Datasheet STP5NK50ZFP, STP5NK50Z, STD5NK50Z-1, STD5NK50Z Datasheet (SGS Thomson Microelectronics)

Page 1
STB5NK50Z-1 - STP5NK50ZFP
STP5NK50Z - STD5NK50Z - STD5NK50Z-1
N-CHANNEL500V-1.22-4.4ATO-220/FP/DPAK/IPAK/I2PAK
Zener-Protected SuperMESH™Power MOSFET
TYPE V
STP5NK50Z STP5NK50ZFP STD5NK50Z STD5NK50Z-1 STB5BK50Z-1
TYPICAL R
EXTREMELY HIGHdv/dt CAPABILITY
100% AVALANCHE TESTED
GATE CHARGE MINIMIZED
VERY LOW INTRINSICCAPACITANCES
VERY GOOD MANUFACTURING
500 V 500 V 500 V 500 V 500 V
(on) = 1.22
DSS
R
DS(on)
< 1.5 < 1.5 < 1.5 < 1.5 < 1.5
I
D
4.4 A
4.4 A
4.4 A
4.4 A
4.4 A
Pw
70 W 25 W 70 W 70 W 70 W
REPEATIBILITY
DESCRIPTION
The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip­based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special careis tak­en to ensure a very good dv/dt capability for the most dem anding applications. Such series comple­ments S T full range of high voltage MOSFETs in­cluding revolutionary MDmes h™ products.
TO-220 TO-220FP
3
2
1
I2PAK
3
1
DPAK
IPAK
INTERNAL SCHEMATIC DIAGRAM
3
2
1
3
2
1
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
IDEAL FOR OFF-LINE POWER SUPPLIES,
ADAPTORS AND PFC
LIGHTING
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP5NK50Z P5NK50Z TO-220 TUBE STP5NK50ZFP P5NK50ZFP TO-220FP TUBE STD5NK50ZT4 D5NK50Z DPAK TAPE & REEL
STD5NK50Z-1 D5NK50Z IPAK TUBE STB5NK50Z-1 B5NK50Z
I
2
PAK
TUBE
1/14April 2003
Page 2
STP5NK50Z - STP5NK50ZF P - STD5NK50Z - STD 5NK50Z-1 - STB5NK50Z-1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STD5NK50Z
STD5NK50Z-1
I
V
DM
P
V
DGR
V
I I
TOT
DS
GS
D D
STP5NK50Z
STB5NK50Z-1
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ) Gate- source Voltage ± 30 V Drain Current (continuous) at TC= 25°C Drain Current (continuous) at TC= 100°C
()
Drain Current (pulsed) 17.6 17.6 (*) 17.6 A Total Dissipation at TC= 25°C
4.4 4.4 (*) 4.4 A
2.7 2.7 (*) 2.7 A
70 25 70 W
STP5NK50ZFP
500 V 500 V
Derating Factor 0.56 0.2 0.56 W/°C
V
ESD(G-S)
Gate source ESD(HBM-C=100pF, R=1.5KΩ) 3000 V
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
V
ISO
T
j
T
stg
() Pulse width limited by safe operating area
4.4A, di/dt 200A/µs, VDD≤ V
(1) I
SD
(*) Limited only by maximum temperature allowed
Insulation Withstand Voltage (DC) - 2500 - V Operating Junction Temperature
Storage Temperature
(BR)DSS,Tj≤TJMAX.
-55to150
-55to150
°C °C
THERMAL DATA
TO-220
2
PAK
I
Rthj-case Thermal Resistance Junction-case Max 1.78 5 1.78 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose
TO-220FP DPAK
300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
= 25 °C, ID=IAR,VDD=50V)
j
4.4 A
130 mJ
GATE-SOURCE ZENER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain) 30 V
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occas ionally be applied from gate to souce. In this respect the Zener voltage is appropriate to achieve an efficient and cost­effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoi d the usage of external components.
2/14
Page 3
STP5NK50Z - STP5NK 50ZFP - STD5NK50Z - S TD5N K 50Z-1 - STB5NK50Z-1
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHE RWISE SPECIFIED)
ON/OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Zero Gate Voltage Drain Current (V
GS
=0)
Gate-body Leakage Current (V
DS
=0) Gate Threshold Voltage Static Drain-source On
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS=15 V,ID= 2.2 A 3.1 S
g
fs
Input Capacitance Output Capacitance Reverse Transfer Capacitance
(3) Equivalent Output
C
oss eq.
