Datasheet STP3NC60FP, STP3NC60 Datasheet (SGS Thomson Microelectronics)

Page 1
STP3NC60
STP3NC60FP
N-CHANNEL 600V - 3.3Ω - 3A TO-220/TO-220FP
PowerMeshII MOSFET
TYPE V
DSS
R
DS(on)
I
D
STP3NC60 600 V <3.6 3A STP3NC60FP 600V <3.6 2A
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
(on) = 3.3
DESCRIPTION
The PowerMESHII is the evolution of the first generation of MESH OVERLAY. The layout re­finements introduced greatly improve the Ron*area figure of merit while keeping the device at the lead­ing edge for what concerns swithing speed, gate charge and ruggedness.
APPLICATIONS
HIGH CURRENT, HIGHSPEED SWITCHING
SWITH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FORWELDING
EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES ANDMOTOR DRIVER
3
2
1
TO-220
TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP3NC60 STP3NC60FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt (1) Peak Diode Recovery voltage slope 3.5 V/ns
V
ISO
T
stg
T
()Pulse width limitedby safe operating area
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)
600 V
600 V Gate- source Voltage ±30 V Drain Current (continuos) at TC=25°C Drain Current (continuos) at TC= 100°C
()
Drain Current (pulsed) 12 12(*) A TotalDissipation at TC=25°C
33A
1.9 1.9(*) A
80 40 W
Derating Factor 0.64 0.32 W/°C
Insulation Withstand Voltage (DC) - 2000 Storage Temperature –60 to 150 °C Max. Operating Junction Temperature 150 °C
j
(1)ISD≤3A, di/dt ≤100A/µs, VDD≤ V (*)Limited only by maximum temperature allowed
(BR)DSS,Tj≤TJMAX.
1/9May 2000
Page 2
STP3NC60/FP
THERMAL DATA
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 1.56 3.12 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
Rthc-sink Thermal Resistance Case-sink Typ 0.5 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current (V
Gate-body Leakage Current (V
=25°C, ID=IAR,VDD=50V)
j
I
= 250 µA, VGS=0
D
= Max Rating
V
DS
=0)
DS
GS
=0)
V
= Max Rating, TC= 125 °C
DS
= ±30V
V
GS
600 V
3A
100 mJ
1 µA
50 µA
±100 nA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage Static Drain-source On
Resistance
On StateDrain Current
V
DS=VGS,ID
= 10V, ID= 1.5 A
V
GS
V
DS>ID(on)xRDS(on)max,
= 250µA
VGS=10V
234V
3.3 3.6
3A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
g
(1)
fs
C
iss
C
oss
C
rss
Forward Transconductance Input Capacitance
Output Capacitance 57 pF Reverse Transfer
Capacitance
DS>ID(on)xRDS(on)max,
ID= 1.5A
V
= 25V, f = 1 MHz, VGS=0
DS
2S
400 pF
7pF
2/9
Page 3
STP3NC60/FP
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Q
Q
gs
Q
gd
Turn-on Delay Time Rise Time
TotalGate Charge
g
Gate-Source Charge 2.3 nC Gate-Drain Charge 4.4 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
t
f
c
Off-voltage Rise Time Fall Time 15 ns Cross-over Time 21 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 3 A
(2)
Source-drain Current (pulsed) 12 A
(1)
Forward On Voltage Reverse Recovery Time Reverse Recovery Charge 1.5 µC Reverse Recovery Current 7.1 A
V
= 300 V,ID= 1.5 A
DD
= 4.7VGS=10V
R
G
(see test circuit, Figure 3)
V
= 480V,ID=3A,
DD
= 10V
V
GS
V
= 480V,ID=3A,
DD
=4.7Ω, VGS= 10V
R
G
(see test circuit, Figure 5)
ISD= 3 A, VGS=0 I
=3 A, di/dt = 100A/µs, V
SD
= 100V, Tj= 150°C (see test circuit, Figure 5)
DD
9ns 13 ns 13 18.2 nC
13 ns
1.6 V
420 ns
Safe Operating Area for TO-220 Safe Operating Area for TO-220FP
3/9
Page 4
STP3NC60/FP
Thermal Impedence for TO-220
Output Characteristics
Thermal Impedence for TO-220FP
Transfer Characteristics
Transconductance
4/9
Static Drain-source On Resistance
Page 5
STP3NC60/FP
Gate Charge vs Gate-source Voltage
Normalized Gate Threshold Voltage vs Temp.
Capacitance Variations
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
5/9
Page 6
STP3NC60/FP
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/9
Page 7
TO-220 MECHANICAL DATA
STP3NC60/FP
DIM.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
MIN. TYP. MAX. MIN. TYP. MAX.
A
C
mm inch
E
D
L5
L7
Dia.
D1
L6
L2
L9
L4
F2
F1
G1
H2
G
F
P011C
7/9
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STP3NC60/FP
TO-220FP MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
A
mm inch
E
D
8/9
B
L3
L6
L7
¯
H
L2
F1
F
G1
G
F2
123
L4
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STP3NC60/FP
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