Datasheet STP7NK40ZFP, STP7NK40Z, STD7NK40Z-1, STD7NK40Z Datasheet (SGS Thomson Microelectronics)

Page 1
STP7NK40Z - STP7NK40ZFP
STD7NK40Z - STD7NK40Z-1
N-CH A NNEL 400V-0.85-5.4A TO-220/TO-220FP/DPAK/IPAK
Zener-Protected SuperMESH™Power MOSFET
TYPE V
STP7NK40Z STP7NK40ZFP STD7NK40Z STD7NK40Z-1
TYPICAL R
100% AVALANCHE TESTED
GATE CHARGE MINIMIZED
VERY LOW INTRINSIC CAPAC ITANCES
VERY GOOD MANUFACTURING
400 V 400 V 400 V 400 V
(on) = 0.85
DS
DSS
R
DS(on)
< 1 < 1 < 1 < 1
I
D
5.4 A
5.4 A
5.4 A
5.4 A
Pw
70 W 25 W 70 W 70 W
REPEATIBILITY
DESCRIPTION
The SuperMESH™ series is obtained through an extreme optimization of ST ’s well established strip­based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is tak­en to ensure a very good dv/dt capability for the most demanding applications. Such series c om pl e­ments ST full range of high voltage MOSFE Ts in­cluding revolutionary MDmesh™ products.
TO-220 TO-220FP
3
1
DPAK
IPAK
INTERNAL SCHEMATIC DIAGRAM
3
2
1
3
2
1
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
IDEAL FOR OFF-LIN E POWER SUPPL I ES,
ADAPTORS AND PFC
LIGHTING
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP7NK40Z P7NK40Z TO-220 TUBE STP7NK40ZFP P7NK40ZFP TO-220FP TUBE STD7NK40ZT4 D7NK40Z DPAK TAPE & REEL
STD7NK40Z-1 D7NK40Z IPAK TUBE
1/13September 2002
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STP7NK40Z - STP7NK40ZFP - S TD7N K40Z - STD7NK40Z-1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP7NK40Z STP7NK40ZFP
V
I
V
V
DM
P
DS
DGR
GS
I
D
I
D
TOT
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 k)
400 V 400 V
Gate- source Voltage ± 30 V
Drain Current (continuous) at TC = 25°C Drain Current (continuous) at TC = 100°C
(l)
Drain Current (pulsed) 21.6 21.6 (*) 21.6 A Total Dissipation at TC = 25°C
5.4 5.4 (*) 5.4 A
3.4 3.4 (*) 3.4 A
70 25 70 W
Derating Factor 0.56 0.2 0.56 W/°C
V
ESD(G-S)
Gate source ESD(HBM-C=100pF, R=1.5KΩ) 3000 V
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
V
ISO
T
j
T
stg
(l) Pulse wi dth limited by safe operating area (1) I
5.4A, di/dt 200A/µs, VDD V
SD
(*) Limited only by maximum temperature allowed
Insulation Withstand Voltage (DC) - 2500 - V Operating Junction Temperature
Storage Temperature
, Tj T
(BR)DSS
JMAX.
-55 to 150
-55 to 150
STD7NK40Z
STD7NK40Z-1
°C °C
THERMA L D ATA
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 1.78 5 1.78 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 100 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose
300 °C
DPAK
IPAK
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
= 25 °C, ID = IAR, VDD = 50 V)
j
5.4 A
130 mJ
GATE-SOURCE ZENER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain) 30 V
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components.