C
iss
C
oss
C
rss
Capacitance
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time
Total Gate Charge Gate-Source Charge Gate-Drain Charge
ID=1 mA, VGS= 0 500 V
V
= Max Rating
DS
VDS= Max Rating, TC= 125 °C V
= ± 20V ±10 µA
GS
V
DS=VGS,ID
= 50µA
3 3.75 4.5 V
1
50
VGS=10V,ID= 2.2 A 1.22 1.5
=25V,f=1MHz,VGS= 0 535
V
DS
75 17
VGS=0V,VDS= 0V to 400V 45 pF
VDD=250V,ID= 2.2 A RG= 4.7VGS=10V
15 10
(Resistive Load see, Figure 3)
=400V,ID= 4.4 A,
V
DD
V
=10V
GS
20
4
28 nC
10
µA µA
pF pF pF
ns ns
nC nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off Delay Time
t
f
Fall Time
VDD= 250 V, ID= 2.2A R
=4.7ΩVGS=10V
G
32 15
(Resistive Load see, Figure 3)
t
r(Voff)
t
= 400V, ID= 4.4A,
t
f
c
Fall Time Cross-over Time
Off-voltage Rise Time
V
DD
RG=4.7Ω, VGS= 10V (Inductive Load see, Figure 5)
12 12 20
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3. C
Source-drain Current
(2)
Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
.
V
DSS
ISD= 4.4 A, VGS=0 I
SD
VDD=30V,Tj= 150°C (see test circuit, Figure 5)
=4.4 A, di/dt = 100A/µs
310
1425
9.2
when VDSincreases from 0 to 80%
oss
4.4
17.6
1.6 V
ns ns
ns ns ns
A A
ns
nC
A
3/14
Page 4
STP5NK50Z - STP5NK50ZF P - STD5NK50Z - STD 5NK50Z-1 - STB5NK50Z-1
Safe Operating Area For TO-220/DPAK/IPAK/I2PAK
Thermal Impedance For TO-220/DPAK/IPAK/I2PAK
Safe Operating Area For TO-220FP
Thermal Impedance For TO-220FP
Output Characteristics
4/14
Transfer Characteristics
Page 5
STP5NK50Z - STP5NK 50ZFP - STD5NK50Z - S TD5N K 50Z-1 - STB5NK50Z-1
Transconductance
Gate Charge vs Gate-so urc e V oltage Capacitance Variations
Static Drain-source On Resistance
Normalized Gate Threshold Voltage vs Temp. Normalized On Resistance vs Temperature
5/14
Page 6
STP5NK50Z - STP5NK50ZF P - STD5NK50Z - STD 5NK50Z-1 - STB5NK50Z-1
Source-drain Diode Forward Characteristics Normalized BVDSS vs Temperatu re
Maximum Avalanche Energy vs Temperature
6/14
Page 7
STP5NK50Z - STP5NK 50ZFP - STD5NK50Z - S TD5N K 50Z-1 - STB5NK50Z-1
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Induct ive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
7/14
Page 8
STP5NK50Z - STP5NK50ZF P - STD5NK50Z - STD 5NK50Z-1 - STB5NK50Z-1
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154
L20 16.40 0.645 L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
8/14
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STP5NK50Z - STP5NK 50ZFP - STD5NK50Z - S TD5N K 50Z-1 - STB5NK50Z-1
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.5 0.045 0.067 F2 1.15 1.5 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L5
L4
9/14
Page 10
STP5NK50Z - STP5NK50ZF P - STD5NK50Z - STD 5NK50Z-1 - STB5NK50Z-1
P032P_B
TO-252 (DPAK) MECHANICAL DATA
DIM.
A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213
C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0
MIN. TYP. MAX. MIN. TYP. MAX.
o
mm inch
o
8
o
0
o
0
10/14
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STP5NK50Z - STP5NK 50ZFP - STD5NK50Z - S TD5N K 50Z-1 - STB5NK50Z-1
0068771-E
TO-251 (IPAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
H
C
A
C2
E
= =
L2
B2
= =
D
B3
2
1 3
L1
A1
L
B6
A3
B
B5
G
= =
11/14
Page 12
STP5NK50Z - STP5NK50ZF P - STD5NK50Z - STD 5NK50Z-1 - STB5NK50Z-1
P011P5/E
TO-262 (I2PAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
e 2.4 2.7 0.094 0.106
E 10 10.4 0.393 0.409
L 13.1 13.6 0.515 0.531 L1 3.48 3.78 0.137 0.149 L2 1.27 1.4 0.050 0.055
mm inch
C
A
A1
12/14
C2
B2
B
e
E
L1
L2
D
L
Page 13
STP5NK50Z - STP5NK 50ZFP - STD5NK50Z - S TD5N K 50Z-1 - STB5NK50Z-1
DPAK FOOTPRINT
All dimensions are in millimeters
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
All dimensions
areinmillimeters
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0. 291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
* on sales type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
2500 2500
13/14
Page 14
STP5NK50Z - STP5NK50ZF P - STD5NK50Z - STD 5NK50Z-1 - STB5NK50Z-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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