Datasheet STP80NF03L Datasheet (SGS Thomson Microelectronics)

Page 1
STP70NF03L
N-CHANNEL 30V - 0.008
- 70A TO-220
LOW GATE CHARGE STripFETPOWER MOSFET
PRELIMINARY DATA
TYPICALR
= 0.008
TYPICALQ
g
= 35 nC @ 10V
OPTIMAL R
DS(on)xQg
TRADE-OFF
CONDUCTIONLOSSESREDUCED
SWITCHINGLOSSESREDUCED
DESCRIPTION
This applicationspecific Power Mosfet is the third generation of STMicroelectronics unique ”Single Feature Size” strip-based process. The resul­ting transistor shows the best trade-off between on-resistance and gate charge. When used as high and low side in buck regulators, it gives the best performancein termsof both conductionand switching losses. This is extremely important for motherboardswhere fast switching and high effi­ciencyare of paramount importance.
APPLICATIONS
SPECIFICALLYDESIGNED AND
OPTIMISEDFOR HIGH EFFICIENCYCPU CORE DC/DC CONVERTERS
INTERNAL SCHEMATIC DIAGRAM
October 1999
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
Dra in- sour c e Volt age (VGS=0) 30 V
V
DGR
Dra in- gate V ol t age ( RGS=20kΩ)30V
V
GS
Gat e-source Voltage
±
20 V
I
D
Dra in C u rr ent (c ontinuous) a t Tc=25oC70A
I
D
Dra in C u rr ent (c ontinuous) a t Tc=100oC50A
I
DM
() Drain Cu rrent (p ulsed) 280 A
P
tot
Tot al Dissipation at Tc=25oC 100 W Der ati ng Fac t or 0.67 W/
o
C
T
stg
St orage Temperature -65 t o 175
o
C
T
j
Max. O perating Junction T emper at ure 175
o
C
() Pulse width limited by safeoperating area
TYPE V
DSS
R
DS(on)
I
D
ST P70NF03L 30 V < 0. 01 70 A
1
2
3
TO-220
1/6
Page 2
THERMAL DATA
R
thj-case
R
thj-amb
T
l
Ther mal Resistanc e Junct ion-case Max Ther mal Resistanc e Junct ion-ambient Max Maximum Lead Te m pe ra tur e For So lder ing Purpose
1.5
62.5 300
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
(T
case
=25oC unless otherwisespecified)
OFF
Symbol Parameter Test Condit ions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Break dow n V o lt age
ID=250µAVGS=0 30 V
I
DSS
Zero Gate Voltage Drain Cur re nt ( V
GS
=0)
V
DS
=MaxRating
V
DS
=MaxRating Tc=125oC
1
10
µA µ
A
I
GSS
Gat e- bod y L eakage Current (V
DS
=0)
V
GS
= ± 20 V ± 100 nA
ON(∗)
Symbol Parameter Test Condit ions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage VDS=VGSID= 250 µA12.5V
R
DS(on)
Sta t ic Drain -s ource On Resistance
VGS=10V ID=35A V
GS
=4.5V ID=35A
0.008
0.011
0.01
0.014
Ω Ω
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on)ma x
VGS=10V
70 A
DYNAMIC
Symbol Parameter Test Condit ions Min. Typ. Max. Unit
g
fs
(∗)Forward
Tr ansc on duc tance
VDS>I
D(on)xRDS(on)ma xID
=35 A 40 S
C
iss
C
oss
C
rss
Input Capac i t ance Out put Capacitanc e Reverse Tr ansfer Capacit a nc e
VDS=25V f=1MHz VGS= 0 1650
800 170
pF pF pF
STP70NF03L
2/6
Page 3
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
Symbol Parameter Test Condit ions Min. Typ. Max. Unit
t
d(on)
t
r
Tur n-on Delay Tim e Rise Ti me
VDD=15V ID=35A R
G
=4.7
VGS=4.5V
(Resis t iv e Loa d, s ee fig. 3)
20
350
ns ns
Q
g
Q
gs
Q
gd
Tot al Gat e Charge Gat e- Source Charge Gate-Drain Charge
VDD=24V ID=46A VGS=10V 35
5
10
45 nC
nC nC
SWITCHINGOFF
Symbol Parameter Test Condit ions Min. Typ. Max. Unit
t
d(off)
t
f
Tur n-of f Delay Tim e Fall T ime
VDD=15V ID=35A R
G
=4.7
VGS=4.5V
(Resis t iv e Loa d, s ee fig. 3)
35 65
ns ns
SOURCEDRAINDIODE
Symbol Parameter Test Condit ions Min. Typ. Max. Unit
I
SD
I
SDM
(•)
Source-drain Current Source-drain Current (pulsed)
70
280
A A
V
SD
(∗)ForwardOnVoltage ISD=70 A VGS=0 1.5 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
ISD= 70 A di/dt = 100 A /µs V
DD
=15V Tj=150oC
(see test circuit, fig. 5)
70
105
2.4
ns
nC
A
(∗) Pulsed:Pulse duration= 300µs, duty cycle 1.5% () Pulse width limited by safe operatingarea
STP70NF03L
3/6
Page 4
Fig. 1:
UnclampedInductiveLoad Test Circuit
Fig. 3: SwitchingTimes Test Circuits For ResistiveLoad
Fig. 2:
UnclampedInductive Waveform
Fig. 4: Gate Chargetest Circuit
Fig. 5:
Test CircuitFor InductiveLoad Switching
And Diode Recovery Times
STP70NF03L
4/6
Page 5
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
L6
A
C
D
E
D1
F
G
L7
L2
Dia.
F1
L5
L4
H2
L9
F2
G1
TO-220 MECHANICAL DATA
P011C
STP70NF03L
5/6
Page 6
Information furnishedis believed tobeaccurateand reliable.However, STMicroelectronics assumes no responsibilityforthe consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationmentioned in this publicationare subjecttochange without notice.This publication supersedes andreplacesall information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systemswithout express written approval of STMicroelectronics.
The STlogo is a trademark of STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
.
STP70NF03L
6/6
Loading...