This Power Mosfet is the latest development of
STMicroelectronisunique ”Single Feature Size”
strip-based process. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalanche characteristicsand
less critical alignment steps therefore a remarkable manufacturingreproducibility.
R
DS(on)
<0.016Ω
<0.016Ω
I
D
60 A
35 A
STP60NE06L-16FP
STripFETPOWER MOSFET
3
2
1
TO-220TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
APPLICATIONS
■ HIGHCURRENT, HIGH SPEED SWITCHING
■ SOLENOIDAND RELAYDRIVERS
■ DC-DC& DC-ACCONVERTERS
■ AUTOMOTIVEENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STP 60NE06L- 16STP 60NE 0 6L - 16 F P
V
V
V
I
DM
P
V
dv/ dtPeak Diode Recovery voltage slope6V/ ns
T
(•) Pulsewidth limited by safeoperating area(1)ISD≤ 60 A, di/dt ≤ 300 A/µs, VDD≤ V
May 2000
Drain-source Voltage (VGS=0)60V
DS
Drain- gate Voltage (RGS=20kΩ)60V
DGR
Gate-source Voltage± 15V
GS
I
Drain Curre nt (cont i nuous) at Tc=25oC6035A
D
Drain Curre nt (cont i nuous) at Tc=100oC4224A
I
D
(•)Drain Curre nt (pulse d)240140A
Total Dissipation at Tc=25oC15045W
tot
Derat ing F ac tor10.3W/
Ins ulat ion W i th s t and Voltage (DC)2 000V
ISO
Sto rage Temperat ure-65 to 175
stg
T
Max. Operat ing Junction Tempera t ure175
j
(BR)DSS,Tj≤TJMAX
o
C
o
C
o
C
1/9
Page 2
STP60NE06L-16/FP
THERMAL DATA
TO-220TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax V alueUnit
I
AR
E
Ther mal Resistanc e Junct ion-caseMax0.942.7
Ther mal Resistanc e Junct ion-ambientMax
Ther mal Resistanc e Case-sinkTy p
Maximum L ead Temperature F or Solder ing P urp os e
l
Avalanche Current, R epetitive or Not-Repetitive
(pulse width limited by T
Single Pul se Avalanche Ener gy
AS
(starting T
=25oC, ID=IAR,VDD=25V)
j
max)
j
62.5
0.5
300
60A
400mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=060V
Break dow n Vo lt age
I
DSS
I
GSS
Zero Gate Voltage
Drain Curre nt (V
GS
Gat e- bod y Leakag e
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingTc= 125oC
V
DS
V
=± 15 V
GS
1
10
100nA
±
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Volt age VDS=VGSID= 250µA11.62.5V
Sta t ic Drain-s our c e On
Resistance
VGS=5VID=30A
=10V ID=30A
V
GS
On State Drain Current VDS>I
D(on)xRDS(on )max
0.014
0.012
60A
0.016
0.014ΩΩ
VGS=10V
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci t ance
iss
Out put Capac itance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=30 A30S
VDS=25V f=1MHz VGS= 04150
590
150
µA
µA
pF
pF
pF
2/9
Page 3
STP60NE06L-16/FP
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
Tur n-on Delay Time
Rise Time
r
VDD=30VID=30A
R
=4.7
G
Ω
VGS=5V
50
155
(Resis t iv e Load, see fig. 3)
Q
Q
Q
Tot al Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
VDD=40V ID=60A VGS=5V55
15
30
70nC
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(off)
Tur n-of f Dela y Tim e
t
Fall T ime
f
VDD=30VID=30A
R
G
=4.7
Ω
VGS=5V
125
25
(Resis t iv e Load, see fig. 3)
t
r(Voff)
t
t
Off-volt age Rise Time
Fall T ime
f
Cross-over Tim e
c
VDD=48VID=20A
R
=4.7
G
Ω
VGS=5V
(Indu ct iv e Load, see fig . 5)
45
220
280
SOURCEDRAINDIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed:Pulse duration = 300µs, duty cycle 1.5%
(•) Pulse width limited by safeoperating area
Source-drain Current
(•)
Source-drain Current
60
240
(pulsed)
(∗)ForwardOnVoltage ISD=60A VGS=01.5V
Reverse Recovery
rr
Time
Reverse Recovery
rr
ISD= 60 Adi/dt = 100 A/µs
=30VTJ=150oC
V
DD
(see test circuit, fig. 5)
85
300
Charge
Reverse Recovery
7
Current
ns
ns
nC
nC
ns
ns
ns
ns
ns
A
A
ns
µ
A
C
SafeOperating Area for TO-220SafeOperating Area for TO-220FP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility forthe consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in thispublication are
subject to change withoutnotice. Thispublication supersedes and replaces allinformation previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices orsystems without express written approval ofSTMicroelectronics.
The ST logo is a trademarkof STMicroelectronics
2000 STMicroelectronics – Printedin Italy –All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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