Datasheet STP3NB80FP, STP3NB80 Datasheet (SGS Thomson Microelectronics)

Page 1
STP3NB80
N - CHANNEL 800V - 4.6Ω - 2.6A- TO-220/TO-220FP
TYPE V
STP3NB80 STP3NB80 FP
TYPICALR
EXTREMELYHIGH dv/dt CAPABILITY
100%AVALANCHETESTED
VERYLOW INTRINSIC CAPACITANCES
GATECHARGE MINIMIZED
DS(on)
DSS
800 V 800 V
DESCRIPTION
Using the latest high voltage MESH OVERLAY process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company’s proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.
R
DS(on)
<6.5 <6.5
I
D
2.6 A
2.6 A
STP3NB80FP
PowerMESH MOSFET
3
2
1
TO-220 TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
APPLICATIONS
HIGHCURRENT, HIGHSPEED SWITCHING
UNINTERRUPTIBLEPOWERSUPPLY(UPS)
DC-DC& DC-AC CONVERTERS FOR
TELECOM,INDUSTRIAL AND CONSUMER ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
ST P3 NB80 STP 3NB 80FP
V
V
V
I
DM
P
dv/ dt(
V
T
() Pulsewidth limited by safe operating area (1)ISD≤ 2.6A, di/dt ≤ 200A/µs,VDD≤ V
••) Limited only by maximum temperature allowed
(
January 1999
Drain-source Voltage (VGS=0) 800 V
DS
Dra in- gate Volt age (RGS=20kΩ)
DGR
Gate -sourc e Volta ge ± 30 V
GS
Drain C urrent (co ntinuous) at Tc=25oC2.62.6(
I
D
Drain C urrent (co ntinuous) at Tc=100oC1.61.6(••) A
I
D
800 V
)A
••
() Dra in Cur rent (pu ls ed) 10.4 10.4 A
Total Dissipation at Tc=25oC9035W
tot
Der at in g Fac to r 0.72 0.28 W/
1) P eak Dio de Recovery volt age slope 4.5 V/ns
Insulat ion W ith stand Vo ltage (DC) 2000 V
ISO
St orage T e mperat ur e -65 t o 150
stg
Max. Op erating Junctio n T e m pe rat ure 150
T
j
,Tj≤T
(BR)DSS
JMA
o
C
o
C
o
C
1/9
Page 2
STP3NB80/FP
THERMAL DATA
TO-220 TO220-FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Para meter Max Val ue Uni t
I
AR
E
Ther mal Resis t an ce Junc ti on-cas e Max 1.39 3.57 Ther mal Resis t an ce Junc ti on-ambien t Max
Thermal Resistance Case-sink Typ Maximum Lead Tem peratu re For Soldering Purp ose
l
Avalanche Cur rent, Repetit iv e or Not - Re petitiv e (pulse width limited by T
Single Pulse Avalanche En ergy
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max)
j
62.5
0.5
300
2.6 A
176 mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
V
(BR)DSS
Drain-sourc e
=250µAVGS=0
I
D
800 V
Break d own V o lt age
I
DSS
I
GSS
Zero Gate Voltage Drain Cu rr ent (V
GS
Gat e- b ody Le akage Current (V
DS
=0)
=0)
V
=MaxRating
DS
= Max Rating Tc=125oC
V
DS
=± 30 V
V
GS
1
50
± 100 nA
ON()
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
V
GS(th)
Gate Threshold
V
DS=VGSID
= 250µA
345V
Voltage
R
DS(on)
Static Drain-source O n
VGS=10V ID= 1 .3 A 4.6 6.5
Resistanc e
I
D(on)
On S t ate Drain Cur rent VDS>I
D(on)xRDS(on)max
2.6 A
VGS=10V
DYNAMIC
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
g
(∗)Forward
fs
Tr ansconduc tance
C
C
C
Input Cap ac i t an c e
iss
Out put Capacita nce
oss
Reverse Transfer
rss
Capacitance
VDS>I
D(on)xRDS(on)maxID
=1.3A 1 2 S
VDS=25V f=1MHz VGS=0 440
60
7
575
78
9
µ µA
pF pF pF
A
2/9
Page 3
STP3NB80/FP
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
t
d(on)
Q Q Q
Turn-on Time
t
Rise Time
r
Total Gate Charge
g
Gat e- Source Cha rge
gs
Gate-Drain Charge
gd
VDD= 400 V ID=1.3A
=4.7 VGS=10V
R
G
VDD=640 V ID=3A VGS=10V 17
12 10
6.5
7.5
17 14
24 nC
SWITCHINGOFF
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
t
r(Voff)
t
t
Off -voltage Rise Time Fall Time
f
Cross-ov er Time
c
VDD= 640 V ID=3 A
=4.7 Ω VGS=10V
R
G
15 17 22
21 24 31
SOURCEDRAINDIODE
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % () Pulse width limited by safe operatingarea
Source-drain Curr ent
(•)
Source-drain Curr ent
2.6
10.4
(pulsed)
(∗) For ward O n V oltage ISD=2.6A VGS=0 1.6 V
Reverse Recov er y
rr
Time Reverse Recov er y
rr
=2.6A di/dt=100A/µs
I
SD
V
= 100 V Tj=150oC
DD
650
2.8 Charge Reverse Recov er y
8.5 Current
ns ns
nC nC
ns ns ns
A A
ns
µC
A
SafeOperating Area for TO-220 SafeOperating Area for TO-220FP
3/9
Page 4
STP3NB80/FP
ThermalImpedancefor TO-220
OutputCharacteristics
ThermalImpedanceforTO-220FP
TransferCharacteristics
Transconductance
4/9
Static Drain-sourceOn Resistance
Page 5
STP3NB80/FP
Gate Charge vs Gate-sourceVoltage
Normalized Gate ThresholdVoltage vs Temperature
CapacitanceVariations
Normalized On Resistance vsTemperature
Source-drainDiode Forward Characteristics
5/9
Page 6
STP3NB80/FP
Fig. 1:
UnclampedInductive Load Test Circuit
Fig. 3: SwitchingTimes Test Circuits For ResistiveLoad
Fig. 2:
UnclampedInductive Waveform
Fig. 4: Gate Charge test Circuit
Fig. 5:
Test CircuitFor InductiveLoad Switching
And Diode Recovery Times
6/9
Page 7
TO-220 MECHANICAL DATA
STP3NB80/FP
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409
L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
mm inch
E
A
L4
D
F2
F1
G1
H2
G
F
P011C
C
D1
L2
Dia.
L5
L7
L6
L9
7/9
Page 8
STP3NB80/FP
TO-220FP MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
mm inch
E
A
D
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L4
8/9
Page 9
STP3NB80/FP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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1998 STMicroelectronics – Printed in Italy – All Rights Reserved
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