Datasheet STP6LNC60FP, STP6LNC60 Datasheet (SGS Thomson Microelectronics)

Page 1
STP6LNC60
STP6LNC60FP
N-CHANNEL 600V - 1- 5.8A TO-220/TO-220FP
PowerMesh™II MOSFET
TYPE V
STP6LNC60 STP6LNC60FP
TYPICAL R
EXTREMELY HIGH dv /d t CAPABILITY
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
DS
DSS
600 V 600 V
(on) = 1.0
R
DS(on)
< 1.25 < 1.25
I
D
5.8 A
5.8 A
DESCRIPTION
The PowerMESH generation of MESH OVERLAY
II is the evolution of the first
™. The layout re-
finements introduced greatly improve the Ron*area figure of merit while keeping the device at the lea d­ing edge for what concerns switching speed, gate charge and ruggedness.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SWITH MODE POWER SUPPLI ES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVES
TO-220
TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP6LNC60 STP6LNC60FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt (1) Peak Diode Recovery voltage slope 3 V/ns
V
ISO
T
stg
T
j
(•)Pu l se width limite d by safe operat i ng area (*) Limited only by maximum temperature allowed
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 k)
600 V 600 V
Gate- source Voltage ±30 V
Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C
()
Drain Current (pulsed) 23.2 23.2 (*) A Total Dissipation at TC = 25°C
5.8 5.8 (*) A
3.65 3.65 (*) A
100 35 W
Derating Factor 0.8 0.28 W/°C
Insulation Withstand Voltage (DC) - 2500 V Storage Temperature Max. Operating Junction Temperature
(1)ISD 5.8A, di/dt ≤100A/µs, VDD V
–65 to 150 °C
(BR)DSS
, Tj T
JMAX.
1/9October 2001
Page 2
STP6LNC60/STP6LNC60FP
THERMA L D ATA
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 1.25 3.53 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source
= 25 °C, ID = IAR, VDD = 50 V)
j
ID = 250 µA, VGS = 0 600 V
5.8 A
300 mJ
Breakdown Voltage Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
V
= Max Rating
DS
V
= Max Rating, TC = 125 °C
DS
V
= ±30V ±100 nA
GS
A
50 µA
ON
(1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
= VGS, ID = 250µA
DS
VGS = 10V, ID = 3 A
234V
1.0 1.25
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS > I
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 120 pF Reverse Transfer
Capacitance
ID=3A
V
DS
D(on)
x R
DS(on)max,
= 25V, f = 1 MHz, VGS = 0
6S
830 pF
15.5 pF
2/9
Page 3
STP6LNC60/STP6LNC60FP
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time 15.5 ns Total Gate Charge
Gate-Source Charge 4.8 nC Gate-Drain Charge 17.5 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
f
t
c
Off-voltage Rise Time Fall Time 7.5 ns Cross-over Time 16 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cycle 1.5 %.
2. Pulse width li mited by safe operating area .
Source-drain Current 5.8 A
(2)
Source-drain Current (pulsed) 23.2 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge 2.4 µC Reverse Recovery Current 10.6 A
= 300 V, ID = 3 A
DD
RG= 4.7 VGS = 10 V (see test circuit, Figure 3)
V
= 480V, ID = 6 A,
DD
VGS = 10V
V
= 480V, ID = 6 A,
DD
RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 5)
ISD = 6 A, VGS = 0 I
=6 A, di/dt = 100A/µs
SD
VDD = 100V, Tj = 150°C (see test circuit, Figure 5)
14.5 ns
28 39 nC
9ns
1.6 V
450 ns
Safe Operating Area for TO-220 Safe Operating Area for TO-220FP
3/9
Page 4
STP6LNC60/STP6LNC60FP
Thermal Impedence for TO-220FPThermal Impedence for TO-220
Output Characteristics
Transconductance Static Drain-source On Resistance
Transfer Characteristics
4/9
Page 5
STP6LNC60/STP6LNC60FP
Gate Charge vs Gate-source Voltage Capacitance Variations
Normalized Gate Thereshold Voltage vs Temp. Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
5/9
Page 6
STP6LNC60/STP6LNC60FP
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/9
Page 7
E
TO-220 MECHANICAL DATA
STP6LNC60/STP6LNC60FP
DIM.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A
C
D
L5
Dia.
L7
D1
L6
L2
L9
F1
G1
F
H2
G
F2
L4
P011C
7/9
Page 8
STP6LNC60/STP6LNC60FP
TO-220FP MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
mm inch
E
A
D
8/9
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L4
Page 9
STP6LNC60/STP6LNC60FP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such informa tion n or for an y infring ement of patent s or other rig hts of third part ies which may resu lt from its use . No l i cen se i s granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical compo nents in life support devices or systems without express written approval of STMicroelectronics.
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -
The ST logo is a trademark of STMicroelectronics
© 2000 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
9/9
Loading...