The SuperM ESH™ series is obtained through an
extreme optimization of S T’s well established stripbased PowerMESH™ layout. In addition to pushing
on-resistance significantly down, special careis taken to ensure a very good dv/dt capability for the
most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDm es h™ products.
3
2
TO-220
1
TO-220FP
3
2
1
TO-247
INTERNAL SCHEMATIC DIAGRAM
3
2
1
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ IDEAL FOR OFF-LINE POWER SUPPLIES,
ADAPTORS AND PFC
■ LI GHTING
ORDERING INFORMATION
SALES TYPEMARKINGPACKAGEPACKAGING
STP8NK80ZP8NK80ZTO-220TUBE
STP8NK80ZFPP8NK80ZFPTO-220FPTUBE
STW8NK80ZW8NK80ZTO-247TUBE
1/11February 2003
Page 2
STP8NK80Z - STP8NK80ZFP - STW8NK80Z
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STP8NK80Z - STW8NK80ZSTP8NK80ZFP
V
V
DGR
V
I
I
IDM()
P
TOT
V
ESD(G-S)
dv/dt (1)Peak Diode Recovery voltage slope4.5V/ns
V
T
T
() Pulse width limited by safe operating area
(1) I
SD
(*) Limited only by maximum temperature allowed
Drain-source Voltage (VGS=0)
DS
Drain-gate Voltage (RGS=20kΩ)
Gate- source Voltage± 30V
GS
Drain Current (continuous) at TC= 25°C
D
Drain Current (continuous) at TC= 100°C
D
6.26.2 (*)A
3.93.9 (*)A
800V
800V
Drain Current (pulsed)24.824.8 (*)A
Total Dissipation at TC= 25°C
Maximum Lead Temperature For Soldering Purpose300°C
l
°C/W
AVALANCHE CHARACTERISTICS
SymbolParameterMax ValueUnit
I
AR
E
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
= 25°C, ID=IAR,VDD=50V)
j
max)
j
6.2A
300mJ
GATE-SOURCE ZENER DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
BV
Gate-Source Breakdown Voltage
GSO
Igs=± 1 mA (Open Drain)30V
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed t o enhance not only the device’s
ESD capability, but also to make them s a fely absorb possible volt age trans ients tha t may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’ s integrity. These integ rated Zener diodes thus avoid the
usage of external components.
2/11
Page 3
STP8NK80Z - STP8NK 80ZFP - STW8NK80Z
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SP ECIFIED)
CASE
ON/OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=1mA,VGS= 0800V
Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Zero Gate Voltage
Drain Current (V
GS
=0)
Gate-body Leakage
Current (V
DS
=0)
Gate Threshold Voltage
Static Drain-source On
V
= Max Rating
DS
VDS= Max Rating, TC= 125 °C
V
= ± 20V±10µA
GS
V
DS=VGS,ID
= 100 µA
33.754.5V
1
50
VGS=10V,ID= 3.1 A1.31.5Ω
Resistance
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
(1)Forward TransconductanceVDS=15V,ID= 3.1 A5.2S
g
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
(3)Equivalent Output
=25V,f=1MHz,VGS= 01320
V
DS
143
27
VGS=0,VDS= 640 V58pF
Capacitance
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
Q
Q
Q
Turn-on Delay Time
t
r
g
gs
gd
Rise Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD=400V,ID= 3.1 A
RG= 4.7Ω,VGS=10V
(Resistive Load see, Figure 3)
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility fo r the
consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics . Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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