Datasheet STPS10150CT Datasheet (SGS Thomson Microelectronics)

®

STPS10150CT/CG

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS

I

F(AV)

V

RRM

2x5A

150 V

Tj 175°C

V

(max) 0.75 V

F

FEATURES AND BENEFITS

HIGH JUNCTION TEMPERATURE CAPABILITY

■

GOOD TRADE OFF BETWEEN LEAKAGE CUR-

■

RENT AND FORWARD VOLTAGE DROP
LOW LEAKAGE CURRENT

■

■ AVALANCHE CAPABILITY SPECIFIED

DESCRIPTION

Dual center tap schottky rectifier designed for
high frequency Switched Mode Power Sup­plies.

A1

A2

K

D2PAK

STPS10150CG

A1

K

A2

A1

TO-220AB

STPS10150CT

A2

K

ABSOLUTE RATINGS (limiting values, per diode)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

P

ARM

T

Repetitive peak reverse voltage 150 V
RMS forward current 10 A
Average forward current

δ = 0.5

TO-220AB
D2PAK

Tc = 155°C per diode

per device
Surge non repetitive forward current tp = 10 ms sinusoidal 120 A
Repetitive peak avalanche power tp = 1µs Tj = 25°C 3100 W
Storage temperature range - 65 to + 175 °C

stg

5

10

Tj Maximum operating junction temperature 175 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

July 2003 - Ed: 5B

A

1/5

STPS10150CT/CG

THERMAL RESISTANCES

Symbol Parameter Value Unit

R

th (j-c)

R

th (c)

When the diodes 1 and 2 are used simultaneously :

∆ Tj(diode 1) = P(diode1) x R

STATIC ELECTRICAL CHARACTERISTICS (per diode)

Symbol Parameter Tests conditions Min. Typ. Max. Unit

I

R

V

F

Pulse test : * tp=5ms,δ<2%

To evaluate the conduction losses use the following equation:
P = 0.65 I

Junction to case TO-220AB / D2PAK Per diode 4 °C/W

TO-220AB / D

2

PAK Total 2.4

TO-220AB / D2PAK Coupling 0.7

(Per diode) + P(diode 2) x R

th(j-c)

* Reverse leakage current Tj = 25°C VR=V

th(c)

RRM

2.0 µA

Tj = 125°C 0.40 2.0 mA

** Forward voltage drop Tj = 25°CI

Tj = 125°C I
Tj=25°CI
Tj = 125°C I

** tp = 380 µs, δ <2%

+ 0.02 I

F(AV)

F2(RMS)

= 5 A 0.92 V

F

= 5 A 0.69 0.75

F

=10A 1

F

= 10 A 0.79 0.85

F

Fig. 1: Average forward power dissipation versus
average forward current (per diode).

PF(av)(W)

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

δ = 0.05

2/5

δ = 0.1

IF(av) (A)

δ = 0.2

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Fig. 2: Average forward current versus ambient
temperature (δ = 0.5, per diode).

IF(av)(A)

6
5
4
3
2
1
0

0 25 50 75 100 125 150 175

δ

=tp/T

T

tp

Tamb(°C)

Rth(j-a)=Rth(j-c)

Rth(j-a)=15°C/W

STPS10150CT/CG

Fig. 3: Normalized avalanche power derating

versus pulse duration.

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).

IM(A)

80
70
60
50
40
30
20

IM

10

0

1E-3 1E-2 1E-1 1E+0

δ=0.5

t

t(s)

Tc=50°C

Tc=75°C

Tc=125°C

Fig. 4: Normalized avalanche power derating
versus junction temperature.

P(t)

ARM p

P (25°C)

ARM

1.2
1

0.8

0.6

0.4

0.2
0

0 25 50 75 100 125 150

T (°C)

j

Fig. 6: Relative variation of thermal impedance

junction to case versus pulse duration (per diode).

Zth(j-c)/Rth(j-c)

1.0

0.8

δ = 0.5

0.6

δ = 0.2

0.4

δ = 0.1

0.2

Single pulse

0.0
1E-3 1E-2 1E-1 1E+0

tp(s)

δ

=tp/T

T

tp

Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode)

IR(µA)

1E+5
1E+4
1E+3
1E+2
1E+1
1E+0

1E-1
1E-2

0 25 50 75 100 125 150

Tj=175°C

Tj=150°C

Tj=125°C

Tj=75°C

Tj=25°C

VR(V)

Fig. 8: Junction capacitance versus reverse

voltage applied (typical values, per diode).

C(pF)

200

100

50

20

VR(V)

10

1 2 5 10 20 50 100 200

F=1MHz
Tj=25°C

3/5

STPS10150CT/CG

Fig. 9: Forward voltage drop versus forward

current (maximum values, per diode).

IFM(A)

100.0

Tj=125°C

Typical values

10.0

1.0

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Tj=125°C

Tj=25°C

VFM(V)

PACKAGE MECHANICAL DATA

TO-220AB

Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board, copper thickness: 35µm)
(STPS10150CG only).

Rth(j-a) (°C/W)

80
70
60
50
40
30
20
10

0

0 2 4 6 8 101214161820

S(cm²)

L2

F2
F1

F

G1

H2

Dia

G

L5

L9

L6

L4

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A

C

C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027

L7

F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

D

G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409

L2 16.4 typ. 0.645 typ.

M

E

L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. 3.75 3.85 0.147 0.151

4/5

PACKAGE MECHANICAL DATA

2

PAK

D

E

L2

L

L3

A1

B2
B

G

2.0 MIN.
FLAT ZONE

C2

STPS10150CT/CG

DIMENSIONS

A

REF.

A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009

D

B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.049 0.055

C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054

C

R

D 8.95 9.35 0.352 0.368

E 10.00 10.28 0.393 0.405

G 4.88 5.28 0.192 0.208

A2

L 15.00 15.85 0.590 0.624

L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069

R 0.40 0.016

V2

V2 0° 8° 0° 8°

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

FOOT PRINT DIMENSIONS (in millimeters)

16.90

10.30

3.70

8.90

5.08

1.30

Ordering type Marking Package Weight Baseqty Delivery mode

STPS10150CT STPS10150CT TO-220AB 2.2 g 50 Tube

STPS10150CG STPS10150CG D

STPS10150CG-TR STPS10150CG D

■

EPOXY MEETS UL94, V0

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2

PAK 1.48 g 50 Tube

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PAK 1.48 g 1000 Tape & reel

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