2/13
Page 3
STP7NK40Z - STP7NK40Z FP - STD7NK40Z - STD7NK40Z-1
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SPECIFIED)
CASE
ON/OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID =1 mA, VGS = 0 400 V
Breakdown Voltage
I
I
V
R
DSS
GSS
GS(th) DS(on)
Zero Gate Voltage Drain Current (V
GS
= 0)
Gate-body Leakage Current (V
DS
= 0) Gate Threshold Voltage Static Drain-source On
V
= Max Rating
DS
VDS = Max Rating, TC = 125 °C
V
= ± 20V ±10 µA
GS
V
= VGS, ID = 50µA
DS
3 3.75 4.5 V
1
50
VGS = 10V, ID = 2.7 A 0.85 1
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(1) Forward Transconductance VDS =15 V, ID= 2.7 A 3.5 S
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
(3) Equivalent Output
= 25V, f = 1 MHz, VGS = 0 535
V
DS
82 18
VGS = 0V, VDS = 0V to 400V 53 pF
Capacitance
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Q Q Q
Turn-on Delay Time
t
r
g gs gd
Rise Time
Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD = 200 V, ID = 2.7 A RG= 4.7 VGS = 10 V (Resistive Load see, Figure 3)
= 320V, ID = 5.4 A,
V
DD
VGS = 10V
15 15
19 10
26 nC
4
µA µA
pF pF pF
ns ns
nC nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off Delay Time
t
f
Fall Time
VDD = 200 V, ID = 2.7A RG=4.7Ω VGS = 10 V
30 12
(Resistive Load see, Figure 3)
t
r(Voff)
t
t
= 320V, ID = 5.4A,
Off-voltage Rise Time
f
c
Fall Time Cross-over Time
V
DD
RG=4.7Ω, V
GS
= 10V
(Inductive Load see, Figure 5)
12 10 20
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pu l se duration = 300 µs, duty c ycle 1.5 %.
2. Pulse width li mited by safe operating area.
3. C
Source-drain Current
(2)
Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
V
.
DSS
ISD = 5.4 A, VGS = 0 I
SD
V (see test circuit, Figure 5)
= 5.4 A, di/dt = 100A/µs
= 50V, Tj = 150°C
DD
220 990
9
when VDS increase s fr om 0 to 80%
oss
5.4
21.6
1.6 V
ns ns
ns ns ns
A A
ns
nC
A
3/13
Page 4
STP7NK40Z - STP7NK40ZFP - S TD7N K40Z - STD7NK40Z-1
Safe Operating Area For TO-220FPSafe Operating Area For TO-220/DPAK/IPAK
Thermal Impedance For TO-220/DPAK/IPAK
Output Characteristics
Thermal Impedance For TO-220FP
Transfer Characteristics
4/13
Page 5
STP7NK40Z - STP7NK40Z FP - STD7NK40Z - STD7NK40Z-1
Static Drain-source On ResistanceTrans c onductance
Capacitance VariationsGate Charge vs Gate-source Voltage
Normalized On Resistance vs Temperatur eNormalized Gate Threshold Volta ge vs Temp.
5/13
Page 6
STP7NK40Z - STP7NK40ZFP - S TD7N K40Z - STD7NK40Z-1
Source-drain Diode Forward Characteristics Normalized BVDSS vs Temperature
Maximum Avalanche Energy vs Temperature
6/13
Page 7
STP7NK40Z - STP7NK40Z FP - STD7NK40Z - STD7NK40Z-1
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
7/13
Page 8
STP7NK40Z - STP7NK40ZFP - S TD7N K40Z - STD7NK40Z-1
E
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A
C
D
8/13
L5
Dia.
L7
D1
L6
L2
L9
F1
G1
F
H2
G
F2
L4
P011C
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STP7NK40Z - STP7NK40Z FP - STD7NK40Z - STD7NK40Z-1
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.5 0.045 0.067 F2 1.15 1.5 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L5
L4
9/13
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STP7NK40Z - STP7NK40ZFP - S TD7N K40Z - STD7NK40Z-1
TO-252 (DPAK) MECHANICAL DATA
DIM.
A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213
C 0.45 0.60 0.018 0.024
C2 0.48 0.60 0.019 0.024
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0
MIN. TYP. MAX. MIN. TYP. MAX.
o
mm inch
o
8
o
0
o
0
10/13
P032P_B
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STP7NK40Z - STP7NK40Z FP - STD7NK40Z - STD7NK40Z-1
TO-251 (IPAK) MECHANICAL DAT A
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
H
C
A
C2
E
= =
L2
B2
= =
D
B3
2
1 3
L1
A1
L
B6
A3
B
B5
G
= =
0068771-E
11/13
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STP7NK40Z - STP7NK40ZFP - S TD7N K40Z - STD7NK40Z-1
DPAK FOOTPRINT
All dimensions are in millimeters
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
All dimensions
are in millimeters
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881
mm inc h
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16 .3 0.618 0.641
* on sales type
12/13
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
2500 2500
Page 13
STP7NK40Z - STP7NK40Z FP - STD7NK40Z - STD7NK40Z-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for t he consequences of use of su ch in formation nor for any in fringement of patents or other rights of third parties w hich may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously suppli ed. STMi croelect ronics pr oducts are not author ized for use as cr itical component s in li fe suppo rt devi ces or systems without express written approval of STMicroelectronics.
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