This Power Mosfet is the latest development of
SGS-THOMSON unique "Single Feature Size"
strip-based process. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalance characteristics and
less critical alignment steps therefore a remarkable manufacturing reproducibility.
R
DS(on)
< 0.028 Ω
< 0.028 Ω
o
C
I
D
45 A
25 A
STP45NE06FP
STripFET POWER MOSFET
PRELIMINARY DATA
3
2
1
TO-220 TO-220FP
INTER NAL SCH E M ATI C DIAG RA M
3
2
1
APPLICATIONS
■ HIGH CURRENT, HIGH SPE ED SWI TCHING
■ SOLENOID AND RELAY DRIVER S
■ MOTOR CONT RO L, AUDIO AM PLIFI ER S
■ DC-DC & DC-AC CONVERT E RS
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STP45NE06STP45NE06FP
V
V
V
IDM(•)Drain Current (pulsed)180180A
P
V
dv/dtPeak Diode Recovery voltage slope7V/ns
T
(•) Pulse width limited by safe operating area (1) ISD ≤ 20 A, di/dt ≤ 300 A/µs, VDD ≤ V
June 1998
Drain-source Voltage (VGS = 0)60V
DS
Drain- gate Voltage (RGS = 20 kΩ)
DGR
Gate-source Voltage± 20V
GS
I
Drain Current (continuous) at Tc = 25 oC4525A
D
I
Drain Current (continuous) at Tc = 100 oC3117.5A
D
Total Dissipation at Tc = 25 oC10035W
tot
60V
Derating Factor0.670.23W/
Insulation Withstand Voltage (DC)2 000V
ISO
Storage Temperature-65 to 175
stg
T
Max. Operating Junction Temperature175
j
, Tj ≤ T
(BR)DSS
JMAX
o
C
o
C
o
C
1/6
Page 2
STP45NE06/FP
THERMAL DATA
TO-220TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERI S TICS
SymbolParameterMax ValueUnit
I
AR
E
Thermal Resistance Junction-case Max1.54.28
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
= 25 oC, ID = IAR, V
j
ma x)
j
DD
= 25V)
62.5
0.5
300
45A
150mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
= 25 oC unless otherwise specified)
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
I
= 250 µA V
D
GS
= 0
60V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating Tc = 125 oC
DS
V
= ± 20 V
GS
1
10
± 100nA
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
Gate Threshold
V
= VGS ID = 250 µA
DS
234V
Voltage
R
DS(on)
Static Drain-source On
VGS = 10V ID = 22.5A0.0220.028Ω
Resistance
I
D(on)
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
45A
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
gfs (∗)Forward
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID =22.5 A1530S
70
3600
480
100
= 02700
GS
350
µA
µA
pF
pF
pF
2/6
Page 3
STP45NE06/FP
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING O N
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
Q
Q
Q
SWITCHING O F F
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
r(Voff)
t
SOURCE DRAIN DIO DE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information n or for any infrin gement of patents or othe r rights of third parties which may result from its use. No licens e i s
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.