Datasheet STP8NA50FI, STP8NA50 Datasheet (SGS Thomson Microelectronics)

STP8NA50

STP8NA50FI

N - CHANNEL ENHANCEMENT MODE

FAST POWER MOS TRANSISTOR

TYPE V

STP 8NA50
STP 8NA50FI

■ TYPICAL R

■ ± 30V GATE TO SOURCE VOLTAGE RATING

■ 100% AVALANCHE TESTED

■ REPETITIVE AVALANCHE DATA AT 100

■ LOW INTRINSIC CAPACITANCES

■ GATE GHARGE MINIMIZED

■ REDUCED THRESHOLD VOLTAGE SPREAD

DS(on)

DSS

500 V
500 V

= 0.7 Ω

R

DS(on)

I

D

<0.85Ω
<0.85Ω8A4.5 A

o

C

DESCRIPTION

This series of POWER MOSFETS represents the
most advanced high voltage technology. The
optimized cell layout coupled with a new
proprietary edge termination concur to give the
device low R

and gate charge, unequalled

DS(on)

ruggedness and superior switching performance.

APPLICATIONS

■ HIGH CURRENT, HIGH SPEED SWITCHING

■ SWITCH MODE POWERSUPPLIES (SMPS)

■ DC-AC CONVERTERS FOR WELDING

EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE

3

2

1

TO-220 ISOWATT220

INTERNAL SCHEMATIC DIAGRAM

3

2

1

ABSOLUTE MAXIMUM RATINGS

Symb o l Paramet er Val u e Unit

ST P8NA50 ST P8NA50FI

V

V

V

I

DM

P

V

T

(•) Pulsewidth limited bysafe operating area

November 1996

Drain - s ource Voltage (VGS=0) 500 V

DS

Drain - gat e Voltage (RGS=20kΩ)500V

DGR

Gate-source Voltage ± 30 V

GS

Drain Current (continuous) at Tc=25oC84.5A

I

D

Drain Current (continuous) at Tc=100oC5.3 3A

I

D

(•) Drain Current (pulsed) 32 32 A

Total Di ssipation a t Tc=25oC 125 45 W

tot

Derating F actor 1 0.36 W/
Ins ulation Withs t and Voltage (DC)  2000 V

ISO

St or a ge Tem perature -65 t o 150

stg

Max. Operating Jun ction T emperature 150

T

j

o
o

o

C

C
C

1/10

STP8NA50/FI

THERMAL DATA

TO-220 ISOW ATT 220

R

thj-case

R

thj-amb

R

thc-sink

T

AVALANCHE CHARACTERISTICS

Symbol Parameter Max Value Uni t

I

AR

E

E

I

AR

Thermal Resistance J unction- c ase Max 1 2.78
Thermal Resistance Junc tion-am bie nt Max

Thermal Resistance Cas e-sink Typ
Maximum Lead Temperature For So ldering Purpose

l

Avalanc h e Cu rr ent , Repet itive or Not-Rep etitive
(pulse width limited by Tjmax, δ <1%)

Single Pul se Avalanche Ener gy

AS

(starti ng T
Repetitive Avalanc he Energ y

AR

=25oC, ID=IAR,VDD=50V)

j

(pulse width limited by Tjmax, δ <1%)
Avalanc h e Cu rr ent , Repet itive or Not-Rep etitive

(Tc= 100oC, pulse width l imited by Tjmax, δ <1%)

62.5

0.5

300

8A

350 mJ

11 mJ

5.3 A

o

C/W

o

C/W

o

C/W

o

C

ELECTRICAL CHARACTERISTICS (T

=25oC unless otherwisespecified)

case

OFF

Symbol Parameter Test Conditions Min. Typ. M ax. Unit

V

(BR)DSS

Drain - s ource

ID=250µAVGS= 0 500 V

Break d own Volta ge

I

DSS

I

GSS

Zer o G at e V oltage
Drain Current (VGS=0)

Gat e- body Leakage
Current (V

DS

=0)

VDS=MaxRating
VDS= Max Rating x 0.8 Tc=125oC

= ± 30 V ± 10 0 nA

V

GS

25

250

ON (∗)

Symbol Parameter Test Conditions Min. Typ. M ax. Unit

V

GS(th)

R

DS(on)

Gate Threshold Voltage VDS=VGSID=250µA 2.25 3 3.75 V
St at ic Drain-s our ce O n

VGS=10V ID=4A 0.7 0.85 Ω

Resistance

I

D(on)

On State Drain Current VDS>I

D(on)xRDS(on)max

8A

VGS=10V

DYNAMIC

Symbol Parameter Test Conditions Min. Typ. M ax. Unit

(∗)Forward

g

fs

Tr ansconductance

C
C
C

Input Capacitance

iss

Out put Capacitance

oss

Reverse Transfer

rss

Capacitance

VDS>I

D(on)xRDS(on)maxID

=4A 4.5 6.5 S

VDS=25V f=1MHz VGS= 0 1200

190

55

1600

250

75

µA
µA

pF
pF
pF

2/10

STP8NA50/FI

ELECTRICAL CHARACTERISTICS (continued)

