Datasheet STP60NE10FP, STP60NE10 Datasheet (SGS Thomson Microelectronics)

Page 1
STP60NE10
STP60NE10FP
N - CHANNEL 100V - 0.016- 60A TO-220/TO-220FP
STripFET POWER MOSFET
TYPE V
ST P60NE10 ST P60NE10FP
TYPICALR
EXCEPTIONALdv/dt CAPABILITY
APPLICATIONORIENTED
DS(on)
DSS
100 V 100 V
= 0.016
CHARACTERIZATION
DESCRIPTION
This PowerMOSFET is the latest developmentof STMicroelectronics unique ”Single Feature Size” strip-based process.The resulting transi- stor showsextremelyhigh packing densityfor low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a re­markablemanufacturingreproducibility.
APPLICATIONS
SOLENOIDAND RELAYDRIVERS
MOTORCONTROL, AUDIOAMPLIFIERS
DC-DCCONVERTERS
AUTOMOTIVEENVIRONMENT(INJECTION,
ABS, AIR-BAG, LAMPDRIVERS,Etc.)
R
DS(on)
<0.022 <0.022
I
D
60 A 30 A
3
2
1
TO-220 TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
ST P60NE10 ST P60NE10FP
V
V
V
I
DM
P
V
dv/ dt Peak Diode Recovery v olt a ge slope 7 V/ns
T
() Pulsewidth limited by safeoperating area (1)ISD≤ 60 A, di/dt ≤ 300 A/µs, VDD≤ V
May 1999
Drain-source Voltage (VGS= 0) 100 V
DS
Drain- gate Voltage (RGS=20kΩ) 100 V
DGR
Gate-source Voltage ± 20 V
GS
I
Drain Curre nt (cont inuous) at Tc=25oC6030A
D
Drain Curre nt (cont inuous) at Tc=100oC4221A
I
D
(•) Dr ain Curre nt (pulse d) 240 120 A
Total Dissipation at Tc=25oC 160 50 W
tot
Derat ing F ac tor 1.06 0.37 W/ Ins ulat ion W ithstand Voltage (DC) 20 00 V
ISO
Sto rage Temperat ure -65 t o 175
stg
T
Max. Oper ating Junction Tempe rat ure 175
j
(BR)DSS,Tj≤TJMAX
o
C
o
C
o
C
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Page 2
STP60NE10/FP
THERMAL DATA
TO-220 TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max V alue Unit
I
AR
E
Ther mal Resistanc e Junct ion-case Max 0.94 2.7 Ther mal Resistanc e Junct ion-ambient Max
Ther mal Resistanc e Case-sink Ty p Maximum L ead Temperature F or Solder ing Purpose
l
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
Single Pul se Avalanche E nergy
AS
(starting T
=25oC, ID=IAR,VDD=35V)
j
max)
j
62.5
0.5
300
60 A
100 mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=250µAVGS= 0 100 V
Break dow n Vo lt age
I
DSS
I
GSS
Zero Gate Voltage Drain Curre nt (V
GS
Gat e- bod y Leakage Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRating Tc= 125oC
V
DS
V
=± 20 V
GS
1
10
100 nA
±
ON (∗)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID= 250µA 234V Sta t ic Drain-s ource O n
VGS=10V ID= 30 A 0.016 0.022
Resistance
I
D(on)
On StateDrain Current VDS>I
D(on)xRDS(on )max
60 A
VGS=10V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci t ance
iss
Out put Capac it ance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=18 A 30 S
VDS=25V f=1MHz VGS= 0 5300
640 215
µA µA
pF pF pF
2/9
Page 3
STP60NE10/FP
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
Tur n-on Delay Time Rise Time
r
VDD=50V ID=30A R
=4.7
G
VGS=10V
28
100
(Resis t iv e Load, s ee f ig. 3 )
Q Q Q
Tot al Gate Charge
g
Gat e- Source Char g e
gs
Gate-Drain Charge
gd
VDD=80V ID=60A VGS= 10 V 142
27 59
185 nC
SWITCHINGOFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Tur n-of f Dela y T ime
t
Fall T ime
f
VDD=50V ID=30A
=4.7 VGS=10V
R
G
160
45
(Resis t iv e Load, s ee f ig. 3 )
t
r(Voff)
t
t
Off-volt age Rise Time Fall T ime
f
Cross-over Tim e
c
V
=80V ID=60A
clamp
=4.7 Ω VGS=10V
R
G
(Indu ctive Load , see fig . 5)
40 45 85
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300µs, duty cycle 1.5 % () Pulse width limited by safe operating area
Sou rc e-d rai n Cu rre nt
(•)
Sou rc e-d rai n Cu rre nt
60
240
(pulsed)
(∗)ForwardOnVoltage ISD=60A VGS=0 1.5 V
Reverse Recovery
rr
Time Reverse Recovery
rr
ISD= 60 A di /dt = 100 A/µs
=50V Tj=150oC
V
DD
(s ee t est c ircu it , f ig. 5)
170
1.02 Charge Reverse Recovery
12
Current
ns ns
nC nC
ns ns
ns ns ns
A A
ns
µC
A
Safe Operating Areafor TO-220 Safe Operating Areafor TO-220FP
3/9
Page 4
STP60NE10/FP
ThermalImpedancefor TO-220
OutputCharacteristics
ThermalImpedanceforTO-220FP
TransferCharacteristics
Transconductance
4/9
Static Drain-sourceOn Resistance
Page 5
STP60NE10/FP
Gate Charge vs Gate-sourceVoltage
NormalizedGate ThresholdVoltage vs Temperature
CapacitanceVariations
NormalizedOn Resistancevs Temperature
Source-drainDiode Forward Characteristics
5/9
Page 6
STP60NE10/FP
Fig. 1: UnclampedInductiveLoad Test Circuit
Fig. 3: SwitchingTimesTest CircuitsFor ResistiveLoad
Fig. 2:UnclampedInductive Waveform
Fig. 4: Gate Charge test Circuit
Fig. 5: TestCircuit ForInductiveLoad Switching And Diode Recovery Times
6/9
Page 7
TO-220 MECHANICALDATA
STP60NE10/FP
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409
L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
mm inch
E
A
L4
D
F2
F1
G1
H2
G
F
P011C
C
D1
L2
Dia.
L5
L7
L6
L9
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Page 8
STP60NE10/FP
TO-220FP MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
mm inch
E
A
D
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L4
8/9
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STP60NE10/FP
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