The PowerMESHII is the evolution of the first
generation of MESH OVERLAY. The layout refinements introduced greatly improve the Ron*area
figure of merit while keeping the device at the leading edge for what concerns swithing speed, gate
charge and ruggedness.
APPLICATIONS
■ HIGH CURRENT, HIGHSPEED SWITCHING
■ SWITH MODE POWER SUPPLIES (SMPS)
■ DC-AC CONVERTERS FORWELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES ANDMOTOR DRIVER
3
2
1
TO-220
TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STP3NC60STP3NC60FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt (1)Peak Diode Recovery voltage slope3.5V/ns
V
ISO
T
stg
T
(•)Pulse width limitedby safe operating area
Drain-source Voltage (VGS=0)
Drain-gate Voltage (RGS=20kΩ)
600V
600V
Gate- source Voltage±30V
Drain Current (continuos) at TC=25°C
Drain Current (continuos) at TC= 100°C
(●)
Drain Current (pulsed)1212(*)A
TotalDissipation at TC=25°C
33A
1.91.9(*)A
8040W
Derating Factor0.640.32W/°C
Insulation Withstand Voltage (DC)-2000
Storage Temperature–60 to 150°C
Max. Operating Junction Temperature150°C
j
(1)ISD≤3A, di/dt ≤100A/µs, VDD≤ V
(*)Limited only by maximum temperature allowed
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