This Power Mosfet is the latest development of
STMicroelectronics unique "Single Feature
Size" strip-based process. The resulting transistor shows extremely high packing density for low
on-resistance, rugged avalance characteristics
and less critical alignment steps therefore a remarkable manufacturing reproducibility.
APPLICATIONS
■
HIGH CURRENT, HIGH SPEED SWITCH ING
■
SOLENOID AND RELAY DRIVERS
■
MOTOR CONTROL, AUDIO AMPLIFIERS
■
DC-DC & DC-AC CONVERTERS
R
DS(on)
< 0.028 Ω
< 0.028 Ω
Ω
I
D
45 A
25 A
STP45NE06LFP
STripFET POWER MOSFET
PRELIMINARY DATA
3
2
1
TO-220 TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STP45NE06L STP45NE06LFP
V
V
V
I
DM
P
V
dv/dtPeak Diode Recovery voltage slope7V/ns
T
(•) Pulse width limited by safe operating area (1) ISD ≤ 45 A, di/dt ≤ 300 A/µs, VDD ≤ V
June 1999
Drain-source Voltage (VGS = 0)60V
DS
Drain- gate Voltage (RGS = 20 kΩ)
DGR
Gate-source Voltage± 20V
GS
Drain Current (continuous) at Tc = 25 oC4525A
I
D
I
Drain Current (continuous) at Tc = 100 oC3117.5A
D
60V
(•)Drain Current (pulsed)180180A
Total Dissipation at Tc = 25 oC10035W
tot
Derating Factor0.670.23W/
Insulation Withstand Voltage (DC)2000V
ISO
Storage Temperature-65 to 175
stg
Max. Operating Junction Temperature175
T
j
, Tj ≤ T
(BR)DSS
JMAX
o
C
o
C
o
C
1/6
Page 2
STP45NE06L/FP
THERMAL DATA
TO-220TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERIST ICS
SymbolParameterMax ValueUnit
I
AR
E
Thermal Resistance Junction-case Max1.54.28
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
= 25 oC, ID = IAR, V
j
max)
j
DD
= 25V)
62.5
0.5
300
45A
150mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
= 25 oC unless otherwise specified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
I
= 250 µA V
D
GS
= 0
60V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating Tc = 125 oC
DS
V
= ± 20 V
GS
1
10
± 100nA
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage
Static Drain-source On
Resistance
V
= VGS ID = 250 µA
DS
VGS = 5 V ID = 22.5 A
V
= 10 V ID = 22.5 A
GS
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
11.72.5V
0.024
0.022
45A
0.03
0.028ΩΩ
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID =22.5 A1530S
90
3600
480
100
= 02370
GS
350
µA
µA
pF
pF
pF
2/6
Page 3
STP45NE06L/FP
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
Q
Q
Q
Turn-on Time
t
Rise Time
r
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
V
= 30 V ID = 22.5 A
DD
=4.7
R
V
Ω
G
= 48 V ID = 45 A V
DD
VGS = 5 V
= 5 V31
GS
37
100
13
13
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
r(Voff)
t
t
Off-voltage Rise Time
Fall Time
f
Cross-over Time
c
V
= 48 V ID = 45 A
DD
=4.7 Ω VGS = 10 V
R
G
20
45
72
SOURCE DRAIN DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Information f urnished i s believed t o be accurate an d reliabl e. How ever, STMicroelect ronics assu mes no responsib ility fo r the consequen ces
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granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to chan ge w ithout notice. This publicatio n su persedes a nd r eplaces al l inf ormati on previ ously suppl ied. STMicroelect ron ics produ cts
are not auth ori zed f or use as critical component s in life support devices or systems without exp r ess writt e n ap proval o f STM i cr oel ectronics.