This PowerMOSFET is the latest developmentof
STMicroelectronicsunique”SingleFeature
Size” strip-based process.The resulting transi-
stor showsextremelyhigh packing densityfor low
on-resistance, rugged avalanche characteristics
and less critical alignment steps therefore a remarkablemanufacturingreproducibility.
APPLICATIONS
■ SOLENOIDAND RELAYDRIVERS
■ MOTORCONTROL, AUDIOAMPLIFIERS
■ DC-DCCONVERTERS
■ AUTOMOTIVEENVIRONMENT(INJECTION,
ABS, AIR-BAG, LAMPDRIVERS,Etc.)
R
DS(on)
<0.022Ω
<0.022Ω
I
D
60 A
30 A
3
2
1
TO-220TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
ST P60NE10ST P60NE10FP
V
V
V
I
DM
P
V
dv/ dtPeak Diode Recovery v olt a ge slope7V/ns
T
(•) Pulsewidth limited by safeoperating area(1)ISD≤ 60 A, di/dt ≤ 300 A/µs, VDD≤ V
May 1999
Drain-source Voltage (VGS= 0)100V
DS
Drain- gate Voltage (RGS=20kΩ)100V
DGR
Gate-source Voltage± 20V
GS
I
Drain Curre nt (cont inuous) at Tc=25oC6030A
D
Drain Curre nt (cont inuous) at Tc=100oC4221A
I
D
(•)Dr ain Curre nt (pulse d)240120A
Total Dissipation at Tc=25oC16050W
tot
Derat ing F ac tor1.060.37W/
Ins ulat ion W ithstand Voltage (DC)20 00V
ISO
Sto rage Temperat ure-65 t o 175
stg
T
Max. Oper ating Junction Tempe rat ure175
j
(BR)DSS,Tj≤TJMAX
o
C
o
C
o
C
1/9
Page 2
STP60NE10/FP
THERMAL DATA
TO-220TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax V alueUnit
I
AR
E
Ther mal Resistanc e Junct ion-caseMax0.942.7
Ther mal Resistanc e Junct ion-ambientMax
Ther mal Resistanc e Case-sinkTy p
Maximum L ead Temperature F or Solder ing Purpose
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pul se Avalanche E nergy
AS
(starting T
=25oC, ID=IAR,VDD=35V)
j
max)
j
62.5
0.5
300
60A
100mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS= 0100V
Break dow n Vo lt age
I
DSS
I
GSS
Zero Gate Voltage
Drain Curre nt (V
GS
Gat e- bod y Leakage
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingTc= 125oC
V
DS
V
=± 20 V
GS
1
10
100nA
±
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID= 250µA234V
Sta t ic Drain-s ource O n
VGS=10V ID= 30 A0.0160.022
Resistance
I
D(on)
On StateDrain Current VDS>I
D(on)xRDS(on )max
60A
VGS=10V
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci t ance
iss
Out put Capac it ance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=18 A30S
VDS=25V f=1MHzVGS= 05300
640
215
µA
µA
Ω
pF
pF
pF
2/9
Page 3
STP60NE10/FP
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
Tur n-on Delay Time
Rise Time
r
VDD=50VID=30A
R
=4.7
G
Ω
VGS=10V
28
100
(Resis t iv e Load, s ee f ig. 3 )
Q
Q
Q
Tot al Gate Charge
g
Gat e- Source Char g e
gs
Gate-Drain Charge
gd
VDD=80V ID=60A VGS= 10 V142
27
59
185nC
SWITCHINGOFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(off)
Tur n-of f Dela y T ime
t
Fall T ime
f
VDD=50VID=30A
=4.7 ΩVGS=10V
R
G
160
45
(Resis t iv e Load, s ee f ig. 3 )
t
r(Voff)
t
t
Off-volt age Rise Time
Fall T ime
f
Cross-over Tim e
c
V
=80VID=60A
clamp
=4.7 ΩVGS=10V
R
G
(Indu ctive Load , see fig . 5)
40
45
85
SOURCE DRAIN DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
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