SWITCHING ON

Symbol Parameter Test Conditions Min. Typ. M ax. Unit

t

d(on)

(di/dt)

Q
Q
Q

Turn-on T ime

t

Rise Time

r

Turn-on Current S lope VDD=400V ID=8A

on

Total Gate Charge

g

Gat e- Source Charge

gs

Gate-Drain Charge

gd

SWITCHING OFF

Symbol Parameter Test Conditions Min. Typ. M ax. Unit

t

r(Voff)

t

Off -voltage Rise Time

t

Fall Time

f

Cross-over Time

c

SOURCE DRAINDIODE

VDD=250V ID=4A
RG=4.7 Ω VGS=10V

18
25

(see test circuit, figure 3)

220 A/µs
RG=47 Ω VGS=10V
(see test circuit, figure 5)

VDD= 400 V ID=8A VGS=10V 55

9

25

VDD=400V ID=8A
RG=4.7 Ω VGS=10V
(see test circuit, figure 5)

15
15
25

25
35

75 nC

22
22
35

ns
ns

nC
nC

ns
ns
ns

Symbol Parameter Test Conditions Min. Typ. M ax. Unit

I

I

SDM

SD

Source-drain C urrent

(•)

Source-drain C urrent

8

32

(pulsed)

V

(∗) Forward On Voltage ISD=8A VGS=0 1.6 V

SD

t

Reverse Recovery

rr

Time

Q

Reverse Recovery

rr

ISD=8A di/dt=100A/µs
VDD= 100 V Tj=150oC
(see test circuit, figure 5)

500

6.5

Charge

I

RRM

Reverse Recovery

26

Current

(∗) Pulsed:Pulse duration = 300 µs, dutycycle 1.5 %
(•) Pulse widthlimited by safeoperating area

Safe Operating Areas for TO-220 Safe Operating Areas forISOWATT220

A
A

ns

µC

A

3/10

STP8NA50/FI

Thermal ImpedeanceFor TO-220

Derating Curve For TO-220

Thermal ImpedanceFor ISOWATT220

Derating Curve For ISOWATT220

Output Characteristics

4/10

Transfer Characteristics

Transconductance Static Drain-source On Resistance

Gate Charge vs Gate-source Voltage Capacitance Variations

STP8NA50/FI

Temperature

Normalized On Resistance vs TemperatureNormalized Gate Threshold Voltage vs

5/10

STP8NA50/FI

Turn-on Current Slope Turn-off Drain-source Voltage Slope

Cross-over Time Switching Safe Operating Area

Accidental Overload Area Source-drain Diode ForwardCharacteristics

6/10

STP8NA50/FI

Fig. 1: Unclamped Inductive Load Test Circuits

Fig. 3: Switching Times Test Circuits For

Resistive Load

Fig. 2: Unclamped Inductive Waveforms

Fig. 4: Gate Charge Test Circuit

Fig. 5: Test Circuit For Inductive Load Switching

And Diode Reverse Recovery Time

7/10

STP8NA50/FI

TO-220 MECHANICAL DATA

DIM.

mm inch

MIN. TYP. MAX. MIN. TYP. MAX.

A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107

D1 1.27 0.050

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067

G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409

L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154

DIA. 3.75 3.85 0.147 0.151

E

A

L4

D

F2

F1

G1

H2

G

F

C

D1

L2

Dia.

L5

L7

L6

L9

P011C

8/10

ISOWATT220 MECHANICAL DATA

STP8NA50/FI

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

E 0.4 0.7 0.015 0.027

F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067

G 4.95 5.2 0.195 0.204

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 0.385 0.417
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366

Ø 3 3.2 0.118 0.126

mm inch

E

A

D

B

L3

L6

L7

Ø

F1

F

G1

H

G

F2

123

L2

L4

P011G

9/10

STP8NA50/FI

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such informationnor for any infringement of patents or other rights of third parties which mayresults fromits use. No
licenseis grantedby implication orotherwise underany patent or patentrights ofSGS-THOMSONMicroelectronics. Specifications mentioned
in thispublication aresubject to change withoutnotice. Thispublication supersedes and replaces all information previously supplied.
SGS-THOMSONMicroelectronics products are notauthorized for use as critical components in lifesupportdevices orsystemswithout express
writtenapproval ofSGS-THOMSONMicroelectonics.

 1996 SGS-THOMSON Microelectronics -Printedin Italy- All Rights Reserved

Australia- Brazil -Canada -China - France- Germany - Hong Kong - Italy -Japan- Korea-Malaysia - Malta - Morocco -The Netherlands -

Singapore - Spain- Sweden- Switzerland- Taiwan- Thailand- UnitedKingdom - U.S.A

SGS-THOMSONMicroelectronics GROUPOF COMPANIES

.

10/10