Y DPAK 0.30 g 2500 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Changes

23-May-2011 1 Initial release.

6/7 Doc ID 17265 Rev 1

Page 7

STPS1045B-Y

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Doc ID 17265 Rev 1 7/7