Page 1
STP5NB80
N - CHANNEL 800V - 1.8Ω - 5A - TO-220/TO-220FP
TYPE V
STP5NB80
STP5NB80 FP
■ TYPICALR
■ EXTREMELYHIGH dv/dt CAPABILITY
■ 100%AVALANCHETESTED
■ VERYLOW INTRINSIC CAPACITANCES
■ GATECHARGE MINIMIZED
DS(on)
DSS
800 V
800 V
= 1.8
DESCRIPTION
Using the latest high voltageMESH OVERLAY
process, STMicroelectronics has designed an
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest RDS(on) per area, exceptional avalanche
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
Ω
R
DS(on)
<2.2Ω
<2.2
Ω
I
D
5A
5A
STP5NB80FP
PowerMESH MOSFET
3
2
1
TO-220 TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
APPLICATIONS
■ HIGHCURRENT, HIGHSPEED SWITCHING
■ SWITCHMODE POWER SUPPLIES(SMPS)
■ DC-AC CONVERTERS FOR WELDING
EQUIPMENTAND UNINTERRUPTIBLE
POWERSUPPLIESAND MOTORDRIVE
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
ST P5 NB80 STP 5NB 80FP
V
V
V
I
DM
P
dv/ dt(
V
T
(*) Limited only by maximum temperature allowed (1 )ISD≤ 5A, di/dt ≤ 200 A/µ s,VDD≤ V
January 1999
Drain-source Voltage ( VGS=0) 800 V
DS
Dra in- gat e Volt a ge (RGS=20kΩ)
DGR
Gate -source V oltage ± 30 V
GS
Dra in Curr en t (c ontinuous) a t Tc=25oC5 5 ( * ) A
I
D
Dra in Curr en t (c ontinuous) a t Tc= 100oC 3.2 3.2( * ) A
I
D
800 V
(• ) Dra in Curr en t (p uls ed) 20 20 A
Tot al Dis s ipation at Tc=25oC 110 40 W
tot
Der at ing Fact or 0.88 0.32 W/
) Peak Diode Recov ery voltag e s lop e 4 4 V/ ns
1
Insulation Withstand Voltage (DC) 2000 V
ISO
St orage Te mpe ra t ure -65 to 150
stg
Max. O perati ng Junction T em p e ra t ure 150
T
j
(BR)DSS
,Tj≤ T
JMAX
o
C
o
C
o
C
1/9
Page 2
STP5NB80/FP
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Ther mal Resis t an ce Junc ti on-cas e Max 1.13 3. 1
Ther mal Resis t an ce Junc ti on-ambien t M a x
Thermal Resistance Case-sink Typ
Maximum Le ad Tem peratu r e F or Sold er ing Purp ose
l
TO-220 TO220-FP
62.5
0.5
300
o
C/W
o
C/W
o
C/W
o
C
Symbol P ara meter Mi n .
I
AR
E
ELECTRICAL CHARACTERISTICS
Avalanche Curr ent, Repetitive or Not- Re petitiv e
(pulse width l imited by T
Single Pu lse Avalanche Energ y
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max)
j
(T
case
=25oC unless otherwisespecified)
Value
Max.
Value
5A
300 mJ
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-sourc e
=250µAVGS=0
I
D
800 V
Break d own Vo lt age
I
DSS
I
GSS
Zero Gate Voltage
Drain Cu rr ent (V
GS
Gat e- b ody Leakage
Current (V
DS
=0)
=0)
=MaxRating
V
DS
V
= Max Rating Tc=125oC
DS
= ± 30 V
V
GS
1
50
± 100 nA
ON(∗)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold
V
DS=VGSID
Voltage
Static Drain-source O n
VGS=10V ID= 2.5 A 1.8 2.2 Ω
Resistanc e
On St ate Drain Current VDS>I
VGS=10V
= 250 µ A
D(on)xRDS(on)max
345V
5A
Unit
µ A
A
µ
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(∗)F o r w a r d
fs
C
iss
C
oss
C
rss
2/9
Tr ansconduc tance
Input Cap aci t ance
Out put Capacit ance
Reverse T ransf er
Capacitance
VDS>I
D(on)xRDS(on)maxID
=2.5A 1.5 4 S
VDS=25V f=1MHz VGS= 0 1050
135
15
pF
pF
pF
Page 3
STP5NB80/FP
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Turn-on delay Time
t
Rise T im e
r
VDD= 400 V ID=3A
=4.7 Ω V GS=10V
R
G
18
9
(see t est circuit, fi gure 3)
Q
Q
Q
Total Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
VDD= 480 V ID=5.6A VGS=10V 30
9
14
42 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
t
Off -voltage R ise Time
Fall Time
f
Cross-ov er Ti me
c
VDD= 640 V ID=5.6A
=4.7 Ω V GS=10V
R
G
(see t est circuit, fi gure 5)
14
14
21
SOURCEDRAINDIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300 µ s, duty cycle 1.5 %
(• ) Pulse width limited by safe operatingarea
Source-drain Current
(•)
Source-drain Current
5
20
(pulsed)
(∗) F orwar d O n V oltage I SD=5A VGS=0 1.6 V
Reverse R ecover y
rr
Time
Reverse R ecover y
rr
=5.6A di/dt=100A/µs
I
SD
= 100 V Tj=150oC
V
DD
(see t est circuit, fi gure 5)
700
5
Charge
Reverse R ecover y
14
Current
ns
ns
nC
nC
ns
ns
ns
A
A
ns
µ
A
C
SafeOperating Area for TO-220 SafeOperating Area for TO-220FP
3/9
Page 4
STP5NB80/FP
ThermalImpedancefor TO-220
OutputCharacteristics
ThermalImpedance for TO-220FP
TransferCharacteristics
Transconductance
4/9
Static Drain-sourceOn Resistance
Page 5
STP5NB80/FP
Gate Charge vs Gate-sourceVoltage
Normalized Gate ThresholdVoltage vs
Temperature
CapacitanceVariations
Normalized On Resistance vsTemperature
Source-drainDiode Forward Characteristics
5/9
Page 6
STP5NB80/FP
Fig. 1: Unclamped InductiveLoad Test Circuit
Fig. 3: Switching Times Test CircuitsFor
ResistiveLoad
Fig. 2: Unclamped InductiveWaveform
Fig. 4: Gate Chargetest Circuit
Fig. 5: Test Circuit For InductiveLoad Switching
And Diode Recovery Times
6/9
Page 7
TO-220 MECHANICAL DATA
STP5NB80/FP
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
mm inch
E
A
L4
D
F2
F1
G1
H2
G
F
P011C
C
D1
L2
Dia.
L5
L7
L6
L9
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Page 8
STP5NB80/FP
TO-220FP MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 0.385 0.417
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
mm inch
E
A
D
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L4
8/9
Page 9
STP5NB80/FP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems withoutexpress written approval of STMicroelectronics.
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1998 STMicroelectronics – Printed in Italy – All Rights Reserved
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