This Power MOSFETis the latestdevelopment of
SGS-THOMSON unique ”Single Feature Size”
strip-based process. The resulting transistor
shows extremely high packingdensity for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a remarkable manufacturingreproducibility.
APPLICATIONS
■ HIGH CURRENT, HIGHSPEEDSWITCHING
■ SOLENOIDANDRELAY DRIVERS
■ MOTORCONTROL, AUDIOAMPLIFIERS
■ DC-DC& DC-AC CONVERTERSIN HIGH
PERFORMANCEVRMs
■ AUTOMOTIVE ENVIRONMENT(INJECTION,
ABS, AIR-BAG, LAMPDRIVERS,Etc.)
3
2
1
TO-220
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
V
V
I
DM
P
dv/ dt(
T
(•) Pulse width limited by safe operating area(1)ISD≤ 40 A,di/dt ≤ 300 A/µs, VDD≤ V
October 1997
Drain-sourc e Vol t age (VGS=0)30V
DS
Drain- gate Vo lt age (RGS=20kΩ)
DGR
Gate- source Voltage± 15V
GS
I
Drain Cur rent (con tinuous ) at Tc=25oC40A
D
I
Drain Cur rent (con tinuous ) at Tc=100oC28A
D
30V
(•)Drain Current (pulsed)160A
Total Dissipation at Tc=25oC80W
tot
Derating Fac tor0.53W/
1) Pe ak Diode Recov ery voltag e slope7V/ns
St orage Te m peratu re-65 to 175
stg
T
Max. Operat ing Junction Temperat ure175
j
(BR)DSS,Tj≤TJMAX
o
C
o
C
o
C
1/8
Page 2
STP40NE03L-20
THERMAL DATA
R
thj-case
R
thj- amb
R
thc-sin k
T
AVALANCHE CHARACTERISTICS
SymbolPara met e rMax Valu eUni t
I
AR
E
Ther mal Resist ance Junctio n- ca s eMax
Ther mal Resist ance Junctio n- ambientMax
Ther mal Resist ance Case-si nkTy p
Maximum Lead T emperat ure For Soldering Purpos e
l
Avalanche Curr e nt , R epetitive o r Not -Re petitiv e
(pulse width limited b y T
Single Pulse Avalanche Energy
AS
(starting T
=25oC, ID=IAR,VDD=15V)
j
max, δ <1%)
j
1.88
62.5
0.5
300
40A
200mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unlessotherwise specified)
case
OFF
SymbolParameterTest Cond itionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-sourc e
=250µAVGS=0
I
D
30V
Breakdown Voltage
I
I
DSS
GSS
Zer o G at e Volt age
Drain Cur rent (V
GS
Gat e-body Le ak a ge
Current (V
DS
=0)
=0)
=MaxRating
V
DS
V
=MaxRatingTc=125
DS
o
C
= ± 15 V
V
GS
1
10
± 100nA
ON (∗)
SymbolParameterTest Cond itionsMin.Typ.Max.Unit
V
GS(th )
Gate Threshold
V
DS=VGSID
=250µA
11.82.5V
Voltage
R
DS(on)
I
D(on)
Stati c D rain-source On
Resistance
VGS=10V ID=20A
=5VID=20A
V
GS
On St at e Dra in Cur rent VDS>I
D(on)xRDS(on)max
0.0140. 0 2
0.023ΩΩ
40A
VGS=10V
DYNAMIC
SymbolParameterTest Cond itionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Tr ansconduc tanc e
C
C
C
Input Capacit ance
iss
Out put C apacit ance
oss
Reverse T ransf er
rss
Capa cit an c e
VDS>I
D(on)xRDS(on)maxID
=20A1520S
VDS=25V f=1MHz VGS= 01850
450
160
2400
590
210
µA
µA
pF
pF
pF
2/8
Page 3
STP40NE03L-20
ELECTRICAL CHARACTERISTICS (continued)
SWITCHINGON
SymbolParameterTest Cond itionsMin.Typ.Max.Unit
t
d(on)
Q
Q
Q
Turn-on Tim e
Rise T ime
t
r
Total Gate Charge
g
Gat e-Sou rc e Charge
gs
Gate-Drain Charge
gd
VDD=15VID=20A
=4.7 ΩVGS=5V
R
G
VDD=24V ID=40A VGS=5V29
SWITCHINGOFF
SymbolParameterTest Cond itionsMin.Typ.Max.Unit
t
r(Voff)
t
Of f - voltag e Ris e Tim e
t
Fall Time
f
Cross-ov er Tim e
c
VDD=24VID=40A
=4.7 ΩVGS=5V
R
G
SOURCE DRAIN DIODE
SymbolParameterTest Cond itionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration =300 µs, duty cycle1.5 %
(•) Pulse width limited by safe operating area
Informationfurnished is believed to be accurate and reliable.However, SGS-THOMSON Microelectronics assumes no responsability for the
consequencesof use of such informationnor for any infringementof patents or otherrights of thirdparties which may results fromits use.No
license isgranted byimplication orotherwise under anypatentor patentrights ofSGS-THOMSONMicroelectronics. Specifications mentioned
in this publicationare subject tochange without notice. This publicationsupersedes and replaces all informationpreviously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorizedforuse ascriticalcomponents inlifesupportdevices orsystems withoutexpress
written approvalof SGS-THOMSONMicroelectonics.
1997 SGS-THOMSON Microelectronics -Printed in Italy- All RightsReserved
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