Datasheet STB80NF55-06, STB80NF55-06-1, STP80NF55-06, STP80NF55-06FP Datasheet (ST)

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STB80NF55-06 STB80NF55-06-1
1
3
3
1
3
3
STP80NF55-06 STP80NF55-06FP
N-CHANNEL 55V - 0.005 Ω - 80A TO-220/TO-220FP/I
STripFET™ II POWER MOSFET
TYPE
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
EXCEPTIONAL dv/dt CAPABILITY
100% AVALANCHE TESTED
APPLICATION ORIENTED
DS
V
DSS
55 V 55 V 55 V
(on) = 0.005
CHARACTERIZATION
SURFACE-MOUNTING D
POWER PACKAGE IN TU BE (NO SUFFIX) OR IN TAPE & REEL (SUFFIX “T4”)
DESCRIPTION
This Power MOSFET is the latest development of STMicroelectronis unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high p acking density for low on­resistance, rugged ava lanche characteristics and less critical alignment steps therefore a remark­able manufacturing reproducibility.
R
DS(on)
<0.0065
<0.0065 <0.0065
2
PAK (TO-263)
I
D
80 A 80 A 60 A
TO-220FP
2
2
PAK
1
²
I
TO-262
(Suffix “-1”)
INTERNAL SCHEMATIC DIAGRAM
²
PAK/D²PAK
TO-220
1
D²PAK
TO-263
(Suffix “T4”)
2
APPLICATIONS
HIGH-EFFICIENCY DC-DC CONVERTERS
UPS AND MOTOR CONTROL
DC-DC CONVERTERS
AUTOMOTIVE ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STB80NF55-06/-1
STP80NF55-06
I
V
DM
V
DGR
V
I I
P
DS
GS
D D
(•)
tot
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate- source Voltage ± 20 V Drain Current (conti nuo us ) at TC = 25°C Drain Current (conti nuo us ) at TC = 100°C
80 60 A
80 42 A Drain Current (pulse d) 320 240 A Total Dissipation at TC = 25°C
300 45 W
Derating Factor 2 0.30 W/°C
(1)
dv/dt
E
AS
V
ISO
T
stg
T
j
(•) Pulse width limited by safe operating area. (1) I
NEW DATASHEET ACCORDING TO PCN DSG/CT/2C13 MARKING: P80NF55-06 @ B80NF55-06 @ P80NF55-06 @
Peak Diode Recove ry vo ltag e slo pe 7 V/ns
(2)
Single Pulse Avalanche Energy 1.3 J Insulation Withstand Voltage (DC) ------ 2500 V Storage Temperature Operating Junction Temperature
80A, di/dt 400A/µs, VDD V
SD
(2) Starting Tj = 25 oC, ID = 40A, VDD= 35V
STP80NF55-06FP
55 V 55 V
-55 to 175 °C
, Tj T
(BR)DSS
JMAX
1/12February 2004
Page 2
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
THERMAL DATA
D2PAK/I2PAK/
TO-220
Rthj-case Thermal Resistance Junction-case Max 0.5 3.33 °C/W
Rthj-amb
T
Thermal Resistance Junction-ambient Maximum Lead Temperature For Soldering Purpose
l
Max 62.5
TO-220FP
300
°C/W
°C
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
= 250 µA, VGS = 0
D
V
= Max Rating
DS
= Max Rating TC = 125°C
V
DS
= ± 20 V
V
GS
55 V
1
10
±100 nA
ON
V
(BR)DSS
I
DSS
I
GSS
(*)
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
V
= VGS ID = 250 µA
DS
V
= 10 V ID = 40 A
GS
234V
0.005 0.0065
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(*)
g
fs
C
iss
C
oss
C
rss
Forward Transconductance Input Capacitance
Output Capacitance Reverse Transfer Capacitance
V
= 15 V ID=40 A
DS
V
= 25V, f = 1 MHz, VGS = 0
DS
150 S
4400 1020
350
µA µA
pF pF pF
2/12
Page 3
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time
Total Ga te Char ge Gate-Source Charg e Gate-Drain Charge
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off Delay Time Fall Time
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
(*)
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
(
•)Pulse width limited by safe operating area.
Source-drain Curre nt
(•)
Source-drain Curre nt (pu lse d)
(*)
Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
= 27 V ID = 40 A
DD
=4.7 Ω VGS = 10 V
R
G
(Resistive Load, Figu re 3) V
= 44 V ID= 80 A VGS= 10V
DD
V
= 27 V ID = 40 A
DD
=4.7Ω, V
R
G
GS
= 10 V
(Resistive Load, Figu re 3)
I
= 80 A VGS = 0
SD
I
= 80 A di/dt = 100A/µs
SD
= 35 V Tj = 150°C
V
DD
(see test circuit, Figure 5)
27
155
142
29
60.5
125
65
100
0.32
6.5
193 nC
80
320
1.5 V
ns ns
nC nC
ns ns
A A
ns
µC
A
Safe Operating Area for TO-220FPSafe Operating Area for TO-220
3/12
Page 4
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
Thermal Impedance Thermal Impedance for TO-220FP
Output Characteristics Transfer Characteristics
Transconductance Static Drain-source On Resistance
4/12
Page 5
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
Gate Charge vs Gate-so urc e Vol tag e Capacitance Variations
Normalized Gate Threshold Voltage vs Temperature Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics Normalized Breakdown Voltage Temperature
5/12
Page 6
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
Fig. 1: Unclamped Inductive Load Test CircuitFig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For Resistive
Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/12
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STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
D2PAK MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.028 0.037 B2 1.14 1.7 0.045 0.067
C 0.45 0.6 0.018 0.024 C2 1.21 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368 D1 8 0.315
E 10 10.4 0.394 0.409 E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.591 0.624 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.069
M 2.4 3.2 0.094 0.126
R 0.4 0.016 V2
MIN. TYP. MAX. MIN. TYP. TYP.
mm. inch.
0.106
7/12
Page 8
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
TO-262 (I2PAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
e 2.4 2.7 0.094 0.106 E 10 10.4 0.393 0.409
L 13.1 13.6 0.515 0.531 L1 3.48 3.78 0.137 0.149 L2 1.27 1.4 0.050 0.055
mm inch
C
A
A1
C2
B2
B
e
E
L1
L2
D
L
P011P5/E
8/12
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STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
TO-220 MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409 L2 16.40 0.645 L3 28.90 1.137 L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.260 L9 3.50 3.93 0.137 0.154
DIA 3.75 3.85 0.147 0.151
MIN. TYP. MAX. MIN. TYP. TYP.
mm. inch.
9/12
Page 10
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
TO-220FP MECHANICAL DAT A
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
mm inch
A
B
H
E
D
L3
L6
L7
¯
F1
F
G1
G
F2
123
L2
L4
10/12
Page 11
STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
D2PAK FOOTPRINT
TAPE AND REEL SH IPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0075 0.082
R 50 1.574
T 0.25 0.35 .0.0098 0.0137
W 23.7 24.3 0.933 0.956
mm inch
MIN. MAX. MIN. MAX.
* on sales type
BASE QTY BULK QTY
1000 1000
11/12
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STB80NF55-06/-1 STP80NF55-06 STP80NF55-06FP
I
s
o
d
b
ct
t
ot
a
nformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequence
f use of such information nor for any infrin gement of patents or other rights of third parties which may resul t from its use. No license is grant e y implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subje
o change without notice. This publication supersed es and replaces all information previously supplied. ST Mic r oelectronics products are n
uthorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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